本文主要探討微懸臂樑結構承受變動磁力負載作用時，微懸臂樑的疲勞壽命。微懸臂樑結構經由微機電系統製程技術如：曝光(Exposure)、顯影(Lithography)、蝕刻(Etching)等於4吋之矽晶片上製作。本研究利用電子顯微鏡(SEM)觀察疲勞破壞試片之斷面型態，以瞭解微懸臂樑的疲勞破壞特徵和顯微結構的變化。微懸臂樑經由磁力負載，經由改變施加磁通量參數，可獲得不同的疲勞壽命值。同時利用有限元素分析微懸臂樑受磁力負載作用時的應力及應變，以電腦輔助模擬分析施加磁力與位移之間的關係。經由理論模擬和實驗比較，建立微懸臂樑之疲勞分析模式。

The fatigue behavior of the micro cantilever beam loaded by various magnetic forces is investigated. The MEMS fabrication techniques, such as exposure, lithography, etching, etc., are applied to manufacture the micro structures on silicon wafer. FEM and SEM are employed to analyze the fractographies, stresses, and strains. The experimental results show that the deformation, stress and strain increase as the magnetic force increases. Besides, the fatigue cycle time decreases while the load raises or the beam length increases.

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