富鎳鈦鎳記憶合金中R相雙向形狀記憶效應之研究

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研究生：	吳宗翰
論文名稱：	富鎳鈦鎳記憶合金中R相雙向形狀記憶效應之研究
指導教授：	胡塵滌
口試委員:	吳錫侃楊聰仁胡塵滌
學位類別：	碩士 Master
系所名稱：	工學院 - 材料科學工程學系 Materials Science and Engineering
論文出版年：	2014
畢業學年度：	102
語文別：	中文
論文頁數：	90
中文關鍵詞：	富鎳鈦鎳記憶合金、R相、雙向形狀記憶效應、拘束時效、全方位形狀記憶效應
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針對富鎳(50.74％Ni)的鈦鎳記憶合金，本論文討論合金中R相的雙向形狀記憶效應。研究主要分為三部分，第一部分探討試片經673K不同時間時效處理後之基本性質改變，經不同時效處理，母相產生不同狀態Ti3Ni4，析出物，週圍造成不同應力場，基地中的鎳含量亦改變，使試片相變態溫度變化，並造成相變態過程中出現R相，成為B2RB19‘之二階段相變態。
第二部分將673K/72ks時效處理後之試片於R相溫度做拘束處理，可觀察到R (273K)與B19‘ (77K)之間具有雙向形狀記憶效應。將試片在R相溫度做循序漸進的數次縮小尺寸拘束處理，隨著拘束環尺寸的縮小，試片在R、B19‘兩相之形狀會越來越彎曲，雙向形狀記憶效應會越來越強。XRD分析發現，673K/72ks時效處理後試片有明顯的R(011)與R(1 ̅01)兩根R相繞射峰，經過R相溫度拘束處理，傾向為R(1 ̅01)織構變強，推測織構之改變可能是使其在R(273K) B19’(77K)變化具有雙向形狀記憶效應之原因。若將試片浸於373K沸水，使試片到B2母相再降溫到298K，則會打亂R相的排列，雙向形狀記憶效應消失。
第三部分先將試片進行673K拘束時效，試片內部產生排列的Ti3Ni4析出物，試片本身會具有全方位形狀記憶效應，再將試片於R相溫度做拘束處理，探討析出物排列與R相溫度拘束處理兩者加成後對形狀記憶之效應。並討論在R相溫度使用反向拘束處理(試片彎曲方向與673K拘束時效時相反)的記憶效應。

目錄
摘要    3
第一章 緒論    7
前言    7
研究目的    8
第2章 文獻回顧    9
2-1 形狀記憶特性    9
2-1-1 形狀記憶效應    10
2-1-2 擬(超)彈性    15
2-2 鈦鎳形狀記憶合金之文獻回顧    18
2-3 R-phase 之文獻回顧    19
2-4 鈦鎳合金析出物之文獻回顧    21
第3章 實驗方法與儀器    24
3-1 實驗流程    24
3-1 試片製備    25
3-2 成分分析    25
3-3 顯微結構觀察    25
3-3-1 光學顯微觀察 (OM)    25
3-3-2 掃描式電子顯微鏡觀察 (SEM)    25
3-4 X-Ray 繞射分析    26
3-5 雙向形狀記憶效應 (TWSME) 測試    26
3-6 熱示差掃描卡量計測量 (DSC)    28

 
第4章 結果與討論    30
4-1 第一部分673K不同時間時效後基本性質    30
4-1-1 試片代號    30
4-1-2 DSC量測    30
4-1-3 XRD量測    37
4-1-4 金相    40
4-2 第二部分673K時效後，R相拘束處理    42
4-2-1 試片代號    42
4-2-2 形狀記憶效應    42
4-2-3 判斷是否R相穩定化造成雙向形狀記憶效應    45
4-2-4 XRD量測    47
4-3 第三部分673K拘束時效中試片厚度對記憶效應之影響    52
4-4 第三部分673K拘束時效後，R相溫度拘束處理    55
4-4-1 試片代號    55
4-4-2 R相溫度反向拘束處理    55
4-4-3 R相溫度第一次正向拘束處理與後續作反向拘束處理    58
4-4-4 XRD量測    60
4-4-5 金相    64
第五章 結論    66
第六章 參考文獻    67
附錄1…………………………...…………...………...........………………………73
附錄2………………………………...………………………………….…….……76
附錄3………………………………………………………………….……………78
附錄4………………………………………………………………….……………80
附錄5………………………………………………………………….……………86
附錄6…………………………………………………………………….…………89
 
