CMOS-MEMS使用標準化的半導體製程技術來製作微機電元件的微加工技術，能輕易地與感測、控制電路整合在同一晶片上，成為一個完整的微機電系統。目前，CMOS-MEMS後製程多半有其獨特性，造成單一後製程技術往往只能用來設計同一類型的元件，局限了在晶片上製造多種元件與達成系統整合的機會。因此本文將開發一CMOS-MEMS後製程平台，以實現整合不同形態的感測器於單一晶片上。
為了驗證此整合平台的可行性，本論文同時設計多種不同型態的感測元件，其中包含了三軸加速度計、電容式壓力計、和熱電阻白金溫度等，單一後製程流程即可整合不同型態的感測器於單一晶片上。元件製作採用台積電(TSMC)的CMOS 0.35□m 2P4M標準製程來製作CMOS晶片，然後搭配新型雙面後製程平台完成。除此之外，本文同時探討各個感測器的設計原理；(1)多軸加速度計的設計與整合，從三軸個別獨立設計之多質量塊加速度計，慢慢演化至單質量塊三軸慣性感測器，(2)電容式壓力計設計，(3)熱電阻式溫度計以及(4)多功能感測晶片整合於單晶片中。整體而言，本論文藉由了解最基本的元件設計、製作流程、以及量測元件個別的特性，來分析與驗證此製程的可行性，期望能提供一個良好的CMOS-MEMS後製程平台用於感測器之整合與應用。

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