研究生: |
梁紘輔 Liang, Hong-Fu |
---|---|
論文名稱: |
細流道填充過程之熱傳研究 Heat Transfer in the Filling Process inside a Small Channel |
指導教授: |
李雄略
Lee, Shong-Leih |
口試委員: |
陳志臣
Chen, Jyh-Chen 傅武雄 Fu, Wu-Shung |
學位類別: |
碩士 Master |
系所名稱: |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
論文出版年: | 2017 |
畢業學年度: | 105 |
語文別: | 中文 |
論文頁數: | 41 |
中文關鍵詞: | 計算流體力學 、溫度場 、熱傳量 、自由液面 |
外文關鍵詞: | CFD, temperature field, heat transfer, free surface |
相關次數: | 點閱:3 下載:0 |
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本文將進行細流道填充過程的水平流場與溫度場計算,研究雷諾數、自由液面接觸角和毛細數對溫度場的影響。本研究採用最小平方法找出最接近自由液面的圓,並將此圓的半徑倒數當作此自由液面的曲率並除以毛細數當作此自由液面的壓力來計算流場。利用能量方程式來計算出溫度場,進而求解出平板的熱傳量分布情形。對於溫度場與熱傳量的影響以雷諾數影響最大,自由液面接觸角與毛細數對溫度場與上平板熱傳量幾乎沒有影響。同時熱傳量在靠近自由液面的部分會些微上升。
To study the change of Reynolds number , contact angle and Capillary number in mold-filling process, we simulating a Horizontal flow field and the temperature field. In this study, the least squares method is used to find the circle closest to the free surface, and the reciprocal of the radius of the circle is taken as the curvature of the free surface and divided by the capillary number as the pressure of the free surface to calculate the flow field. Using the energy equation to calculate the temperature field, and then solve the heat transfer distribution on the plate. The influence of temperature field and heat transfer has the greatest effect on Reynolds number, and the contact angle and capillary number have little effect on them. The heat transfer near the free surface will be slightly increased.
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