目前精密元件量測多以非接觸的量測方式為主。隨著製造技術的精進，許多基礎元件的尺寸縮小至微米等級，同時其量測的技術受到考驗。本研究提出一改進原始電子光斑(Electronic Speckle Pattern Interferometry)影像干涉量測之光路系統，將面內、面外電子光斑量測之光路整合且導入相平移法(Phase-Shifting)作為干涉條紋相位提取及增進相位分布(Wrapped Phase)品質之工具。此光路設計在改變不同量測維度僅需更動少許反射鏡的位置來切換面內、面外量測光路，藉此提升本二維變形量量測工具的便捷性。
為了驗證此光路設計之可行及準確性，本研究利用量測一矽晶圓塗布Polyimide在因為加熱產生翹曲的面內、面外變形情況。並以有限元素法軟體ANSYS建立試片有限元素模型，成功的比對實驗與數值模擬結果。
在原始相關條紋的影像透過相平移法後仍存在許多非連續之斑點，本研究引入快速傅立葉轉換並搭配高斯濾鏡之影像平滑法，嘗試減少雜訊的影響。最後為了得到連續之位移量分布，使用影像品質引導項為重建演算法(Quality Guided Phase Unwrapping)將原始相位分布展開維連續相位分布。透過位移與相位之線性關係得到全場之面內、面外位移量分布圖。
本研究提出之整合二維電子光斑量測光路設計所量測到的位移量比對模擬結果，誤差皆在10%以內，證明本研究提出之整合式電子光斑光路設計的可行性與精確度。

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