本研究主要係改善超音波覆晶鍵合設備中之鍵合工具頭的非共平面現象，並利用有限元素法設計ㄧ只共振頻率為20kHz且相對應的共振模態為縱向模態的鍵合工具頭，此鍵合工具頭的鍵合端面具備良好的平面度以及極小的平面內位移量。其中在平面度方面利用雷射都卜勒測振儀量取鍵合端面的位移量，最大位移量與最小位移量相差0.138μm，比目前業界對於兩吋晶圓的平面度要求2μm更為良好，因此可使得晶圓鍵合的平整性更為提高，在AF-ESPI所量測的平面內位移結果顯示，本研究所設計的鍵合工具頭平面內位移極小，將不會造成工具頭與晶圓間於鍵合過程中產生滑動現象。

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