本研究致力於晶圓級檢測平台之設計與自動化，透過機構設計將探針座加裝步進馬達後自動化，並以雷射為迴授感測器設計系統整體量測平台。控制端以LabVIEW程式將雷射感測器、XYZ三軸移動平台以及自動化之探針座整合於人機介面，並撰寫程式將晶圓位置識別及定位過程自動化。
由於一般晶圓量測大多採用固定式探針卡，優點為對位容易且準確。但對於少量多樣生產且亦需要量測的晶圓，會因為同一晶圓元件結構的不同，在量測時受限於探針卡固定的排列方式。另一種量測方法則是採用手動控制探針座並用視覺輔助進行量測，但此量測方法十分依賴人為操作，因此缺乏穩定性與重複性。
為了解決上述問題，本研究將探針座自動化並與系統整合，有別於前述晶圓量測受限於探針卡的位置排列或大量依賴人為操作。本研究之機台提供了較靈活且穩定的量測方式，首先以雷射感測器掃描晶圓上設計之標記點，藉以找出晶圓中心位置，並於確認位置後，以雷射回授位置資訊，以利馬達控制探針座之定位，達到量測的目標，最後根據座標換算推估出待測物的位置，輔助探針完成碰觸目標測量電性之任務。

The research is based on designing and automation of the Wafer-Probing system. By assembling stepper motor, prober, 3-axis stage and using the laser sensor as feedback. The system integrated and controlled all the component through LabVIEW interface and being able to achieve the wafer position identification and run the automatic probing process at the same time.

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