本研究針對交換式電源供應器成功地發展出一套具友善操作介面的散熱電腦輔助設計系統，此系統是建立在微軟視窗98的操作平台上使用，其內容乃由前置處理器、熱網路分析軟體及後置處理器等三個次系統組成。前置處理器提供了相當友善的使用者介面，讓設計人員能夠輕易地產生熱傳分析模型、建立熱網路分析軟體所需之輸入檔案、評量交換式電源供應器發熱量、選擇風扇種類、及計算空氣之流量；同時亦可展現出交換式電源供應器各組件的數位照片。有關熱網路分析軟體之設計，乃採用本實驗室所發展出之「外內」熱傳分析觀念，針對交換式電源供應器不同階段之熱傳分析需求而內建了六種熱傳分析模型。在後置處理器中，本研究提出了一套改良之繪圖方法來繪製彩色等溫圖；並引用圖像合成方法，成功地顯示出印刷電路板上等溫圖的彩色合成效果。因此，在研究中更進一步地整合上述前後處理次系統、熱網路分析軟體及資料庫，而完成一套具友善操作介面之交換式電源供應器散熱電腦輔助設計系統。
應用上述研發出之電腦輔助設計系統，本研究針對數個交換式電源供應器的散熱實例做詳盡分析與比較，結果印證此電腦輔助設計系統皆能適當地預測交換式電源供應器內印刷電路板上的熱傳特性。另外，本研究亦針對交換式電源供應器設計作了一系列的探討，此些探討乃包括印刷電路板與底殼間距、風扇種類、風扇與通風孔安置方式等。經由文中各種實例探討，結果皆驗證了本研究中開發出之交換式電源供應器散熱電腦輔助設計系統的優越性。

Bar-Cohen, A., and Kraus, A. D., 1993, Advances in Thermal Moldeling of Electronic Components & Systems, ASME Press, New York.
Bar-Cohen, A., and Kraus, A. D., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Co., Washington.
Brown, Marty, 1990, Practical Switching Power Supply Design, Academic Press, San Diego.
Chao, R. C., 1997, “Thermal Analysis and Experimental Study for 75MHz Notebook Computers,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Chapman, A. J., 1984, Fundamentals of Heat Transfer, Rice University, Macmillan Publishing Company, New York.
Charles, Jr., H. K., 1989, “Electrical Interconnection,” In Electronic Materials Handbook, ed. by Minges, M. L., Vol.1, ASM International, Materials Park, Ohio, U.S.A., pp.224-236.
Caralow, H. S., and Jaeger, J. C., 1959, Conduction of Heat in Solids, Oxford at the Clarendon Press, p.216.
Cheng, K. W., 1998, “Thermal CAD System for 75MHz Notebook Computers,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Chiang, K. F., 1997, “Thermal Analysis and Experimental Study for 133 MHz Notebook Computers,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Chou, C. C., 1998, “Thermal CAD System for 133MHz Notebook Computers,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Chou, C. L., 1999, “Multimedia Computer-Aided Design System for Thermal Control of Notebook Computers,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, van Nostrand Reinhold Co., New York, U.S.A..
Hisano, K., Iwasaki, H, Ishizuka, M., and Makita, S., 1995, “Thermal Design of Compact Electronic Equipment, ”ASME EEP-Vol.10-2, Advances in Electronic Packaging, pp.889-894.
Huang, C. H, 1991, “Development of An Automated Thermal CAD/CAE System For Modern Electronics Package,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Hung, Y. H., Liou, J. M., Lin, H. H., and Lin, C. D., 1995, “A CAD Package for Thermal Management of Electronics Packaging,” In Advances on Electronic Packaging 1995, EEP-Vol.10-1, pp.159-167.
Joy, C. R., and Schlig, E. S., 1970, “Thermal Properties of Very Fast Transistors,” IEEE Trans. Electron Devices, Vol.ED-17, pp.586- 593.
Klein, M. K., 1994, “Multi-Level Thermal Analysis Applied to The Design of Electronic Products,” ASME, EEP-Vol. 9, CAD/CAE Application to Electronic Packaging, pp.59-65.
Lin, C. D., 1990, “Application of Thermal CAD/CAE System on the Moden Electronics Packaging Design,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Liou, J. M., 1989, “Thermal CAD/CAE System for Electronic Equipment,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Lu, S. C., 2000, “An Experimental Study on Thermal Behavior of Switching Power Supplies,” Master’s Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, R.O.C..
Mills, A. F., 1995, Basic Heat and Mass Transfer, California University, Los Angeles, CA, U.S.A..
Myers, T. F., 1996, “A Full-Featured Pentium PCI-Based Notebook Computer,” J. of Hewlett-Packard, pp. 38-44.
Nakayama, W., 1986, “Thermal Management of Electronic Equipment: A Review of Technology and Research of Topics,” Applied Mechanics Review, Vol. 39, No. 12, pp. 1847-1868.
Pierce, B. L., and Stumpf, H. J., 1969, “TAP-A - A Program for Computing Transient or Steady-State Temperature Distribution,” Westinghouse Astronuclear Laboratory, U.S.A..
SAP User Group, 1981, MODEL - An Interactive Pre-Processor Graphics Program, University of Southern California, Los Angeles, CA, U.S.A..