進行三維異質整合微系統晶片開發過程中，整體結構之可靠度分析是重要的一環。而建立可靠度之有限單元數值模擬，以了解幾何結構參數對可靠度之影響，並進一步改善晶片之壽命是為本文之目標。由於晶片中微機電元件結構複雜，模擬過程中通常會適度的簡化；模型的簡化是否對晶片分析結果造成影響則需進一步探討。
本文首先針對不同三維異質整合晶片全域模型進行熱應力分析及加速熱循環分析；藉由分析結果說明簡化模型之合理性，以大幅減少分析時間，並評估其可靠度。接著，將不同內含單一微機電元件晶片之模型進行可靠度分析；對微掃描面鏡之晶片，提出熱-結構交替分析流程方法，以評估其於製程中所導致之熱預應力對此晶片結構之影響；也討論微型陀螺儀晶片模型簡化之合理性。並以上述分析結果為基礎，將簡化後微型陀螺儀晶片模型之封裝結構進行設計，討論改善晶片可靠度之可行性及提出封裝方面之建議。再以田口法進行最佳化設計分析，了解幾何結構參數對晶片可靠度之影響外，並得到最佳幾何參數組合，可提升微機電元件晶片之可靠度。文中也提出微型陀螺儀晶片與微掃描面鏡晶片之三種製作流程，並比較各種流程之優缺點。最後，再將製作完成之微型陀螺儀晶片進行加速熱循環實驗與分析結果相互驗證。本文所得結果可提供內含穿晶片導線三維異質整合晶片研發之封裝結構設計與晶片製備之參考。

The reliability analysis of whole structure is an important part in the researching and developing process of 3D heterogeneous integration microsystem chip. And building the reliability of finite element analysis (FEA) simulation for figuring out the relationship between geometric paramaters and reliability; moreover, improving the life of chips are the purpose of this thesis. Generally, the finite element (FE) models are simplified appropriately in simulation process due to the complicated structure of MEMS (Micro Electronic Mechanical Systems) device in the chip; however, the simplified model whether affect the analysis results or not will need to be investigated.
The thermal stress analysis and thermal cycling analysis for different 3D heterogeneous integration microsystem chip FE models were investgated in this thesis; the results indicated properly simplify models to reduce the computational time is beneficial for reliability analysis. And the reliability analysis for different MEMS device chip FE models were investigated; the thermal-structure analysis alternately process was proposed to estimate the effect of thermal prestress for micromirror chip; the rationality of simplified microgyroscope chip model was also discussed. Base on the results, the the packaging structure of simplified microgyroscope chip model was designed and the possibility of improving reliability and suggestions were proposed. Then the Taguchi Method was used to optimal design analysis for chip and the optimal combination of geometric parameters was captured. Finally, the analysis results were proved by thermal cycling test of microgyroscope chip. The results in this thesis can provide suggestions in packaging structure design for researching and developing 3D heterogeneous integration microsystem chip which was embedded through-silicon-via.

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