研究生: |
呂文豐 Wen-Feng Lu |
---|---|
論文名稱: |
在空氣下利用高密度大氣電漿束快速氮化AISI316 Rapid nitriding of AISI 316 by high density plasma jet at atmospheric ambient condition |
指導教授: |
陳建瑞
Jiann-Ruey Chen |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 材料科學工程學系 Materials Science and Engineering |
論文出版年: | 2007 |
畢業學年度: | 95 |
語文別: | 中文 |
論文頁數: | 87 |
中文關鍵詞: | 氮化 、不□鋼 、電漿 |
外文關鍵詞: | plasma, nitriding |
相關次數: | 點閱:2 下載:0 |
分享至: |
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報 |
本實驗之目的在使用高密度大氣電漿束 (Atmospheric Pressure Plasma Jet)對不□鋼金屬做氮化處理。本實驗中用來產生電漿的氣體主要為N2,但是在空氣中O2會影響氮化作用,所以除了使用N2為氣源外還加入H2氣,H2的比例從0 ~ 5 at.%。除了產生電漿的氣體改變之外,本實驗還探討其他參數對氮化效果的影響,如改變不同之電源供應器(AC,DC power):以DC電源供應器處理之不□鋼其改變的參數有:產生氮氣電漿的氣體中氫氣的濃度(0~5, at.%);試片的溫度(400℃與25℃);與電漿處理時間(1min, 2 min )。以AC電源供應器處理之不□鋼, 改變的參數有:產生電漿之氣體流速 (1.4 m / s,5.8 m / s )與交流電之頻率為(15 KHZ , 20 KHZ)。經處理過的試片利用奈米壓痕儀去量測其硬度,利用ESCA去分析表面鍵結,以及利用XRD去分析試片處理前後的結晶性。
實驗結果顯示在空氣氣氛下氫含量越高、氮化效果越明顯,原因為氫有阻止鐵原子被氧化的效果。且比較所有以電漿處理過的試片,得到在溫度400~500℃時為最佳氮化溫度。所以本實驗得到如果欲在一大氣壓空氣下達到更好電漿氮化效果,必須提高電漿密度、添加抗氧化劑且要維持在最佳氮化溫度下進行電漿處理。
[1] Andreas Schutze , IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 26, NO. 6, DECEMBER 1998.
[2] T. Yoshida, “The future of thermal plasma processing,” Materials Trans.JIM, vol. 31, no. 1, pp. 1–11, 1990.
[3] Y. Chang, R. M. Young, and E. Pfender, “Silicon nitride synthesis in an atmospheric pressure convection-stabilized arc,” Plasma Chem. Plasma Process., vol. 9, no. 2, pp. 277–289, 1989.
[4] J. R. Roth and Y. Ku, “Surface cleaning of metals in air with a one atmosphere uniform glow discharge plasma,” in Abstracts IEEE Int.Conf. Plasma Sci., Madison, WI, 1995, p. 251.
[5] Pierre-Luc Girard-Lauriault, Fackson Mwale, Mihaela Iordanova, Caroline Demers, Patrick Desjardins, Michael R. Wertheimer. Plasma Processes and Polymers Volume 2, Issue 3, Date: March 31, 2005, Pages: 263-270
[6] Yang Gao , Surface & Coatings Technology SCT-12442; No of Pages 3,2006
[7] V. Hopfe, D. Rogler, G. Maeder, I. Dani, K. Landes, E. Theophile, M. Dzulko, C. Rohrer, C. Reichhold , Chemical Vapor Deposition Volume 11, Issue 11-12, Date: December, 2005, Pages: 510-522 .
[8] Xiaodong Zhu, Farzaneh Arefi-Khonsari,1 Camille Petit-Etienne,1 Michael Tatoulian1 , Plasma Process. Polym. 2005, 2, 407–413 .
[9] Yang Gao , Xue-Ping Guo a, Ronghua Wei b ,Surface & Coatings Technology 201 (2006) 2829–2834 .
[10] 杜金山,國立交通大學碩士論文 The Study of MIG-Flux Welding Technology of Stainless Steel,
[11] C.A. Figueroa, F. AlvarezT , Surface & Coatings Technology 200 (2005) 498– 501 .
[12] C.A. Figueroa *, F. Alvarez , APSUSC-13914; No of Pages4, Applied Surface Science (2006) .
[13] R.S.E. Schneider, h. Hiebler, J. Mater. Sci. 33 (1998) 1737
[14] L.L. Pranevicius *, P. a, Valatkeviciusb, V. Valinciusb, C. Templierc, J.-P. Rivierec, L. Praneviciusa , JOURNAL OF APPLIED PHYSICS VOLUME 94, NUMBER 8 15 OCTOBER 2003,
[15] Patant No : US 6,677,550 B2
[16] I. Langmuir, Proc. Nat. Acad. Sci., vol. 14, p. 627, 1926.
[17] Andreas Schutze , IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 28, NO. 1, FEBRUARY 2000
[18] J. L. Vossen and W. Kern, Thin Film Processes II, Academic Press, Inc., Bonton (1991) 21.
[19] Y. P. Raizer, Gas Discharge Physics. New York: Springer-Verlag, 1991.
[20] W. Elenbaas, The High Pressure Mercury Vapor Discharge. Amsterdam,The Netherlands: North-Holland, 1951.
[21] 清華大學材料系周麗新教授[薄膜工程]課程第四章講義.
[22] V.M. Lelevkin, D.K. Otorbaev, and D.C. Schram, “Physics of Non- equilibrium Plasmas”, North-Holland, Amsterdam (1992)
[23] H.V. Boening, “Plasma Science and Technology”, Cornell Univ. Press,Ithaca (1982)
[24] M.A. Lieberman and A.J. Lichtenberg, “Principles of Plasma Discharges andMaterials Processing”, Wiley, New York (1994)
[25] 奈米通訊:奈米壓痕量測系統簡介,丁志華,國家奈米元件實驗.
[26] An Improved technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments”, Journal of Materials Research, Vol. 7 No. 6, p.1564-1583, 1992.
[27] I. N. Sneddon, Int. J. Engng. Sci. 3, 47,1965 .
[28] Materials Research, Vol. 7, No. 3, 483-491, 2004.
[29] "Surface Analysis, The Principal Techniques", Edited by John C. Vickerman, Wiley, 1997.
[30] 微結構分析技術之介紹,181期,工業材料雜誌 73~79 .
[31] D. Briggs , M.P. Seah , Practical surface analysis , John WILLEY & SONS. Vol. 1, second edition 1993
[32] C. A. Figueroa, A. S. Ferlauto, and F. Alvarez, Journal of Applied Physics , 94 (2003) 5435.
[33] J. P. Riviere , M. Cahoreau , and P. Meheust , Journal of Applied Physics ,91(2002) 6361
[34] Li Yan , Xinhe Zhu , Jiujun Xu, Yuzhou Gao , Yan Qin , Xiyao Bai,Plasma Chemistry and Plasma Processing , 25 , 5 (2005) 467.
[35] S. Ciampi , V. DI Castro , Surface Science , 331-333,(1995)294 .
[36] D. Brion , Applications of Surface Science , 5 , (1980) 133 .
[37] C.D. Wagner , J.F. Moulder , L.E. Davis , W.M. Riggs , Handbook of X-ray photoelectron spectroscopy .
[38] Eduardo J. Miola , Sylvio D. de Souza , Pedro A.P. Nascente ,Maristela Olzon-Dionysio , Carlos A. Olivieri , Dirceu Spinelli , Applied Surface Science 144–145(1999) 272 .