紅外線感測器之應用範圍相當廣泛，無論是國防相關的飛彈導引裝置，商業相關的建築物老化偵測，甚至於民生相關的醫療診斷系統皆有其應用。而使用微機電技術所製造之紅外線感測器不僅價格便宜、體積小易用於系統組裝且性能佳，由於這些優點使得熱型的感測器漸漸取代量子型感測器，成為紅外線感測器研究的主要趨勢；而在四種主要的熱型感測器中，又以熱電式紅外線感測器最具研究潛力。
因此，本論文提出一利用微機電技術所製造之新型熱電式紅外線感測器，藉由熱電偶懸浮結構隱藏於紅外線吸收薄膜下方的設計方式，製作高填置率、高響應度及低雜訊等效溫差的紅外線感測器。另外，針對熱電偶材料選擇及結構設計部份做相關公式的計算模擬，希望藉由理論分析找出一組較具代表性之感測器性能規格。同時，利用CoventorWare微機電模擬軟體進行感測器暫態熱傳模擬以用於理論計算之比較及等效電路的類比行為。本文並以PSpice電路模擬軟體自行設計感測器後段的訊號處理電路，藉由實驗測試的方法驗證電路的可行性。並使用LabVIEW顯示系統進行電壓輸入轉色階變化的功能，以描繪出待測熱源的溫度輪廓。最後以代工下線的TSMC 0.35 μm 2P4M CMOS 標準製程將感測器元件實現出來，並建立出熱源感測的實驗量測系統以達到紅外線感測的最終目的。

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