摘要
晶圓(wafer)是半導體積體電路製造時所使用的基板，基板品質的好壞對最終產品的良率表現上有極大的影響，由於目前對於原物料晶圓必須仰賴供應商提供，半導體工廠多半是對原物料制定COA(Certificate of Authenticity) 來決定允收的標準。隨著製程的精進和多樣化，每片晶圓在經過不同製程，尤其是越來越多的熱處理和其他製程之後，進廠時相同允收規格下的晶圓表現開始出現分歧，反映出了當前制定的COA並無法涵蓋晶圓經過製程後衍生的不可預期變化。
本研究依照紫式決策分析架構分別對現行產品和特殊新進產品進行進料晶圓資料挖礦與最佳化。在現行產品上，本研究案例依照分析架構就目前產品反饋的表現，濾除已符合條件無須再精進的進料晶圓參數，專門針對尚待釐清的晶圓規格做驗證，經此分析找出雖不致造成現行產品問題但可更精進的晶圓規格參數；在特殊新進產品上，本研究依據歷史上的經驗資料，找出和產品問題參數最相關的晶圓規格參數，再利用DOE用最少的實驗次數找出最大影響值的規格參數，並針對此結果在短時間內找出最佳化的晶圓規格以符合特殊產品的條件限制，減少無意義的實驗消耗和猜測，有效降低產品研發週期。

Abstract
Wafer, the substrate of integrated circuit (IC), decides the quality of final product performance from its intrinsic properties. Currently, most semiconductor manufacturing FABs use COA (Certificate of Authenticity) as accepted criteria to wafer suppliers. During the more complicated and advanced technology going, the raw wafers with same COA perform different results after hundreds of manufacturing and thermal process. The unpredictable failure reveals the deficiency of overall optimized certification for raw wafers.
This study aims to employ UNISON decision framework to develop a raw wafer quality management system for reducing advanced/special process developing period on semiconductor manufacturing. For mature products, here demonstrates an optimized procedure for wafer CoA key parameters improvement. This can very help to accurate the right root cause and fix problems in a short time. Also, for specialty and advanced products, this study finds the most related wafer parameters from historic experience with DOE analysis and significantly reduces developing cycle and useless guess.

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上網日期 : 2016年8月19日。
網址: http://iknow.stpi.narl.org.tw/post/Read.aspx?PostID=12701
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