電子製造封測業面對未來的無鉛製程以及高密度化的發展趨勢下，傳統二維自動化光學檢測（Automatic Optical Inspection）方式因受限於光源打光角度，攝影取像角度等種種因素，漸漸無法勝任於更高精密度的電子產品檢測。此時，利用X射線進行三維結構的影像重建，最後以所得到的立體影像來檢測出生產線上的製程缺陷，已逐漸獲得業界的重視，極可能在未來在電子產品檢測上扮演極其吃重的角色。
自從電腦斷層掃瞄發明之後，利用X射線輔以電腦強大的運算能力重建出的斷面影像為近代的醫療做出不小的貢獻。如今我們想要將它應用在製造檢測上面，勢必得對其基本原理與技術作一定程度的探討與研究。本研究使用理論發展較為完備的濾波逆投影法（Filtered Back-Projection）來重建待測影像，並將結果輔以相關係數找出重建三維BGA錫球結構之最佳參數，最後依據所得到的影像與資訊來檢測是否有瑕疵或缺陷出現。

Electronics manufacturing and IC packaging & testing industries confront the tendencies of higher component density and Pb-free manufacturing process in the future. Traditional two-dimension automatic optical inspection machine is limited by several factors, such as angles of the light source and photographing, it is not able to fulfill the need in the future. Meanwhile, the technique of using x-ray image to reconstruct three-dimensional image to inspect the product gradually grab the attention of the industry. It is believed this approach will play an important role in the near future.
Since computed tomography (CT) is developed, computer has a powerful arithmetic ability that can reconstruct the section images of structure, which is a great contribution to modern medical science. Nowadays, in order to apply this technique in manufacturing and inspection process, its basic principles and technologies must be carefully studied. In this dissertation, finding the best parameter of filtered back-projection (FBP) method by the correlation coefficient (CC) can rebuild the 3D BGA structure and these images can detect the deficiencies is existed or not.

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