摘要

隨著覆晶構裝被採用的頻率愈來愈多，所需產率須大幅提升，加強自動化生產及更細線化、高信賴性的要求，使得異方性導電膠膜覆晶構裝技術發展迅速，這種技術主要用在LCD(liquid crystal display)驅動IC的接合。其中又以COG (chip on glass)為目前的主流構裝，此技術是使用異方性導電膠膜(anisotropic conductive film；ACF)作為接合的材料，因此COG構裝的可靠度是取決於ACF的特性。
本論文主要以晶片剪力強度測試(die shear test)的方法來探討COG構裝的機械性質，也就是ACF界面層的結合強度，並且針對三種不同硬化系統及材料性質之異方性導電膠膜(ACF1、ACF2及ACF3)探討不同的溫度、壓力、時間的熱壓接合條件對於接合強度的影響；也將試片分別在不同操作溫度、高溫高濕、熱循環等環境下進行可靠度測試，且觀察其破壞的表面，定義其破壞的機制；
結果顯示ACF2酚醛(phenol)硬化系統反應速度及固化程度較差，初始結合強度較低。ACF1針對ACF2反應性及柔軟性做改善，添加的脂肪二胺(aliphatic diamine)長鏈分子，使得接合強度變強。ACF1與ACF2初始固化未完全，因此一開始經過溫度老化效應反而增加固化程度使強度提升，隨後環境因素影響下黏著強度慢慢下降。ACF3咪唑 (imidazoles)硬化系統反應迅速固化程度高，初始結合強度最高，且Tg高不受85℃老化影響，但固化後收縮力大且過於剛性，殘餘熱應力過大，造成150℃老化後強度最低且無法通過高溫高濕、熱循環的考驗，顯示反應快速不代表膠材黏著的可靠性。本研究之結果對LCD構裝可靠度方面的資料能有所幫助，也可以提供ACF材料在開發上技術突破的參考。

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