由於紅外線感測器可廣泛應用於軍事、工業等用途上，故如何生產具有成本低、性能高的紅外線感測器近年來已逐漸獲得重視。此外適逢微機電系統之迅速發展，因此可藉由日益成熟的半導體製程技術將微結構整合於積體電路中以實現具有尺寸小、成本低、整合性佳與性能高之紅外線感測器。
本論文以台積電0.35um 2P4M Mixed Signal製程與Post-CMOS製程為基礎所設計之熱電式紅外線微感測器具有填充率高、感測面積小、電路整合性佳、系統性能高等優點。透過熱傳分析與熱、電等效原理將感測器結構類比成一簡單的等效電路模型，再經由幾何上的考量尋找到最佳的幾何設計尺寸，使得在小感測面積下系統仍具有較佳的響應度、歸一化偵測度與NETD值。為了驗證感測器之可行性，本研究使用CoventorWare從事數值模擬，分析結果顯示感測器響應度為432.15 V/W，NETD = 104.44 mK，時間常數為2.49 ms。最後再以標準CMOS製程為基礎將感測電路與微結構整合於同一晶片中，並建立量測系統以讀取晶片之熱輻射感測訊號。

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