本論文使用旋塗sodium silicate solution中間層、金-矽共晶接合及電漿活化接合等三種方法接合鈮酸鋰-矽異質晶圓對，討論此三種接合法的優劣好壞。
旋塗sodium silicate solution中間層接合所能達到的最佳接合區域約為60~70 %，但晶圓對無法承受切割造成的應力而分開，因此無法得到真正的接合強度；以掃瞄式聲波顯微鏡觀察金-矽共晶接合法接合的鈮酸鋰-矽晶圓對，發現疑似缺陷造成的波浪紋，且一經切割兩晶圓便分開；電漿活化鈮酸鋰及矽晶圓表面後直接接合，接合狀況良好，拉伸強度可與傳統高溫退火後直接接合的矽晶圓對強度相比擬。使用較高瓦數的電漿活化或是增加電漿活化的時間，皆有助於提升晶圓對的接合強度。

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