為提升日常生活品質，大眾越發重視生活周遭的環境資訊，因此同時監測多種環境資訊之產品日漸蓬勃，並以實現感測器的整合與尺寸微縮為目標。現今環境感測市售產品多以 SiP 之形式整合，本研究利用TSMC 0.18 μm 1P6M CMOS標準製程優勢，與覆晶技術設計開發四種核心環境感測器，包括氣體、濕度、風速與溫度感測器，並透過自行操作後製程去將上述多種感測器整合在單一晶片，去實現環境感測系統晶片(System on Chip, SoC)。本研究包含元件設計、系統整合與製程相容優化三個面向：(1)元件:透過覆晶技術製作氣體感測器以解決在定義金屬氧化物ZnO-SnO2複合材料位置時之逸散問題；(2)元件:設計垂直整合具感測電極之濕度感測器與微加熱器，並將加熱器同時作為風速感測器，藉此縮小尺寸；(3)系統:藉雙面後製程移除背面矽基材與二氧化矽，使多晶矽層作為氣體感測器感測電極，並同時作為熱管理結構減少熱傳；(4)系統:單晶整合氣體、溫度、濕度與風速感測器，實現多功能環境系統晶片，尺寸縮小至2.2 mm × 2.2 mm (BME680: 3 mm × 3 mm，因採用多晶片封裝)。

In order to ensure the quality of life, modern society pays attention to various environmental information. Therefore, products that monitor various environmental information are booming, with the goal of sensor integration and size reduction. Commercial environmental sensing products nowadays are mostly integrated through packaging (SiP). This study demonstrates a monolithically integrated environmental sensing hub, including the MOS type gas sensor (G) with a microheater, diode thermometer (T), capacitive humidity sensor (H), and Hot wire anemometer (F) through standard TSMC 0.18 μm 1P6M CMOS process and in-house post-CMOS processes. Merits of the study include two perspectives, device design and system integration: The contributions of this research cover two aspects: component design and system integration: (1) Component: using flip-chip technology to solve the problem of dissipation when defining metal oxide composite materials for gas sensors. (2) Component: vertically integrate a humidity sensor with sensing electrodes and a micro-heater. The heater will be used as a flow sensor simultaneously, and the overall chip size can be reduced. (3) System: single crystal integrated gas, temperature, humidity and flow sensor, realizing a multi-functional environmental system on a single chip.

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