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研究生: 趙丞清
Chao, Cheng-Ching
論文名稱: CMOS三軸電容式觸覺感測陣列及光學近接感測器之開發
Development of CMOS three-axis capacitive tactile sensors and optical proximity sensors
指導教授: 盧向成
Lu, Shiang-Cheng
口試委員: 方維倫
Fang, Wei-Leun
鄭裕庭
Cheng, Yu-Ting
學位類別: 碩士
Master
系所名稱: 電機資訊學院 - 電子工程研究所
Institute of Electronics Engineering
論文出版年: 2025
畢業學年度: 113
語文別: 中文
論文頁數: 122
中文關鍵詞: 微機電CMOS三軸式電容式觸覺感測光近接感測類比電路感測器
外文關鍵詞: MEMS, CMOS, Tri-axial tactile, optical proximity, analog, sensor
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  • 本論文設計了一個4×4 CMOS三軸電容式觸覺感測陣列及光學近接感測結合讀取電路開發,使用TSMC 0.18 μm 1P6M製程製作,觸覺感測器使用金屬層作為結構上下極板,並且使用簡易的後製程步驟,有效降低成本以及晶片製作上的複雜度。光感測採用N-WELL/P-SUB的架構,設計上嵌入觸覺陣列中,提供近接感測(proximity sensing)之功能,觸覺感測感測單元大小為0.25 mm×0.25 mm,陣列數目為 4×4,近接感測單元大小為31.66 μm×23.5 μm,陣列數目為3×3。
    兩種機制搭配各自的感測電路感測訊號的變化,觸覺感測電路使用切換式電容電荷積分電路,搭配切換式時脈訊號產生器對積分電路進行充放電,以分辨x/y/z受力變化。近接感測則是透過APS (Active Pixel Sensor)的方式感測光電流變化,判斷物體的接近程度。
    在量測結果顯示,觸覺模態三軸感測靈敏度(Sensitivity)分別為z軸為317.21 %⁄mN,x軸為3.18 %⁄mN,y軸為3.06 %⁄mN,可量測的最小解析度(Resolution)分別為z軸為3.437 μN,x軸為0.34 mN,y軸為0.355 mN。電路雜訊124.97 〖μV〗_rms ; 近接感測部分的感測度為2170.251 V/cm/sec,最遠可以感測距離為11 cm,可量測的最小解析度(Resolution)為7.244×10^(-3) cm,電路雜訊〖496.94 μV〗_rms。


    This work designed and implemented a 4×4 three-axis capacitive tactile sensor array and an optical proximity sensor based on the TSMC 0.18 μm CMOS 1P6M process. The tactile sensor's structure used metal layers as the upper and lower electrode plates and employed simplified post-processing steps, effectively reducing costs and the complexity of chip fabrication. The optical detector used an N-WELL/P-SUB structure, integrated within the tactile sensor array design, providing proximity sensing functionality. The tactile sensor unit pixel size is 0.25 mm×0.25 mm arranged in a 4×4 array, while the proximity sensor unit pixel size is 31.66 μm×23.5 μm arranged in a 3×3 array.
    The two mechanisms were integrated with their sensing circuits to detect signal variations. The tactile sensing circuit employed a switched-capacitor charge integration circuit with a switch clock signal generator to charge and discharge the integration circuit, enabling the detection of x/y/z force variations. The proximity sensing circuit implemented the Active Pixel Sensor(APS) approach to detect photocurrent changes, determining the proximity level of objects.
    The measurement results demonstrated that the tactile sensing mode achieved three-axis sensitivity of 317.21 %/mN, 3.18 %/mN, and 3.06 %/mN for the z-, x-, and y-axis. The minimum measurable resolutions are 3.437 μN for the z-axis, 0.34 mN for the x-axis, and 0.355 mN for the y-axis, with the circuit noise level of 124.97 〖μV〗_rms. For the proximity sensing mode exhibited a sensitivity of 2170.251 V/cm/sec with a maximum detection distance of 11 cm and a minimum resolution of 7.244×10^(-3) cm, while exhibiting a circuit noise level of 〖496.94 μV〗_rms.

    摘要--------------------I Abstract---------------II 致謝-------------------III 目錄--------------------IV 圖目錄------------------VI 表目錄------------------X 第一章 緒論--------------1 1-1 前言-----------------1 1-2 文獻回顧--------------3 (a) 壓力感測----------4 (b) 近接感測----------7 (c) 近接感測以及壓力感測整合型雙模態感測器------------9 1-3 研究動機--------------12 第二章 感測器介紹與模擬分析-------------13 2-1 感測器整體系統架構-------------13 2-2 感測器工作原理------------15 2-2-1 電容觸覺感測結構設計------------15 2-2-2 光感測器基本原理架構與分析模擬------------22 2-3 結構模擬-----------25 2-3-1 共振模態模擬-------------26 2-3-2 結構電機構力模擬----------27 第三章 感測器電路設計與模擬------------31 3-1感測電路架構-------------32 3-1-1觸覺電容感測電路設計--------------32 3-1-2切換式時脈訊號產生器--------------36 3-1-3陣列選擇控制電路-------------42 3-1-4運算放大器電路設計與模擬-----------47 3-1-5取樣保持電路sample&hold-----------57 3-1-6 光學式近接感測電路設計------------58 3-2 感測電路模擬-------------60 3-2-1 觸覺電容感測器電路模擬------------60 3-2-2 光感測器電路模擬-----------63 第四章 晶片製作與實現-------------64 4-1 佈局考量-------------------64 4-2 後製程製作流程-------------67 4-3 電路板設計--------------76 第五章 量測結果與討論---------------78 5-1 量測儀器介紹----------------78 5-2 觸覺結構量測----------------80 5-2-1 微觀量測--------------80 5-2-2 振頻量測--------------82 5-2-3 結構彈簧量測-----------85 5-3 測試電路量測--------------87 5-4 觸覺感測量測--------------89 5-4-1 觸覺電路量測------------90 5-4-2 探針量測------------92 5-4-3 陣列量測------------98 5-5 光學近接感測電路量測--------------100 5-5-1 定量量測-------------102 5-5-2 動態量測-------------107 5-5-3 陣列量測-------------108 5-6 雜訊量測---------------110 第六章 結論與未來工作-------113 6-1 研究結果--------------113 6-2 未來工作--------------114 參考文獻--------------116

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