本研究旨在利用溶膠-凝膠法製備環氧樹脂與二氧化鈦奈米複合材料。經由配方組成變化及製程條件控制，複合材料可融合有機材料之韌性及加工性和無機材料之耐熱性及強度。並藉由反應生成的TiO2，提升複合材料的熱傳導性、降低其熱膨脹係數、提高材料的折射率，並探討作為LED封裝應用之可行性。
首先將環氧樹脂以適當的偶合劑進行接枝改質，使環氧樹脂具有帶反應性矽氧烷之側鏈，增加環氧樹脂與二氧化鈦的介面接著力。再將改質後的環氧樹脂與Titanium(IV) isopropoxide (TIP)經溶膠-凝膠法在室溫下進行水解縮合反應形成Epoxy/TiO2複合材料。最後加入硬化劑及促進劑進行硬化，並以DSC、TGA、及TMA分析材料的熱性質及熱膨脹係數；以熱傳導分析儀分析材料的熱傳係數；以UV-VIS光譜儀、橢圓儀進行材料光學特性分析；以SEM進行型態學分析。
研究結果顯示，環氧樹脂與IPTES接枝改質成功，且於酸性環境下，改質環氧樹脂可與TIP進行溶膠-凝膠反應生成Si-O-Ti鍵結，其矽氧烷鍵結以T2型取代鍵結為主，且生成之粒子粒徑小於100nm並均勻分散於複合材料中。在硬化物之物性分析上，Epoxy/TiO2複合材料的玻璃轉移溫度會比純環氧樹脂稍低。隨著TIP添加比例的增加，熱裂解溫度會些微下降，而焦碳殘餘量則持續增加，以添加5wt%的TIP擁有較好的耐熱性質。熱膨脹係數則隨著TIP添加量的增加而降低，顯示加入無機物後，可有效降低有機材料的熱膨脹係數。當TIP添加量增加至20wt%時，可得最高的熱傳係數以及折射率，然而在光穿透度上，隨著TIP添加比例的增加，短波長的光穿透度也隨之下降；另外，隨著封裝材料厚度的增加，整體的光穿透度也會漸漸下降。因此，整體來看，本研究所製備的Epoxy/TiO2奈米複合材料，將僅能應用於綠光及紅光LED封裝上。

1.錢國基, 產業經濟, 1998, 第201期, 105
2.賴宏仁, 工業材料, 1998, 第153期, 94
3.M. Chaturvedi, Y. L. Shen, Acta materialia, 1998, 46, 4287
4.謝添壽, 工業材料, 2003, 第193期, 153
5.Y. L. Liu, Y. L. Lin, C. P. Chen, R. J. Jeng, J. Appl. Polym. Sci., 2003, 90, 4047
6.X. Huang, S. Lewis, W. J. Brittain, R. A. Vaia, Macromolecules, 2000, 33, 2000
7.L. Tie, D. K. Padmananda, J. P. Thomas, Chemistry of Materials, 1995, 7, 2144
8.L. Tie, D. K. Padmananda, J. P. Thomas, Chemistry of Materials, 1994, 6, 573
9.史光國, “半導體發光二極體及固體照明”, 2005
10.J. C. Seferis, Polymer Handbook, 3rd ed.; Brandrup J., Immergut E.H., Eds; Wiley-Interscience: New York, 1980, 451
11.D. W. VanKrevelen, Properties of Polymers, 4th ed.; Elsevier: New York, 1997, Ch 10, 287
12.T. Matsuda, J. Appl. Polym. Sci., 2000, 76, 50
13.H. Dislich, Angew. Chem. Int. Ed. Engl., 1979, 18, 49
14.S.A. Jenekhe, C. J. Yang, Chem. Mater., 1994, 6, 196
15.M. Yoshida, J. Mater. Sci., 1997, 32, 4047
16.W. F. Su, H. K. Yuan, ACS Polymer Preprints, 2000, 41, 575
17.R. A. Gaudiana, H. G. Rogers, Macromolecules, 1985, 18, 1058
18.H. R. Allcock, M. Olshavsky, Macromolecules, 1995, 28, 6188
19.E. J. A. Pope, M. Asami, J. D. Mackenzie, J. Mater. Res., 1989, 4, 1018
20.G. L. Wilkes, B. Wang, J. C. Hedrick, S. C. Liptak, McGrath, J. E. Macromolecules, 1991, 24, 3449
21.R. M. Davis, V. J. Nagpal, S. B. Desu, J. Mater. Res., 1995, 10, 12, 3068
22.P. N. Prasad, M. Yoshida, Chem. Mater., 1996, 8, 235
23.W. C. Chen, S. J. Lee, L. H. Lee, J. L. Lin, J. Mater. Chem., 1999, 9, 2999
24.W. C. Chen, L.H. Lee, Chem. Mater., 2001, 13, 1137
25.U. W. Suter, T. Kyprianidou-Leodidou, W. Caseri, J. Phys. Chem., 1994, 98, 8992
26.U. W. Suter, T. Kyprianidou-Leodidou, W. Caseri, J. Mater. Res., 1997, 12, 2198
27.R. A. Gaudiana, R. A. Minns, J. Macromol. Sci.-Chem., 1991, A28, 831
28.R. A. Minns, R. A. Gaudiana, J. Macromol. Sci.-Pure Appl. Chem., 1992, A29, 19
29.H. R. Allcock, M. Olshavsky, Macromolecules, 1997, 30, 4179
30.S. Kohmoto, T. Okubo, M. Yamamoto, J. Macromol. Sci.-Pure Appl. Chem., 1998, A35, 1819
