本研究以實驗為主，數值模擬為輔，互相驗證，實驗方法採用穿透式光彈法及散射光彈法兩種光彈方法，數值模擬則採應用廣泛之ANSYS有限元素分析軟體，共同探討雙層材料結構受到熱負載時之熱應力分佈情形。首先以穿透式光彈法探討雙層材料結構熱應力分佈之情形，接著首度引用散射式光彈法針對不含缺陷及含不同位置圓孔缺陷之雙層材料試片之熱應力分佈進行探討，以雷射光切片對含圓孔缺陷之PLM-4B光彈材料試片在不同厚度位置照射以得到表層、次表層及中間層之暫態熱應力條紋，而求得次主應力差值。實驗數據之結果並與ANSYS之結果互相比較。由於實驗本身的限制而無法求得之暫態介面應力及圓孔邊應力則藉由ANSYS求得。

ABSTRACT

This dissertation focused on conducting two types of photoelastic experiments, the transmitted-light photoelastic method and the scattered-light photoelastic method, and then validating the experimental results through a finite element package ANSYS to investigate the thermal stress distribution of bimaterial structures under thermal loading.

Initially, the transmitted-light photoelastic method was applied to examine the thermal stress distribution of bimaterial structures. In addition, the scattered-light photoelastic method was first employed to study the thermal stress distribution of bimaterial structures with or without defect at different locations. Through changing the incident locations of the optical slice on the PLM-4B photoelastic material with and without defects of circular hole, the value of secondary principal stress difference (SPSD) can be obtained at the top surface, sub-surface and the middle surface of the specimen. Simultaneously, the experimental results were compared with the ANSYS simulated results. Due to the limitation of the experiments, the transient state for the interfacial stresses of the bimaterial structure and the stresses at the vicinity of the circular hole were calculated by ANSYS.

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