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研究生： 李承穎
Lee, Cheng-Ying
論文名稱： 高導熱銀銅基鑽石複材/基板接合模組
High Thermal Conductive Diamond/Ag-Cu Composite and Substrate Joining Modules
指導教授： 林樹均
Lin, Su-Jien
口試委員: 李勝隆
洪健龍
張守一
學位類別： 碩士
Master
系所名稱： 工學院 - 材料科學工程學系
Materials Science and Engineering
論文出版年： 2018
畢業學年度： 106
語文別： 中文
論文頁數： 157
中文關鍵詞： 鑽石複材 、高導熱 、低熔點合金
外文關鍵詞： high thermal conductivity, composite, low melting point alloy
相關次數： 點閱：2  下載：0 
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    • 本實驗以銀銅作為基材，添加微量活性元素鈦改善鑽石與金屬基材的界面潤濕性，並以水平爐管進行無壓真空液相燒結製備銀銅基鑽石複合材料。改變燒結溫度與壓胚壓力參數，所得複材熱傳導值可達780 W/mK。經由添加銅鈦薄片於生胚上燒結，可使銀銅基鑽石複材表面粗糙度下降至1.9 m，適合做後續接合基板之用。
    與商用氮化鋁、矽、氧化鋁基板做接合，使用四種低熔點合金作為熱界面材料，包括：市售低熔點合金Ga78In14Sn8，以及自製三種鎵銦錫合金，其中自製合金熔點依序為80 C、100 C及120 C。在接合模組方面，氧化鋁、氮化鋁、矽基板分別使用自製熔點80 C、100 C、120 C之熱界面材料，其模組之熱傳導係數最佳分別可達223 W/m·K、432 W/m·K及405 W/m·K，相較於市售低熔點合金接合模組熱傳導值提升15-39%；在熱循環測試方面，自製熔點120 C之合金系統有最佳耐熱循環能力，其接合模組經1000次室溫至85 C熱循環後，三種基板仍能維持90%以上熱傳導值，而市售低熔點合金接合模組僅能維持約63-82% 熱傳導值；顯示自製之低熔點合金熱性質表現優於市售低熔點合金，在電子構裝應用上，此熱界面材料極具有商業潛力。

    Minor-addition of Ti was added into matrix to improve the wettability between diamonds and Ag-Cu matrix in this study. Pressureless liquid phase sintering process was adopted for the fabrication of diamond/Ag-Cu composites. The thermal conductivity optimum result is 780 W/mK, achieved by using 1020 C as sintering temperature. The surface roughness were reduced from 73 μm to below 2 μm by attaching Cu-Ti flake to the composites before sintering which reached the joining required smoothness.
    Using four different kinds of low melting point alloys: commercial Liquid Ultra Ga78In14Sn8, and three kinds of homemade as thermal interface materials (TIM) to join diamond composites with commercial substrates (aluminum nitride, silicon, sapphire). The melting point of these TIM are 11, 80, 100, and 120 C respectively.
    Optimization homemade TIM joining modules enhance 15-39% thermal conductivity comparing with commercial Liquid Ultra. In thermal cycle tests carried out from 25 °C to 85 °C with 1000 cycles, as the melting point of TIM increases, joining modules become more durable. The 120 °C TIM joining modules remained over 90% thermal conductivity after 1000 cycles. By contrast, commercial Liquid Ultra joining modules only remained 63-82 % thermal conductivity after 1000 cycles. Consequently, homemade TIM possesses highly commercial capacity.

    摘 要 I 目 錄 III 圖目錄 X 表目錄 X 壹、 前言 1 貳、 文獻回顧 3 2.1. 散熱材料的重要性 3 2.2. 散熱材料的發展 5 2.2.1. 傳統散熱材料 6 2.2.2. 先進散熱材料 7 2.3. 金屬基複合材料 10 2.3.1. 金屬基複合材料常見製程 10 2.3.2. 複合材料理論性質計算 15 2.3.3. 相關研究成果 16 2.4. 影響鑽石複材熱傳值因素 21 2.4.1. 鑽石與金屬基材的界面潤濕性 21 2.4.2. 鑽石粒徑與體積分率 24 2.4.3. 界面層厚度 25 2.4.4. 鑽石晶面差異 27 2.5. 熱循環測試 29 2.6. 熱界面材料 30 2.6.1. 熱界面材料的重要性 30 2.6.2. 熱界面材料的種類及特性 30 2.6.3. 相關研究成果 32 2.7. 常見電路基板 34 參、 實驗方法 36 3.1. 實驗設計與流程 36 3.1.1. 原料來源及其性質 36 3.1.2. 實驗設計與原理 38 3.1.3. 實驗規劃 39 3.2. 乾式混粉與冷壓成型 41 3.3. 水平爐管真空液相燒結 41 3.4. 基板接合 43 3.5. 低熔點合金之製作 44 3.6. 熱循環測試 44 3.7. 複合材料與接合封裝的性質分析 46 3.7.1. 緻密度量測 46 3.7.2. 熱傳導係數量測 47 3.7.3. 表面粗糙度量測 51 3.7.4. 微結構觀察 52 肆、 結果與討論 53 4.1. 接合前銀銅基鑽石複材性質 53 4.1.1. 不同燒結溫度對複材熱性質影響 54 4.1.2. 不同壓胚壓力對複材熱性質影響 55 4.1.3. 複材之耐熱循環能力 56 4.1.4. 鑽石銀銅基複材表面粗糙度與熱傳值誤差校正 58 4.2. 鑽石銀銅基複材表面平整化處理 61 4.2.1. 銀銅鈦薄片法 62 4.2.2. 銅鈦薄片法 64 4.3. 市售低熔點合金接合模組 67 4.3.1. 接合後之散熱模組熱性質 68 4.3.2. 高溫少週期及低溫多週期熱循環測試 71 4.4. 低熔點合金之熔點調整 73 4.4.1. 低熔點合金之選取 73 4.4.2. 低熔點合金接合模組 75 4.4.3. 低溫多週期熱循環測試 80 4.4.4. 高溫少週期熱循環測試 83 4.5. 銀銅片接合模組 89 4.5.1. 銀銅片之製作 89 4.5.2. 銀銅片與矽基板接合模組 93 4.5.3. 銀銅片與氧化鋁基板接合模組 116 4.5.4. 銀銅片與氮化鋁基板接合模組 128 4.5.5. 電子微探分析儀分析銀銅接面 141 4.5.6. 討論 145 伍、 結論 147 陸、 未來研究方向建議 149 柒、 參考文獻 150

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