全球的電子產品隨著半導體製程向更微小線路邁進，也更能往輕薄短小，高頻高速和多功能發展。而對作為承載元件與形成電路的印刷電路板而言，意味著更薄基板與更細線路並要求更精準的對準度。這對擔負影像轉移的曝光技術而言，遇到了典範轉移的十字路口。有幾種開發中的技術有機會達到下一代曝光規格的需求。包括步進式Step & Repeat投影曝光、雷射直接成像、DMD直接成像和雷射投影成像等。
本篇研究由印刷電路板主要的多層板及高密度互連板(HDI)製程分析開始，說明曝光技術發展的歷史軌跡，及其在製程上的限制，並分析與評估比較現有幾項高階影像轉移的競爭技術。本篇研究最後提出對材料供應商、設備供應商和印刷電路板製造者可採行方向的建議。

As the semiconductor process progresses continuously to smaller critical dimensions, all electronic devices are able to develop toward ever lighter, thinner, shorter and smaller, also with high frequency, high speed and multi-function capabilities. To the Printed Circuit Board, which acts as both the carrier and circuit connectr of these components, it means thinner substrate, finer circuit lines and more accuracte registration are required. To the exposure technology, which is responsible for the image transfer of thess pattens, it has encountered a paradigm shift. There are several developing technologies that are feasible to meet the specification requirement of the next generation exposure. They include the Projection Step & Repeat Exposure, the Laser Direct Imaging, the DMD Direct Imaging and the Laser Projection Imaging.
Firstly, the main processes of the multi-layer Printed Circuit Board and the High Density Interconnect Board were analyzed in this study. The development history of the exposure technology and its limitation during processes were then explained. The competiting advanced image transfer technologies were then analyzed and compared. Suggestions to possible selections were made to material suppliers, equipment suppliers as well as printed circuit board manufacturers at the end of this study.

¨ 中文/日文資料
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Ushio: www.ushio.co.jp