表目錄
表 3 1 不同試片厚度，相同表面應變量    27
表 3 2 相同試片厚度，不同表面應變量    27
表 4 1 成份分析之結果    30
表 4 2 673K時效試片之各相變態溫度(K)    32
表 4 3 673K時效試片之各相變化熱焓值(J/g)    32
表 4 4 673K時效，相同表面應變量、不同試片厚度，試片外觀隨溫度變化圖    53

 
圖目錄
圖 2 1 CuAlNi合金熱彈性麻田散相，隨溫度升高或降低之顯微結構照片[15]    10
圖 2 2 形狀記憶效應示意圖    12
圖 2 3 單向形狀記憶效應與雙相形狀記憶效應示意圖    13
圖 2 4 全方位形狀記憶效應示意圖    13
圖 2 5 應變-溫度曲線，外加應力102MPa    14
圖 2 6 外加應力與變態溫度關係    14
圖 2 7 擬彈性效應拉伸曲線示意圖    16
圖 2 8 TiNi形狀記憶合金之應力-應變-溫度關係圖[24]    17
圖 2 9 形狀記憶效應與超彈性存在區域示意圖    17
圖 2 10 TiNi二元平衡相圖[38]    19
圖 2 11 (a)B2母相單位晶格延 <111> 方向膨脹變形為(b) R相單位晶格    21
圖 2 12 Ti3Ni4在母相析出造成的晶格扭曲    23
圖 3 1 Shimadzu XRD-6000繞射儀    26
圖 3 2 不同半徑之拘束環    28
圖 3 3 試片曲率半徑計算方式示意圖    28
圖 3 4 DSC200F3熱示差掃描卡量計    29
圖 3 5 典型的麻田散相變化之DSC曲線圖形    29
圖 4 1  1073/1.8ks剛完成退火步驟試片之DSC圖    32
圖 4 2試片673K時效之DSC圖    35
圖 4 3相變態溫度Rs、Rf時效趨勢圖    36
圖 4 4相變態熱焓值ΔHΔB2->R、ΔHR->B2時效趨勢圖    36
圖 4 5 1073/1.8ks剛完成退火步驟試片之XRD分析圖    37
圖 4 6 673K時效不同時間，XRD分析圖    39
圖 4 7半高寬與時效時間趨勢圖    39
圖 4 8 P673K/3.6ks (a)OM (b)SEM    41
圖 4 9 P673K/72ks (a)OM (b)SEM    41
圖 4 10 P673K/144ks (a)OM (b)SEM    41
圖 4 11 P673K/216ks (a)OM (b)SEM    41
圖 4 12 673/72ks-C298/86.4ks試片， 形狀記憶量測經過373K、273K與77K三個溫度    43
圖 4 13 673K時效72ks後，298K R相溫度作各種拘束 273K、77K形狀變化趨勢圖    44
圖 4 14 673K時效72ks後，298K R相溫度作各種拘束273K、77K形狀變化圖    44
圖 4 15 內徑5.75mm之拘束環    46
圖 4 16 673K時效72ks，R相拘束不同時間，時效趨勢圖    46
圖 4 17 673K時效72ks XRD分析圖    48
圖 4 18 673K時效72ks，298K R相溫度作各種拘束，XRD分析圖    50
圖 4 19 673K時效72ks，298K R相溫度作各種拘束， XRD分析比較圖    51
圖 4 20形狀變化率差值，兩不同厚度試片之時效趨勢圖    54
圖 4 21 673K拘束時效72ks後，298K R相溫度作各種反向拘束    57
圖 4 22 673K拘束時效72ks後，298K R相溫度作各種反向拘束    57
圖 4 23  673K拘束時效72ks後，298K R相溫度先正向拘束與後續各反向拘束，273K、77K形狀變化趨勢圖    59
圖 4 24 673K拘束時效72ks後，298K R相溫度先正向拘束與後續各反向拘束，273K、77K形狀變化圖    59
圖 4 25 673K拘束時效72ks，XRD分析圖    61
圖 4 26 673K拘束時效72ks，R相溫度各種不同反向拘束，XRD分析圖    62
圖 4 27 673K拘束時效72ks，R相溫度各種不同正向拘束，XRD分析圖    63
圖 4 28 673K拘束時效72ks，R相溫度各種不同拘束，XRD分析比較圖    63
圖 4 29 PC673K/3.6ks (side view) (a)OM (b)SEM    65
圖 4 30 PC673K/72ks (side view) (a)OM (b)SEM    65
圖 4 31 PC673K/144ks (side view) (a)OM (b)SEM    65
圖 4 32 PC673K/216ks (side view) (a)OM (b)SEM    65
圖 4 33 B19’相關文獻之XRD 分析圖    91


                                

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