研究生: |
羅介聰 Chieh-Tsung Lo |
---|---|
論文名稱: |
混鍊程序對於導電膠導電性質的影響 Effect of Mixing Process on the Electrical Properties of Conductive Adhesives |
指導教授: |
周更生
Kan-Sen Chou |
口試委員: | |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 化學工程學系 Department of Chemical Engineering |
論文出版年: | 2000 |
畢業學年度: | 88 |
語文別: | 中文 |
論文頁數: | 80 |
中文關鍵詞: | 導電膠 、銀粉 、混鍊程序 、環氧樹脂 、亞克力樹脂 、臨界薄膜厚度 |
外文關鍵詞: | conductive adhesives, silver, mixing process, epoxy resin, acrylic resin, critical film thickness |
相關次數: | 點閱:3 下載:0 |
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本研究探討了三滾筒混鍊機之混鍊程序,對於摻銀導電膠電性的影響。研究中以測量表觀臨界體積分率(apparent critical volume fraction)來判斷最佳的混鍊條件,其目的是為了尋求較佳的混鍊程序,以製成低導電粒子填充率的導電膠。研究結果顯示三滾筒混鍊或加熱混鍊為較佳的混鍊程序,此結果代表了粒子在樹脂中的運動,尤其是軸向的擴散,為影響導電膠中粒子均勻分散的主因。研磨粒子效應在本實驗中亦有深入的探討。結果顯示在研磨粒子時添加少量的乙二醇,將有助於其在樹脂系統中之分散,確實降低表觀臨界體積分率達1.24vol%,此外,高形狀係數的鎳絲亦可使外觀臨界體積分率下降至2.29vol%。
導電機制研究方面,經由理論的分析,本系統之導電粒子間的相隔距離過大,電子躍遷機率極低,因此導電膠可能的導電機構應為導電粒子互相連接形成導電通路。在薄膜厚度研究上,我們模擬出不同組合之粒子添加量(Vc)與臨界薄膜厚度(或連通長度,t)間關係式 ,此關係式與文獻實驗值比較,具有高度的一致性。
The effect of mixing process using roll mills on electrical property of conductive adhesives filled with silver particles was investigated in this work. Evaluation of different mixing conditions was based on the measurement of apparent critical volume fractions of silver particles. Our objective was to find out the best mixing process in order to obtain conductive adhesives with the least amount of conducting particles. Our results indicated that the use of three-roll-mill or heating slightly during mixing produced better results. It suggested that a more uniform mixture was achieved by enhancing the movement of particles, especially along the axial direction. The effect of grinding particles was also studied. We found that the addition of a small amount of ethylene glycol helped the uniform dispersion of Ag particles in the resin system. As a result, the apparent critical volume fraction decreased to 1.24vol%. In addition, the apparent critical volume fraction could be further decreased to 2.29vol% when we used nickel filaments having high aspect ratio as conductive fillers.
In regards to the conduction mechanism, from the analysis of theory, the gap between conductive particles in our system was so large that the probability of electrons tunneling through the gap was extremely small. It was suggested that the conduction mechanism of conductive adhesives should be the particles, which connected to form conduction path. In the analysis of the effect of film thickness, we obtained the following equation to relate volume fraction of particles(Vc) with critical film thickness(or coherence length, t). This equation also demonstrated satisfactory correlation to the data from literature.
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