簡易檢索 / 詳目顯示

研究生: 林昆翰
Qwan-Han Lin
論文名稱: 多產品批間控制之穩定性與性能分析
Stability and Performance Analysis of Mixed Product Run-To-Run Control
指導教授: 鄭西顯
Shi-Shang Jang
口試委員:
學位類別: 碩士
Master
系所名稱: 工學院 - 化學工程學系
Department of Chemical Engineering
論文出版年: 2005
畢業學年度: 93
語文別: 中文
論文頁數: 80
中文關鍵詞: 批間控制多產品製程以機台為基礎的控制以產品為基礎的控制
外文關鍵詞: run-to-run control, high-mix process, tool-based control, product-based control
相關次數: 點閱:3下載:0
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報
  • 批間控制(run-to-run control,RtR control)現今已被廣泛使用於半導體產業,來降低製程的誤差,以達到最佳控制結果。大部分有關於批間控制方面的研究,都是針對單一機台上的單一種產品而言;然而在實際的工廠操作下,都是在單一機台上運行多種不同的產品。本篇論文將這種「少量多樣」的製程,稱為high-mix製程。本篇論文對上述產品生產情形,歸納出兩種不同的控制策略:
    1.每一批次生產的不同產品,可以經由EWMA(Exponent Weight Moving Average)控制器估算出製程干擾。此種控制方法,稱為「以機台為基礎的控制」(tool-based control)。
    2.分別考慮同一機台的不同產品,不同的產品有個別的控制器控制。此種控制方法,稱為「以產品為基礎的控制」(product-based control)

    本篇論文主要利用單一機台上兩個個別的產品製程,對兩種不同的控制策略進行數學上的理論推導及模擬控制結果。由最終的控制結果顯示,倘若使用tool-based control,在機台有非穩態(non-stationary)干擾及製程和產品模式彼此不協調時,其控制結果會發散。而使用product-based control,其控制結果不會發散,但是當機台有相當顯著的飄移時,控制結果較單一產品的控制為差。


    1.前言 ……………………………………………………………………1 2.原理……………………………………………………………………4 2.1 批間控制…………………………………………………………4 2.2 EWMA …………………………………………………………7 2.3 干擾模式 ……………………………………………………… 9 2.4 控制策略………………………………………………………11 2.4.1 tool-based 控制……………………………………… 11 2.4.2 product-based控制………………………………………12 3. 單一產品製程………………………………………………………14 3.1製程干擾為雜訊…………………………………………………15 3.2 製程干擾為IMA(1,1)……………………………………………16 4. 簡易規律性的雙產品製程 ……………………………………… 17 4.1 tool-based 控制………………………………………………17 4.1.1製程干擾為雜訊……………………………………………19 4.1.2製程干擾為IMA(1,1)………………………………………20 4.2 product-based 控制……………………………………………22 4.2.1製程干擾為雜訊……………………………………………23 4.1.2製程干擾為IMA(1,1)………………………………………24 5. 複雜規律性的雙產品製程 ……………………………………… 26 5.1 tool-based 控制………………………………………………27 5.1.1製程干擾為雜訊……………………………………………28 5.1.2製程干擾為IMA(1,1)………………………………………30 5.2 product-based 控制……………………………………………34 5.2.1製程干擾為雜訊……………………………………………35 5.1.2製程干擾為IMA(1,1)………………………………………36 6. 分析比較 ………………………………………………………… 39 7. 結論………………………………………………………………… 43 參考文獻………………………………………………………………44 附錄A………………………………………………………………46 附錄B………………………………………………………………47 附錄C………………………………………………………………48 附錄D………………………………………………………………50 附錄E………………………………………………………………52 附錄F………………………………………………………………53 附錄G………………………………………………………………55 附錄H………………………………………………………………56 附錄I………………………………………………………………57 附錄J………………………………………………………………58 附錄K………………………………………………………………61 附錄L………………………………………………………………64 附錄M………………………………………………………………67 附錄N………………………………………………………………71 附錄O………………………………………………………………72 附錄P………………………………………………………………73 附錄Q………………………………………………………………77 附錄R………………………………………………………………79

    [1] E.L. Cussler, and G..D. Moggridge, Chemical Product Design, Cambridge University Press, 2001

    [2] Seborg, D.E., T.F. Edgar, D.A. Mellichamp, Process Dynamics and Control, Wiley 2004

    [3] J. Moyne, Run-to-Run control in semiconductor manufacturing, CRC Press, Florida, 2001.

