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研究生: 黃柏文
Huang,Bo Wen
論文名稱: ClAlPc分子在金(111)上的沉積速率和照射光強度變化之研究
Study of deposition-rate and irradiation-flux dependence of ClAlPc on Au(111)
指導教授: 唐述中
Tang,Shu Jung
口試委員: 鄭弘泰
Jeng, Horng Tay
鄭澄懋
Jeng, Cheng Maw
學位類別: 碩士
Master
系所名稱: 理學院 - 物理學系
Department of Physics
論文出版年: 2016
畢業學年度: 105
語文別: 中文
論文頁數: 46
中文關鍵詞: 氯鋁酞菁分子
外文關鍵詞: ClAlPc
相關次數: 點閱:2下載:0
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  • 藉由角解析光電子能譜研究ClAlPc分子在金(111)上的沉積速率和照射光強度變化。本篇論文揭示在金(111)上的ClAlPc分子因沉積速率的不同導致不同的吸附結構。在每分鐘0.02 Å的慢速率情況,主要是氯向下結構但在快速率每分鐘0.2 Å的情形下則是氯向上和氯向下共存。我們進一步研究在上述兩種條件下,曝光和退火在樣品上產生的效應。在慢速率沉積情形,主要氯向下結構較脆弱,在弱光(2.1X10^15 photons/sec)照射下氯向下分子傾倒,在強光(6.4X10^15 photons/sec)照射下氯向下分子脫離,根據分子軌域電子態改變,金的表面態,和真空能階得知。而退火後的結果也顯示類似行為。然而在快速率沉積情形下做退火和曝光處理,氯向下和氯向上共存的結構都非常穩定。


    The deposition-rate and irradiation-flux dependence of ClAlPc adsorbed on the Au(111) crystal was investigated by the angular-resolved photoelectron spectroscopy (ARPES). This thesis reveals that different depositing rates of ClAlPc on Au(111) crystal surface result in different adsorption configurations of ClAlPc; at the slow rate of 0.02 Å/min, Cl-down configuration dominates but at the fast rate of 0.2 Å/min Cl-down and Cl-up configurations coexist. We further studied irradiation-exposure and post-annealing effects on the samples under these two conditions. For the case of slow deposition, the dominant Cl-down configuration is vulnerable to the irradiation; the Cl-down molecules are inclined by the radiation of low flux, 2.1X10^15 photons/sec, and desorbed by the radiation of high flux, 6.4X10^15 photons/sec, according to the change of molecular orbital states, the Au surface state, and vacuum level. Post-annealing effects also imply similar behaviors. However for the case of fast deposition, the coexistent configurations are very robust to both irradiation-exposure and post-annealing effects.

    1.緒論-------------------------1 2.基礎原理 2.1光電子能譜 2.1.1簡介--------------------2 2.1.2 光電效應理論模型---------3 2.1.3 角解析光電子能譜---------7 2.2 有機分子的電子結構----------9 2.3 有機分子的介面電子結構------10 2.4 有機材料簡介----------------14 3.實驗儀器與原理 3.1實驗環境-超高真空系統---------------------------16 3.1.1 各幫浦的簡介和工作範圍說明-------------------17 3.1.2 烘烤(Bake Out)-----------------------------19 3.1.3 除氣(Degas) -------------------------------19 3.2 殘餘氣體分析儀(Residual Gas Analyzers)---------20 3.3 熱陰極真空計(Hot-cathode ionization gauge)-----21 3.4 離子濺射槍(Sputter gun)------------------------21 3.5 蒸鍍槍(Knudsen cell----------------------------22 3.6 電子能量分析儀----------------------------------23 3.7 同步輻射光源------------------------------------26 4.有機材料(ClAlPc)成長面與功函數分析 4.1 清潔金(111)表面--------------------------------28 4.2 成長有機薄膜(ClAlPc)---------------------------28 4.3 功函數的分析-----------------------------------29 5.實驗結果討論 5.1 不同沉積速率-----------------------------------33 5.2不同沉積速率之退火處理---------------------------35 5.2.1 退火處理之真空能階變化-----------------------38 5.3不同沉積速率之照光變化---------------------------39 5.3.1 快速率之照光變化----------------------------39 5.3.2慢速率之照光變化-----------------------------41 5.3.3慢速率照光之真空能階變化----------------------42 6.結論---------------------------------------------44 參考文獻-------------------------------------------45

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