研究生: |
鄭廷尉 Zheng, Ting-Wei |
---|---|
論文名稱: |
鈦介層對鍍覆於矽基板之氮化鋯/鈦雙層薄膜殘留應力釋放之影響 Effect of Ti Interlayer on Stress Relief of ZrN/Ti Bilayer Thin Films on Silicon Substrate |
指導教授: |
黃嘉宏
Haung, Jia-Hong 喻冀平 Yu, Ge-Ping |
口試委員: |
李志偉
Lee, Jyh-Wei 呂福興 Lu, Fu-Hsing |
學位類別: |
碩士 Master |
系所名稱: |
原子科學院 - 工程與系統科學系 Department of Engineering and System Science |
論文出版年: | 2018 |
畢業學年度: | 106 |
語文別: | 英文 |
論文頁數: | 106 |
中文關鍵詞: | 殘留應力 、鈦介層 、塑性應變 、平均X光應變 、氮化鋯 |
外文關鍵詞: | Residual Stress, Ti Interlayer, Plastic Strain, Average X-ray Strain, ZrN |
相關次數: | 點閱:3 下載:0 |
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純金屬介層廣泛地被應用於硬質鍍層以改善其附著性與降低殘留應力。然而,對應力釋放之介層厚度設計大多依經驗而定,而並無定量的依循基礎。本研究的目的是探討金屬介層對硬膜應力釋放之影響,並建立物理模型以連結介層塑性變形與應力釋放之關係。本研究以氮化鋯/鈦雙層薄膜鍍覆於矽基板作為模型系統,並以非平衡磁控濺鍍系統製備試片。試片種類包括具有不同鈦介層厚度及使用不同基板偏壓於氮化鋯製程之氮化鋯/鈦雙層薄膜。試片整體與單一薄膜層之殘留應力值以曲率量測法與平均X光應變搭配奈米壓痕法精準量測之。實驗結果顯示應力釋放比例介於59.7到80.4%之間,其數值隨介層厚度增厚而上升,但隨氮化鋯層之應力增加而下降。應力釋放效率則隨介層厚度增加而下降,然而不同氮化鋯之應力條件對釋放效率並無顯著趨勢存在。在本研究中,我們使用氮化鋯硬膜彈性儲存能與金屬介層塑變功間之能量平衡的觀點建立物理模型,藉此說明介層塑變與應力釋放的關聯,並以等軸平面應力狀態下頸縮時之塑性應變作為介層釋放應力之上限。此模型後續以實驗結果進一步驗證。藉此模型,我們可以量化估計在特定介層厚度條件下可容許之應力釋放值,或是釋放特定應力時所需之介層厚度。此外,驗證實驗結果顯示,此模型所提供之金屬介層應力釋放值為保守估計值。此模型也顯示應力釋放主要來自於鈦介層之塑性變形。
Pure metal interlayers have been widely used to enhance adhesion and relieve residual stress in hard coatings. However, the interlayer thickness for stress relief was mostly designed empirically without quantitative basis. The objectives of this study were to investigate the effect of metal interlayer on stress relief of hard coatings, and to establish a physical model associating plastic deformation of interlayer with stress relief. ZrN/Ti bilayer thin films on Si substrate was chosen as the model system. ZrN/Ti specimens with different interlayer thicknesses and with ZrN coatings deposited at different bias voltages were prepared using unbalanced magnetron sputtering. Wafer curvature method and average X-ray strain combined with nanoindentation technique were employed to accurately measure the residual stresses in the entire specimen and individual layer, respectively. Experimental results showed that the extent of stress relief, ranging from 59.7 to 80.4%, increased with interlayer thickness, while decreased with increasing stress transferring from top ZrN layer. The efficiency of stress relief decreased with increasing interlayer thcikness, but varied irregularly with the stress transferring from ZrN layer. A physical model was developed to account for the stress relief due to plastic deformation of the interlayer, based on the energy balance between elastic stored energy in ZrN and plastic work of metal interlayer. The upper limit of stress relief by the interlayer was assumed to be the necking strain of the interlayer under equibiaxial stress state. The model was verified by the experimental results. Using the model, we could quantitatively estimate the allowable stress relief with a specific interlayer thickness or the required interlayer thickness to relieve certain amount of stress. Furthermore, a critical experiment was conducted and confrimed that the model could provide a conservative estimation on stress relief for practical applicaitons. The proposed model also indicated that the stress relief was mainly due to plastic deformation of Ti interlayer.
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