本論文主要利用有限單元模擬及實驗量測方法探討四方扁平薄型電子構裝(Thin Quad Flat Package, TQFP)在JEDEC (Joint Electron Device Engineering Council) 規範的自然對流條件下之散熱效能。為了正確分析熱對流及輻射效應，本論文首先以紅外線熱像儀量測銲於測試基板上之TQFP構裝表面溫度場，並以此為熱傳邊界條件，應用ANSYS有限單元套裝軟體計算TQFP構裝內部溫度分佈，其結果並與晶片溫度測試實驗相驗證，以修正、建立一可靠之有限單元分析模型。以此模型為基礎，本論文接著深入評估文獻中採用之各種不同邊界熱傳模型之適用性。最後，本論文並歸納出一最佳的邊界熱傳模型，以評估各熱傳路徑之散熱比重，進而針對TQFP構裝主要散熱元件進行參數化分析及相關熱應力探討，以供TQFP構裝散熱效能與可靠度評估之參考。

By finite element simulation and experiments, this work focuses its attention on the thermal dissipation efficiency analysis for a Thin Quad Flat Package (TQFP) under a natural convection environment based on JEDEC (Joint Electron Device Engineering Council) specifications. To accurately account for the convection and radiation effects, the surface temperatures of the TQFP welded on the test board are first measured by the infrared (IR) thermometer and considered as the boundary conditions of the finite element calculation using the ANSYS program. To modify and establish a reliable finite element analysis model, the computed results are verified by the thermal test die measurement. By this model established, various heat transfer models developed in the literature are then evaluated. After selecting the most appropriate heat transfer model as the boundary conditions, this work further assesses the ratio of the thermal dissipation from each heat transfer path. Finally, the parameter analysis of the major thermal dissipation components and related thermal stress analysis are performed. The results could be used as a guideline for TQFP’s thermal dissipation management and reliability analysis.

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