31.蕭世明, “含磷/氮難燃高分子之製備與熱穩定性質”, 國立中興大學碩士論文, 2001
32.K. Matsukawa, K. Hasegawa, J. Polym. Sci. Pol. Chem., 1992, 30, 2045
33.S. S. Lee, S. C. Kim, J. Appl. Polym. Sci., 1998, 69, 1291
34.陳凱琪, 黃淑禎, 李巡天, 工業材料, 2002, 第187期, 112
35.馬振基, 張文吉, 塑膠資訊, 2002, 第67期, 45
36.A. Okada, A. Usuki, Materials Science and Engineering:C, 1992, 3, 109
37.W. Jia, E. Segal, D. Kornemandel, Y. Lamhot, M. Narkis, A. Siegmann, Synthetic Metals, 2002, 128, 115
38.D. R. Yei, S. W. Kuo, Y. C. Su, F. C. Chang, Polymer, 2004, 45, 2633
39.K. M. Kim, K. Adachi, Y. Chujo, Polymer, 2002, 43, 1171
40.Z. Ahmad, M. I. Sarwar, S. Wang, J. E. Mark, Polymer, 1997, 38, 4523
41.M. I. Sarwar, Z. Ahmad, European Polymer Journal, 2000, 36, 89
42.J. J. W. M. Rosink, M. A. Blauw, L. J. Geerligs, E. Van der Drift, B. A. C. Rousseeuw, S. Radelaar, Optical Materials, 1998, 9, 416
43.S. Trohalaki, Polymer, 1996, 37, 1841
44.G. Parker, M. Hara, Polymer, 1997, 38, 2701
45.F. K. Liu, S. Y. Hsieh, F. H. Ko, T. C. Chu, Colloids and Surfaces A：Physicochemical and Engineering Aspect, 2003, 231, 31
46.P. Lijia, C. Dazhu, H. Pingsheng, Z. Xiao, W. Lvqian, Materials Research Bulletin, 2004, 39, 243
47.A. Stanculescu, L. Tugulea, H. V. Alexandru, F. Stanculescu, M. Socol, J. Crystal Growth, 2005, 275, 1779
48.廖建勳, 工業材料, 1997, 第125期, 110
49.J. Zarzycki, J. Sol-Gel Sci. Tech., 1997, 8, 17
50.R. Reisfeld, C. K. Jorgensen, “Chemistry Spectroscopy and Applications of Sol-Gel Glasses”, Springer-Verlag, Berlin, 1992
51.B. Jirensons et.al, Colloid, Chemistry, New York Co. 1962
52.J. D. Mackenzie in Hybrid Organic-Inorganic Composites, edited by J.E. Mark, C. Y-C Lee, P.A. Bianconi (Maple Press, New York, 1995),p226
53.J. Wen, G. L. Wiles, Chem. Mater., 1996, 8, 1667
54.C. J. Brinker, G. W. Scherer, Sol-Gel-Science Chap3, 1990
55.I. Matsuyama, S. Satoh, M. Katsumoto and K. Susa, J. Non-Cryst. Solids, 1991, 135, 22
56.Y. Hu, Y. J. Chung, J. D. Mackenzie, J. Mater. Sci., 1993, 28, 6549
57.R. Aelion, Loebel, and F. Eirich, J. Am. Chem. Soc., 1905, 72, 5705
58.E. R. Pohl and F. D. Osterholtz in Molecular Characterization of Composite Interfaces, eds. H. Ishida and G. Kumar (Plenum, New York, 1985),p157
59.Z. Ahmad, M. I. Sarwar, J. E. Mark and S. Wang, Polymer, 1997, 17, 4523
60.W. Chian and D. C. Timm, Macromolecules, 2004, 37, 8098
61.George Socrates, “Infrared and Raman Characteristic Group Frequencies”, John Wiley & Sons, LTD, 2001, 323
62.L. Kellberg, P. Zeuthen, H. J. Jakobsen, J. Catalysis, 1993, 143, 45
63.D. W. Sindorf and G. E. Maciel, J. Am. Chem. Soc., 1983, 105, 3767
64.邱顯烈, “以溶膠-凝膠法製備Epoxy/SiO2奈米複合材及其在高透光性光電元件封裝之應用研究”, 國立成功大學碩士論文, 2005
65.游晶瑩, 昝世蓉, 工業材料, 2006, 第237期, 99
66.陳智禮, 楊鈞杰, 工業材料, 2006, 第231期, 139
67.黃振東, 工業材料, 2006, 第231期, 70
68.田運宜, 工業材料, 2006, 第229期, 85