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研究生: 何宗昇
論文名稱: 硼矽玻璃添加於銀膏中對束縛燒結應力的影響
Effects of glass additives on stress development during constrained sintering of Ag paste
指導教授: 簡朝和
口試委員:
學位類別: 碩士
Master
系所名稱: 工學院 - 材料科學工程學系
Materials Science and Engineering
論文出版年: 2004
畢業學年度: 92
語文別: 中文
論文頁數: 30
中文關鍵詞: 銀膏硼矽玻璃緻密化束縛燒結應力燒結驅動力黏滯流動
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  • 本研究主要目的在探討銀膏中添加硼矽玻璃在束縛燒結條件下,對緻密化及燒結應力的影響。實驗上以非等溫燒結方式透過雷射系統量測,在硼矽玻璃軟化前(710℃)對銀的燒結為束縛物的角色,這使得起始燒結溫度隨玻璃添加量增加而延緩;但在硼矽玻璃軟化後對銀燒結體的緻密化是隨玻璃增加而趨於緻密,若從晶粒成長隨密度變化分析知道,緻密度的提升主要是由於硼矽玻璃軟化後黏滯流動的結果。
    同樣藉由雷射系統量測,可得硼矽玻璃對銀在束縛燒結下所產生的平面應力是隨玻璃添加量增加而降低,在750℃時平面應力從純銀的1.5MPa降至含30vol%硼矽玻璃的0.4MPa。另外透過熱機械分析儀在週期性加壓的方式下可量得銀膏添加硼矽玻璃的單軸向黏度值,並推測其剪黏度及燒結驅動力。由剪黏度及燒結驅動力分析知,硼矽玻璃的軟化能有效地鬆弛燒結張應力的影響,使得燒結驅動力的作用能有機會大於束縛燒結張應力的影響,這將使得銀燒結體能在束縛燒結下達到緻密。


    1. 簡介 1 2. 實驗方法 2 2.1 膏體製備 2 2.2 刮刀製程 3 2.2.1 自由燒結試片 3 2.2.2 束縛燒結試片 3 2.2.3 應力量測試片 3 2.3 TMA量測試片 4 2.4脫脂除碳 4 2.5 燒結收縮曲線量測 4 2.5.1 自由燒結 4 2.5.2 束縛燒結 5 2.6 束縛燒結應力量測 5 2.7 單軸向黏度量測 6 2.8 微結構觀察 6 3. 結果與討論 7 3.1 硼矽玻璃添加對銀膏緻密化的影響 7 3.1.1自由燒結緻密曲線 7 3.1.2束縛燒結緻密曲線 8 3.2 硼矽玻璃添加對緻密機制的影響 9 3.2.1 燒結活化能分析 9 3.2.2 硼矽玻璃添加對晶粒成長的影響 12 3.3 硼矽玻璃添加對束縛燒結應力的影響 13 3.3.1 束縛燒結所衍生的平面應力 14 3.3.2 自由燒結驅動力 16 3.3.3 單軸向黏度量測 17 3.3.4 燒結平面應力與燒結驅動力之間關係 20 3.4 硼矽玻璃添加對流變行為的影響 25 4. 結論 26 5. 參考文獻 27

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