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研究生: 黃棋林
Huang, Chi-Lin
論文名稱: PN接面之矽微環形電光調變器製作
Fabrication of PN junction micro-ring electro-optic modulator
指導教授: 趙喣
Chao, Shiuh
口試委員: 陳永睿
黃遠東
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 光電工程研究所
Institute of Photonics Technologies
論文出版年: 2011
畢業學年度: 99
語文別: 中文
論文頁數: 144
中文關鍵詞: PN接面環形共振腔電光調變器
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  • 本論文將光電元件整合在矽基板上,在SOI基板上製作PN接面之矽微環形共振腔,利用偏壓使PN接面之矽微環形共振腔的載子濃度改變,利用自由載子色散效應達到調變光訊號的效果,並且將元件架構上將橫截面縮小,以提升其操作速度以及減少消耗功率。本論文中針對佈植模擬分析、水平PN接面結構製程、垂直PN接面結構製程,詳細的敘述其製程流程、電性量測,並對製程參數的選擇做詳細說明。元件製作使用國家奈米實驗室CMOS標準製程。根據電性量測結果推得元件操作速度可達20GHZ(理論值),在無阻抗匹配情況下,50%以上的功率可輸入至元件。


    第一章.緒論與簡介....................................................................................................... 1 1-1前言 ................................................................................................................. 1 1-2元件架構簡介 ................................................................................................. 3 第二章. 佈植濃度模擬分析......................................................................................... 4 2-1離子佈植製程參數模擬設計 ......................................................................... 4 2-2 P型濃度分析 .................................................................................................. 5 2-3 N型濃度分析 ................................................................................................. 7 2-3.1元素選取 .............................................................................................. 7 2-3.2 多次摻雜 ............................................................................................. 9 2-3.3脊形波導蝕刻與橫向穿透 ................................................................ 11 2-3.4光阻隔絕佈植之能力 ........................................................................ 13 2-4水平PN接面濃度分析 ................................................................................ 14 2-4.1 P型濃度分佈 ..................................................................................... 14 2-4.2 N型濃度分佈 .................................................................................... 14 2-4.3 P型重摻雜濃度分佈 ......................................................................... 17 2-4.4 N型重摻雜濃度分佈 ........................................................................ 18 2-5垂直PN接面濃度分析 ................................................................................ 20 第三章.水平PN接面製程與量測結果 ..................................................................... 22 3-1元件設計 ....................................................................................................... 22 3-2元件曝光介紹 ............................................................................................... 25 3-2.1曝光微影簡介 .................................................................................... 25 3-2.2光罩流程 ............................................................................................ 25 3-2.3光罩介紹 ............................................................................................ 26 3-3元件製作流程 ............................................................................................... 37 3-4電性量測 ....................................................................................................... 53 3-4.1 量測簡介 ........................................................................................... 53 3-4.2 IV量測 ............................................................................................... 55 3-4.3 CV量測 .............................................................................................. 59 3-5元件製作結果 ............................................................................................... 61 第四章.垂直PN接面製程與量測結果 ..................................................................... 64 4-1元件設計 ....................................................................................................... 64 4-2元件曝光介紹 ............................................................................................... 67 4-2.1曝光微影簡介 .................................................................................... 67 4-2.2 光罩流程 ........................................................................................... 67 4-2.3光罩介紹 ............................................................................................ 68 4-3元件製作流程 ............................................................................................... 79 II 4-4電性量測 ..................................................................................................... 100 4-4.1 量測簡介 ......................................................................................... 100 4-4.2 IV量測 ............................................................................................. 100 4-4.3 CV量測 ............................................................................................ 103 4-4.4高頻電性量測及分析 ...................................................................... 105 4-5元件製作結果 ............................................................................................. 108 4-5.1 FIB機台簡介 ................................................................................... 108 4-5.2 FIB觀測間隙區域 ........................................................................... 110 4-5.3 FIB觀測電極區域 ........................................................................... 113 第五章.結論與未來展望........................................................................................... 117 5-1 水平與垂直PN接面比較 ......................................................................... 117 5-2 改善曝光方式 ............................................................................................ 117 5-3 改善元件操作速度 .................................................................................... 119 附錄A. 水平PN接面之矽微環形電光調變器其製程流程表.............................. 120 附錄B.波導與共振腔之間隙 ................................................................................... 127 附錄C.垂直PN接面之矽微環形電光調變器其製程流程表 ................................ 129 附錄D. 垂直PN接面之矽微環形電光調變器高頻量測數據.............................. 136 參考文獻.................................................................................................................... 144

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