近年來，液晶平面顯示器已被大眾廣泛的接受而且其應用面也在持續的成長中。在液晶平面顯示器中，面板之驅動積體元件佔了成本的很大一部份。然而，在液晶平面顯示器之源極驅動積體元件在傳統的故障分析上有許多缺點和障礙，本研究之成果提供一個全新的解決方案，就是利用電子束測試機(E-Beam Prober)與超大型積體電路測機(VLSI Tester)進行連結。這個解決方案適用於源極驅動積體元件的兩種不同的封裝型式，包含TCP和QTCP。這個全新的解決方案包含三個主要技術：首先是高成功率(94%)的驅動積體元件開蓋技術，其次是可以在電子束測試機上進行分析的新治具，還有就是一個功能強大且高彈性的測試程式。 整合上述三種技術，此研究成功的完成了利用電子束測試機與超大型積體電路測機連結以進行液晶平面顯示器之源極驅動積體元件的故障分析。除了在電子束測試機上進行分析之外，上述三種技術也能夠成功的運用在其他的故障分析工具上。此外，本論文還針對運算放大器(OP)介紹一種開路分析技巧，使得運算放大器的故障分析變的更容易。在實際的分析案件中, Hspice 模擬工具也被應用來協助了解運算放大器的內部行為。有了這個全新的解決方案，可以顯著地提昇源極驅動積體元件的故障分析成功率並且有效率地縮短故障分析的時間。

A new system of failure analysis for TFT-LCD Source Driver IC is presented. This system is suitable to two package types (TCP and QTCP) of TFT-LCD Source Driver IC. This system consists of a high success rate (94%) de-capsulate technique, a new fixture between device and E-Beam Prober and a powerful/flexible test program. All of above make failure analysis of TFT-LCD Source Driver IC by E-Beam prober linking to VLSI Tester (SC-μ) being successful and practicable. In addition to failure analysis with E-Beam Prober, these new techniques are also useful to other failure analysis tools such as internal probing at probe-station, Emission Microscope for Multi-layer Inspection (EMMI), Optical Beam Induced Resistance Change (OBIRCH), Liquid Crystal (LC), etc. Besides, an Open-Loop method for OP (operation amplifier) is also presented which makes OP analysis become more effective. Hspice simulation is also introduced to help failure analysis in OP. With this system, for TFT-LCD Source Driver IC, failure analysis success rate is promoted and failure analysis cycle time is shortened successfully and effectively.

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