本文提出兩種具有繞折式彈簧之CMOS-MEMS電容式麥克風，利用繞折式彈簧設計使麥克風振膜之剛性得以降低，且使其運動更為接近理想的平行板接近感測模式，再搭配上較厚的結構層以及材料堆疊的選擇與配置來抑制殘餘應力所產生的翹曲，此外本研究亦引入陣列式麥克風設計進一步提升元件的感測性能。微麥克風的設計從其相關的理論分析著手，並利用電腦輔助軟體對元件之各項性能進行模擬設計。製造上採用TSMC T18 1P6M製程平台搭配實驗室後製程的方式完成元件。最後將對麥克風元件的機械薄膜與聲學特性進行量測、分析與討論。根據實驗量測之結果，此結構設計方式能成功地將麥克風實現於CMOS平台上，使用陣列式麥克風能大幅度的提升整體元件的感測靈敏度以及訊噪比，此外特殊的振膜結構配置對於單一麥克風元件之感測性能亦有一定程度的提升。

This study presents two different CMOS-MEMS microphone designs with serpentine spring structure. The serpentine spring structure not only can decrease the stiffness of diaphragm but also can change the diaphragm motion into piston-type movement to improve the microphone sensitivity. On the other hands, by using thick structure and material arrangement can help to resist the bending which caused by residual stress effect. Array type microphone design which can enhance device sensitivity also has be included in this work. In microphone design, computer-assisted software had been use to simulate the properties of micro-structure. The microphone had been implement by using TSMC 0.18μm 1P6M fabrication process, and in-house post-CMOS process. Finally the measured microphone mechanical and acoustic properties would be given. According to the measurement results, two of microphone design had been implement successfully. Array type microphone could effectively enhance device performance. In addition, special diaphragm design could also improve the sensitivity in single type microphone.

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