本研究的目的是整理出一套製造與設計部門之間的整合機制，從電路板組裝的取置機著手，事先將機台的製造資源限制讓設計部門知道，使設計部門能考量到製造的可行性，並分析製程與產品的失效資料，推論出設計規範。透過雙方良好的溝通，以減少工程變更的次數、縮短研發時程及降低成本，進而加速新產品導入的時間，增加企業的競爭力。

本研究的成果及貢獻包括：
1.根據所蒐集到的取置機規格限制與製程和產品的失效資料，利用製
造屬性展開及失效分析等手法，訂定出取置機的製造屬性與相關的
設計屬性，並推論出設計規範，確實考慮設計與製造部門雙方的需
求，使得設計與製造的缺失可事先被預防。
2.利用程式語言（HTML及VBA）建構一軟體介面，對本研究加以實證
並增加實用性，其主要有下列功能：
(a)使用者可利用此介面填入基板與元件的設計屬性值，根據資料庫
中的規格限制及設計規範加以檢驗，對問題點予以標示，並提醒
使用者應注意的事項；
(b)可估算所輸入元件的製程時間，並可根據所輸入的元件料號查詢
元件的外形、鋼板開孔、白框（Silk Screen）及銲墊（Pad）規
格；
(c)可查詢資料庫中基板與元件設計屬性的限制、取置機規格限制、
相關的設計規範、合格元件供應商列表及常見問題；
(d)利用網頁架構，讓各單位使用者及協力廠商可共同查詢及維護。
3.利用本研究的軟體介面，可檢查出傳統CAD圖（2D）無法發現的問
題，如元件高度及重量等。

The purpose of the research is to establish an integrated mechanism between manufacture and design department. Starting in placement machine for printed circuit board assembly lines to make design department learn manufacturing resource constraints of machines previously. Design department can take manufacturability into account and analyze failure data from process/product to inference design rules. The benefits are reducing times of engineering change notice, decreasing cost, and speeding new product introduction.

The achievements and contributions of the research include:
1.According to manufacturing resource constraints and
failure data from process/product, the research uses
manufacturing attribute deployment (MAD) and failure
analysis to establish manufacture attributes of placement
machine and related design attributes to inference design
rules.
2.Using program languages (HTML and VBA) to construct an
user interface. It has following functions:
(a)User can type in design attribute value of board and
components and the interface will check with
constraints and design rules in the database.
(b)It can compute the process time and look up
specification of shape, hole on stencil, silk screen,
and pad of components.
(c)It can look up constraints of board and component
design attributes, related design rules, approval
vender list, and common problems in the database.
(d)Because of using web-based structure, all departments
and partners can look up and maintain the information
in the database together.
3.Using the user interface, it can find out the problems
that CAD can’t detect. Such as the height and weight of
components.