    [4] E.D. Castillo, Statistical process adjustment for quality control, John-Wiley and Sons, New York, 2002.

    [5] T.F. Edgar, S.W. Butler, W.J. Campbell, C. Pfeiffer, C. Bode, S.B. Hwang, K.S. Balakrishnan, J. Hahn, Automatic control in microelectronics manufacturing: Automatic control in microelectronics manufacturing: Practices, challenges, and possibilities, Automatics, 36 (2000) 1567-1603.

    [6] E.D. Castillo, J.Y. Yeh, An adaptive run-to-run optimizing controller for linear and nonlinear semiconductor processes, IEEE Trans. Semicond. Manuf., 11 (2) (1998) 285–295.

    [7] A. Chen, R.S. Guo, Age-based double EWMA controller and its application to CMP processes, IEEE Trans. Semicond. Manuf., 14 (1) (2001) 11–19.

    [8] J. Wang, Q.P. He, S.J. Qin, C.A. Bode, M.A. Purdy, Recursive least squares estimation for Run-to-Run control with metrology delay and its application to STI etch process, IEEE Trans. Semicond. Manuf., 18 (2) (2005) 309–319.

    [9] R. Telfeyan, J. Moyne, N. Chaudhry, J. Pugmire, S. Shellman, D. Boning, W. Moyne, A. Hurwitz, J. Taylor, A multi-level approach to the control of a chemical-mechanical planarization process, J. Vac. Sci. Technol. A, 14 (3) (1996) 1907–1913.

    [10] C.E. Chemali, J. Freudenberg, M. Hankinson, J.J. Bendik, Run-to-Run critical dimension and sidewall angle lithography control using the PROLITH simulator, IEEE Trans. Semicond. Manuf., 17 (3) (2004) 388–401.

    [11] N.S. Patel, G.A. Miller, C. Guinn, A. C. Sanchez, S. T. Jenkins, Device dependent control of chemical-mechanical polishing of dielectric films, IEEE Trans. Semicond. Manuf., 13 (3) (2000) 331–343.

    [12] F. Edgar, S.K. Firth, C. Bode, V. Martinenz, Multi-product Run-to-Run control for high-mix fabs, AEC/APC Asia, Hsinchu, Taiwan, 2004.

    [13] A. Toprac, Y. Wang, Solving the high-mix control problem, AEC/APC Asia, Hsinchu, Taiwan, 2004.

    [14] A. Ingolfsson, E. Sachs, Stability and sensitivity of an EWMA controller, J. Quality Technol., 25 (4) (1993) 271–287.

    [15] R. Good, S.J. Qin, Stability analysis of double EWMA run-to-run control with metrology delay, in Proc. Amer. Control Conf., Anchorage, AK, 2002, pp. 2156–2161.

    [16] S.T. Tseng, R.J. Chou, S.P. Lee, Statistical design of double EWMA controller, Appl. Stochastic Models Bus. Indust., 18 (3) (2002), 313–322.

    [17] S.T. Tseng, N.J. Hsu, Sample-Size determination for achieving asymptotic stability of a double EWMA control scheme, IEEE Trans. Semicond. Manuf., 18 (1) (2005), 104–111.

    無法下載圖示 全文公開日期 本全文未授權公開 (校內網路)
    全文公開日期 本全文未授權公開 (校外網路)

    QR CODE