本研究針對微型熱電致冷器及其應用進行數值與實驗分析。數值研究部分，利用套裝軟體ANSYS對熱電致冷器材料及尺寸、接合面之接觸電阻等進行分析，結果顯示上述參數對微型熱電致冷器之性能皆有顯著影響。在實際應用部分，利用數值方法針對微型熱電致冷器散熱模組用於CPU之熱點移除進行分析，結果顯示傳統式微型熱電致冷器散熱模組對熱點移除無顯著作用，而使用mini-contact之微型熱電致冷器散熱模組可有效地將熱點移除，在進行數值分析時，假設接合面之接觸熱阻可忽略。實驗部分包括建立一具熱點之加熱台，及測試嵌入式mini-contact之微型熱電致冷器散熱模組對熱點移除之可行性。實驗結果顯示嵌入式mini-contact之微型熱電致冷器散熱模組未能有效將熱點移除，故利用ANSYS對熱電致冷器尺寸、接合面之接觸熱阻、mini-contact尺寸、晶片厚度等進行分析，探討實驗可行性方法。

[1] A. D. Kraus and A. Bar-Cohen, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Corporation, pp.435-466, 1983.
[2] Sheldon S. L. Chang, Energy Conversion, Prentice-Hall, Inc., Englewood Cliffs, N. J., pp.65-69, 1963.
[3] R. J. Buist, “Measurement of Thermoelectric Properties,” CRC Handbook of Thermoelectrics, pp. 143-155, 1995.
[4] K. H. Lee and O. J. Kim, “Analysis on the Cooling Performance of The Thermoelectric Micro-Cooler,” International Journal of Heat and Mass Transfer 50, pp.1982–1992, 2007.
[5] R. E. Simons, M. J. Ellsworth and R. C. Chu, “An Assessment of Module Cooling Enhancement With Thermoelectric Coolers,” Journal of Heat Transfer-Transactions of the ASME, Vol. 127, pp.76-84, Jaunary, 2005.
[6] K. Fukutani and A. Shakouri, ” Design of Bulk Thermoelectric Modules for Integrated Circuit Thermal Management,” IEEE Transastions on Components and Packaging Technologies, Vol. 29, No. 4, December, 2006.
[7] M. Gao and D. M. Rowe, “Improved Model for Calculating the Coefficient of Performance of a Peltier Module,” Energy Conversion & Management 41, pp. 163-171, 2000.
[8] V. Semenyuk, “Thermoelectric Micro Modules for Spot Cooling of High Density Heat Sources,” 20th International Conference on Thermoelectrics, pp. 391-396 ,2001.
[9] I. A. Drabkin, L. B. Yershova, D. A. Kondratiev and G. G. Gromov, “The Effect of the Substrates Two-Dimensional Temperature Distribution on the TEC Performance,” http://www.rmtltd.ru
[10] S. Ramanathan and G. M. Chrysler, “Solid-State Refrigeration for Cooling Microprocessors,” IEEE Transastions on Components and Packaging Technologies, Vol. 29, No. 1, March, 2006.
[11] R. E. Simons and R. C. Chu, “Application of Thermoelectric Cooling to Electronic Equipment: A Review and Analysis,” 16th IEEE SEMI-THERM symposium.
[12] D. G. Walker, K. D. Frampton and R.D. Harvey, “Distributed Control of Thermoelectric Coolers,” 2004 Inter Society Conference on Thermal Phenomena, pp. 361-366.
[13] B. Yang, P. Wang and A. Bar-Cohen, “Thermoelectric Mini-Contact Cooler For Hot-Spot Removal In High Power Devices,” 2006 Electronic Components and Technology Conference, pp. 997-1002.
[14] B. Yang, P. Wang and A. Bar-Cohen, “Mini-Contact Enhanced Thermoelectric Cooling of Hot Spots in High Power Devices,” IEEE Transastions on Components and Packaging Technologies, Vol. 30, No. 3, September, 2006.
[15] P. Wang, “On-Chip Thermoelectric Cooling of Semiconductor Hot Spot,” UM Theses and Dissertations, August, 2007.
[16] G. J. Snyder, M. Soto, R. Alley, D. Koester and B. Conner, “Hot Spot Cooling using Embedded Thermoelectric Coolers,” 22nd IEEE SEMI-THERM Symposium, pp. 135-143.
[17] E. E. Antonova and D. C. Looman, ” Finite Elements for Thermoelectric Device Analysis in ANSYS,” 2005 International Conference on Thermoelectrics, pp. 200-203.