微機電系統(Micro-Electro-Mechanical system,MEMS)，指的是利用半導體製程為基礎，將之利用來製作微尺度機械動件且可與微電子整合的微型系統。在微機電元件中常常因為薄膜應力的影響使的元件產生非預期的形變而影響性能甚至於會使整體設計失效。因此如何精確的量測薄膜應力，一直是設計上一個重要的關鍵。
利用結構變形來量測殘餘應力的設計之中，結構的變形行為又分成「同平面式(in-plane)」和「出平面式(out-of-plane)」。「同平面式(in-plane)」的變形由於受限於量測設備精度不高的限制，因而影響推估的應力值。而殘餘張應力又難以使結構產生能以高精度量測的「出平面式」位移，本研究於是參考Guckel Ring的概念提出一新型的出平面式張應力測試鍵，並發展兩種適用於此測試鍵的分析方式，提供給不同需求的使用者，期能藉此得到更準確的殘餘張應力量測結果、並提供更多元的量測方式。

第六章 文獻回顧

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