隨著光通訊產業的發展，新型的光通訊模組與系統也推陳出新。本研究將使用ANSYS電腦模擬軟體針對以BGA型態之光收發模組與光電基板結合後，其錫球可靠度與光耦合效率作一分析與探討。
為增加短距離內的通訊頻寬、降低串擾（Crosstalk）效應並減少熱效應問題的產生，光電基板因應而生。所謂光電基板即是將傳統印刷電路板中的金屬導線以平面波導結構替代，光取代電子在波導中傳遞訊號，此舉可解決上述傳統基板之問題。而在光收發模組封裝的成本中，光對位部分佔了很大之比例，故為將低封裝成本，以錫球回復力作為光對位機制的光收發模組已有多種之型態，一般皆以覆晶結構的形式存在。其與電子封裝產業不同之處在於覆晶結構之光收發模組並無底膠，故錫球可靠度較差。於本研究中，光收發元件將置於BGA封裝體內，期望將其可靠度提升。

在一般光電模組分析當中，只有以實驗量測光耦合效率，對錫球受熱循環後之壽命並無分析，但實際上錫球壽命會影響光電模組的可用性。故本研究以有限單元理論將光電模組模型化並加以分析，並以分析結果預測錫球疲勞壽命及探討潛變效應對光耦合效率之影響。

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