本研究利用微機電製程，開發獨創性之微接觸電阻量測裝置與方法，除可直接量測接觸電阻與微接觸力之關係外，更可量化在不同接觸次數下，接觸表面粗糙度的變化，因此；可針對接觸電阻與接觸介面間之關係進行量測與探討。除此之外；透過特殊校正方法，去除測試裝置結構與量測儀器寄生電阻與接面電阻，可直接量測接觸電阻值，大幅增加微接觸電阻量測的準確性。由測試結果顯示，隨著接觸次數增加，接觸電阻與接觸表面粗糙度亦隨之增加。透過此創新性之微接觸電阻量測裝置與寄生電阻校正方法開發，可針對微米尺度下接觸特性，進行定量化探討，並可將相關研究結果應用至射頻微機電開關與微型連接器，以改善接觸介面特性，確保電子訊號傳遞之可靠度。

This study demonstrates an on chip testing apparatus to determine the variation of contact resistance with the contact force as well as to quantify the change of contact surface roughness after certain contact cycles. Consequently, the relationship between contact resistance and interfacial roughness can be characterized. Moreover, the method to calibrate the parasitic resistance for the contact resistance measurement is presented. The resistance of the insulated film formed on the contact interfaces also can be extracted. The experimental results show that mechanical cycling causes an increase in contact resistance and interfacial roughness. In summary, the present on chip apparatus provides detailed information regarding the micro contact testing, and further enables the improvement of RF-MEMS switches and micro-connectors performances.

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