微機電系統(Micro-Electro-Mechanical System，簡稱MEMS)是目前具有發展潛力的研究領域之一。早期MEMS的元件因為其採用半導體整合製程的因素，因此大多是在平面上的二維結構。在1992年微鉸鍊提出後，二維結構透過微鉸鏈的輔助可以翻轉立起在矽基板上而形成三維微結構，從此以後很多三維的微結構被設計並且製作出來。三維的光學微鏡面運用的範圍很廣，其能夠被整合成很多的微光學應用元件或系統，但是這些微鏡面在操作之前必須先將它翻轉立起，並加以固定在某一個角度。以前大多依賴一個操作者透過顯微鏡及微探針來達成這項工作，所以侷限了這個組裝過程必須在實驗室環境下才能完成，並不符合批次製造製程。因此如何將這些三維微鏡面在批次製造後一次翻轉立起在矽基板上便成為這些鏡面製程完成後的一個很重要的問題。
本文提出以垂直的靜電場來做三維微鏡面及結構的非接觸式組裝。利用摩擦生電所產生的電荷可以累積的特殊物理現象，將蓄存的電荷造成垂直靜電場來當作驅動源翻轉微鏡面離開矽基板。並且根據摩擦生電的理論和高斯定律，估測出所產生的電場及靜電吸引力大小的理論值。最後設計出一套完整的實驗，包含一些基本靜電學所需的物理裝置及用表面微加工所製作出來的三維微結構，用以驗證此方法的可行性以及其應用性，並與理論值做比較，可供未來組裝三維微鏡面及結構的參考。

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