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研究生: 王炳琨
Wang Ping-Kun
論文名稱: 不同HfOxNy/SiO2堆疊穿隧介電層對快閃記憶體操作特性之影響
Flash Memories with Different HfOxNy/SiO2 Stack Tunnel Dielectric
指導教授: 王天戈
Tien-Ko Wang
張廖貴術
Kuei-Shu Chang-Liao
口試委員:
學位類別: 碩士
Master
系所名稱: 原子科學院 - 工程與系統科學系
Department of Engineering and System Science
論文出版年: 2004
畢業學年度: 92
語文別: 中文
論文頁數: 117
中文關鍵詞: 快閃記憶體堆疊穿隧介電層
外文關鍵詞: Flash Memory, Stack Tunnel Dielectric, HfOxNy/SiO2
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  • 快閃記憶體元件在經過多次的寫入/擦拭操作之後,主要的元件傷害都集中在熱電子穿隧閘極氧化層的過程中發生。當元件使用愈久,其閘極氧化層的傷害便愈嚴重;如此一來,將使得電子無法穿隧閘極氧化層到達懸浮閘極進行資料的儲存,也將使得快閃記憶體的電荷保持能力大幅衰減,導致元件無法使用。因此,本篇論文探討以單層/堆疊閘極結構做為快閃記憶體中的穿隧閘極介電層,再配合不同的快速熱退火溫度條件,對於快閃記憶體元件電特性之影響,做一系統性的探討。
    由實驗結果可發現,堆疊結構不論在寫入或是擦拭方面,其穿隧電流值皆比單層結構大,因此,堆疊結構有較快的寫入及擦拭速度;在可靠度測試中,實驗結果顯示出堆疊結構不論在電荷保持、耐力表現、讀取干擾方面,其整體表現皆比單層結構優越。而在同樣是堆疊樣本當中,我們發現當墊氧化層厚度愈薄,跨於閘極氧化層的電場便愈大,因此可得到較大的穿隧電流值,所以墊氧化層較薄的元件擁有較優越的寫入/擦拭特性;而墊氧化層厚度較厚的樣本,則是在高電場下的電荷保持特性,表現較為出色。在退火溫度方面,由實驗結果發現當退火溫度在850℃之下,材料擁有最佳的特性,因此有較佳的元件特性。整體而言,我們認為OH15/60-850為最佳的元件參數。


    目 錄 摘要……………………………………………………………I 目錄……………………………………………………………II 表目錄…………………………………………………………V 圖目錄…………………………………………………………VI 第一章 序論……………………………………………………………1 1-1前言…………………………………………………………………1 1-2研究目的……………………………………………………………4 1-3高介電常數材料的選擇及介紹…………………………………5 1-3-1 HfO2材料介紹………………………………………………6 1-3-2 HfOxNy材料介紹……………………………………………7 1-3-3 HfOxNy與HfO2特性比較…………………………………7 1-4論文回顧………………………………………………………………8 1-4-1 High-k應用在快閃記憶體中的穿隧閘極介電層……………9 1-4-2 High-k應用在快閃記憶體中的內多晶矽介電層……………10 1-5各章摘要……………………………………………………12 第二章 快閃記憶體元件操作方法…………………………………20 2-1 快閃記憶體元件結構………………………………………………20 2-2 寫入與擦拭方法………………………………………………22 2-2-1 通道熱電子注入寫入 ………………………………………22 2-2-2 F-N穿隧寫入……………………………………………23 2-2-3 F-N穿隧擦拭……………………………………………23 2-3 耐力…………………………………………………………24 2-4 過度擦拭……………………………………………………25 2-5 干擾…………………………………………………………27 2-6 電荷保持……………………………………………………28 第三章 快閃記憶體元件製程…………………………………43 3-1 元件製程……………………………………………………43 3-1-1 晶片刻號及零層(Alignment Mark)曝光……………………43 3-1-2定義主動區(Active Region Definition)……………………44 3-1-3 LOCOS Formation and KOOI Effect………………………45 3-1-4 閘極介電層的沈積及退火(Annealing)處理…………………46 3-1-5 Floating Gate, IPD and Control Gate Deposition………47 3-1-6 Poly Gate Definition and Source,Drain,Body Implant…48 3-1-7 Contact Holes and Metal Layer……………………………49 3-2 材料分析……………………………………………………50 第四章 不同HfOxNy/SiO2組成比做為快閃記憶體之穿隧介電 層電特性之影響…………………………………………60 4-1 F-N穿隧理論基礎…………………………………………………60 4-2 結果與討論…………………………………………………………62 4-2-1快閃記憶體之寫入與擦拭偏壓決定……………………………62 4-2-2 各元件寫入/擦拭速度比較……………………………………64 4-2-3快閃記憶體之可靠度分析………………………………………65 4-3結論…………………………………………………………………69 第五章 不同退火溫度對穿隧介電層電特性之影響……95 5-1 研究緣由與目的…………………………………………………95 5-2 結果與討論…………………………………………………………96 5-2-1 各元件寫入/擦拭速度比較……………………………………96 5-2-2快閃記憶體之可靠度分析………………………………………98 5-3結論…………………………………………………………………100 第六章 結論與建議………………………………………112 6-1結論…………………………………………………………………112 6-2建議…………………………………………………………………113 參考文獻……………………………………………………114

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