Sn-Bi共晶合金的熔點(139℃)相當低，普遍的應用在各種低溫的電子產品上，商用的熱電材料模組裡以Sn-Bi合金作為連接熱電材料與導電銅板佔有相當大的比例，而在各種的熱電材料中，又以Bi2-xSbxTe3與Bi2Te3-ySey具有最好的熱電性質，最常被用在中低溫的熱電材料中，因此在市售的熱電材料模組中常可見到Sn-Bi與Bi2-xSbxTe3或Bi2Te3-ySey相接著，這些模組在組裝或產品使用的過程中，Sn-Bi會與Bi2-xSbxTe3或Bi2Te3-ySey接觸與反應，而互相接著後的界面反應，對這些產品的可靠度便有很大的影響。本研究先簡化此四元的界面反應，先以二元或三元的界面反應來做探討。由於相平衡的基礎資料，對解釋界面反應與生成相有極大的幫助，因此本研究也建立了相關的三元系統相平衡。
本研究以實驗的方式來得到在1600C與5000C之Sn-Bi-Te相平衡，在此研究中發現了有5個三元相的存在，除了已知的外，另外也發現Sn3Bi2Te6、Sn2Bi2Te5及SnBiTe2相的存在。另外也使用新的Sn-Sb熱力學參數，來計算Sn-Sb-Te與Sn-Bi-Sb三元相平衡圖。
本研究以反應偶的方式進行界面反應的探討，使用的基材為熱電材料中主要的組成元素Te與構成n與p-type熱電材料最主要的Bi2Te3與Sb2Te3，討論了Sn-(Bi)/Te、Sn/Bi2Te3與Sn/Sb2Te3這些基礎系統的界面反應。在Sn/Te與Sn-Bi/Te之液/固界面反應中，皆可觀察到獨特的十字形cruciform pattern的產生，此特殊的生成相結構在文獻上是相當的罕見。在Sn/Te之液/固界面反應中也討論了，使用不同形狀的Te基材之界面反應，證實了在生成相中因為應力的關係，使得反應生成相出現裂縫，並解釋產生cruciform pattern之反應機制。在Sn-Bi/Te之液/固界面反應中，cruciform pattern則會隨著Bi在銲料中含量的增加而逐漸消失。在Sn/Te固/固界面反應中，則觀察到了雙結構的生成，藉由標記實驗來得知其原子擴散機制。在Sn/Bi2Te3之界面反應中，雖然起始為固/固界面反應，但因為生成Sn-Bi液相與SnTe+液相兩相共存的反應層，而使得其反應層的厚度隨著時間呈線性的增加，從Sn-Bi-Te的相平衡圖中，也可得知在反應偶中，液相之生成是可能存在的。在Sn/Sb2Te3之界面反應中，發現生成Sn3Sb2與SnTe+Sn3Sb2的兩相共存區，從計算得到的Sn-Sb-Te相平衡，其反應的擴散路徑也可清楚的瞭解。
本研究也討論了固態基材包覆液態之界面反應，此與一般界面反應的研究方式大不相同，藉由Sn/Te與Sn/Co兩個會生成cruciform pattern的反應系統，來研究Te與Co包覆液態Sn時，其角落之界面生成相生長形態，在結果中發現，在靠近角落的地方會有生成相向內凹的形態出現，並解釋其生成機制。

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