本研究探討以硼矽玻璃+氧化鋁進行束縛燒結時低溫共燒硼矽玻璃之緻密動力學與機制及透過雷射光學量測系統對銀膏進行束縛燒結時之應力分析。
當硼矽玻璃+氧化鋁（BSG+alumina）薄片在燒結中受到束縛時會導致緻密速率減緩。然而我們發現無論在自由燒結或束縛燒結，影響緻密的控制機制仍為黏滯流動（viscous flow）。束縛燒結的緻密化行為可由使用於多孔性燒結玻璃構成方程的黏性類比透過自由燒結來做數學上的描述。

在銀膏應力量測部分透過雷射光學系統量測得到束縛燒結應力，並不足以解釋減緩緻密速率減緩，其中應力大小與緻密速率有關。因此由實驗結果得知除了燒結應力的影響外還伴隨著晶粒成長的減緩及緻密機制由自由燒結時較快的grain boundary diffusion轉變成束縛縛燒結時較慢的lattice diffusion。

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