1.刁建成編譯，半導體IC產品製造與應用，全華科技圖書股份有限公司，90年12月。
2.水野滋，赤尾洋二編著，品質機能展開研究小組譯，品質機能展開法，先鋒企業管理發展中心，86年。
3.王通成，『筆記型電腦廠製造流程分析：電路板組裝線』，清華大學工業工程與工程管理學系碩士論文，89年。
4.呂志平，『整合QFD與DFA之同步設計與評估方法之構建』，清華大學工業工程與工程管理學系碩士論文，87年。
5.巫政祐，『產品屬性與設計屬性之連結--以手機市場為例』，台北大學企業管理學系碩士論文，91年。
6.李賢仁編譯，SMT組裝技術之實務，電子技術出版社，86年11月。
7.取置機型錄，Universal Instruments Corporation。
8.許盛堡，『建構一個QFD與FMEA之整合架構』，元智大學工業工程與管理學系碩士論文，91年。
9.許棟樑，陳大仁，『整合性優質設計架構』，科技管理學刊，審稿中，民國93年。
10.郭嘉龍編譯，圖解SMT接合材料入門，全華科技圖書股份有限公司，89年11月。
11.陳俊元，『筆記型電腦廠系統組裝線診斷與改善』，清華大學工業工程與工程管理學系碩士論文，91年。
12.黃錦烈，『電腦廠從接單到出貨的時間分析與改善手法』，清華大學工業工程與工程管理學系碩士論文，92年。
13.葉榮鵬編著，吳聯樹總校閱，品質管制，高立圖書，83年。
14.電子技術編輯群主編，表面黏著技術(SMT)，電子技術出版社，81年9月。
15.謝宗雍，「電子構裝」，華梵大學機電工程學系課程講義。
16.鍾文仁，陳佑任編著，IC封裝製程與CAE應用，全華科技圖書股份有限公司，92年6月。
17.魏隆章，『以製造為導向的研發設計以提高電腦機板生產力之研究』，義守大學管理科學學系碩士論文，89年。
18.Bendell, A., “Introduction to Taguchi Methodology, Taguchi Methods”, In: Proceedings for 1988 European Conference, pp.1-14, London: Elsevier Applied Science, 1988.
19.Boothroyd, G., and Alting, L., “Design for Assembly and Disassembly”, Keynote Paper, Annals of the CIRP, 41 (2), pp.625-636, 1992.
20.Boothroyd, G. and Dewhurst, P., “Design for Assembly—A Designers Handbook”, Technique Report, Department of Mechanical Engineering, University of Massachusetts, 1983.
21.Boothroyd, G. and Dewhurst, P., “Product Design for Assembly”, Wakefield, RI: Boothroyd and Dewhurst, 1986.
22.Boothroyd, G., Poli, C., and March, L., “Handbook of Feeding and Operating and Orienting Techniques for Small Parts”, Technique Report, Department of Mechanical Engineering, University of Massachusetts, 1978.
23.Corbett, J., “How Design Can Boost Profit”, Eureka Transfers Technology, May, pp.59-65, 1987.
24.Crow, K. A., Concurrent engineering In R. Bakerjian, “Tool and Manufacturing Engineers Handbook: Design for Manufacturability”, pp.2-1-2-19, Vol. 6, 1983.
25.Giachetti, Ronnald E., and Alvi, Mohammed I., “An Object-Oriented Information Model for Manufacturability Analysis of Printed Circuit Board Fabrication”, Computer in Industry, Vol. 45, Issue 2, pp.177-196, 2001.
26.Henstock, M. E., “Design for Recyclability”, Conservation and Recycling, Vol. 4, Issue 3, September 1990, pp.253-254, 1988.
27.Huthwaite, B., “Link Between Design and Activity-Based Accounting”, Manufacturing Systems, 7(10), pp.44-47, 1989.
28.Jovane, F., Alting, L., Armillotta, A., Eversheim, W., Feldmann, K., Seliger, G., and Roth, N., “A Key Issue in Product Life Cycle: Disassembly”, Annals of CIRP, pp.1-13, 1993.
29.Keoleian, G. A., Meanery, D., and Curran, M. A., “A Life Cycle Approach to Product System Design”, Pollution Prevention Review, pp.293-306, 1993.
30.Leonard, L., “Design for Environment”, Plastics Design Forum, May/June, pp.25-32, 1991.
31.Martin O’Driscoll, “Design for Manufacture”, Journal of Materials processing Technology, pp.318-321, 2002.
32.SMT Back to Basics, IHS Publishing Group, July 1998.
33.Stoll, H. W., “Design for Manufacturing”, Manufacturing Engineering, January, pp.67-73, 1988.
34.Ullman, David G., The Mechanical Design Process, The McGraw-Hill Companies, Inc., 1997.
35.Warnecke, H. V., and Bassler, R., “Design for Assembly—Part of Design Process”, Annals of CIRP, 37(1), 1, 1988.
36.Waterbury, R., “Designing Parts for Automated Assembly”, Assembly Engineering, February, pp.24-28, 1985.