本研究以濕潤天平(wetting balance)定量量測基材的濕潤性，探討基材與錫銅和錫鉍無鉛銲料間的濕潤現象，所使用的基材為銅和鎳片。同時以現用之錫鉛銲料作為對照，比較其濕潤情形。
在濕潤性質的測試方面，將銅片和鎳片以夾具夾住，並沾上適量的助銲劑（有水溶性、type-RMA及type-R三種），再將之掛於濕潤天平的基材懸掛處上做濕潤性的測試。所改變的環境參數有兩個部分：改變浸漬速度及銲料的溫度。經由以濕潤天平測試不同的環境下錫銅銲料對基材的濕潤性質，發現較佳的濕潤情形發生在使用水溶性助銲劑時，浸漬速度為20mm/s、浸漬深度為4mm、錫鉛銲料（Sn-40wt%Pb）溫度為250ºC或錫銅銲料（Sn-1wt%Cu）溫度為270ºC。在這樣的情形下所得到的濕潤時間，依錫鉛銲料對基材銅、錫鉛銲料對基材鎳、錫銅銲料對基材銅及錫銅銲料對基材鎳的順序，分別為0.26秒、0.3秒、0.4秒及0.435秒。單位沾濕周長之最大濕潤力則分別是0.283N/m、0.263N/m、0.223N/m及0.157N/m。再藉由濕潤力所計算出的界面張力依序分別為0.41 N/m、0.438N/m、0.433N/m及0.493N/m。而計算出的接觸角大小則分別是34.4度、47.5度、52.3度及63.9度。

若是銲料和基材在濕潤的過程中發生界面反應，則所量測到的濕潤性質應該變成是銲料對介金屬相，而非銲料對基材。因此，當銲料與基材濕潤的界面生成不同的介金屬相，其所量測到的濕潤性質可能會因生成相的不同而有一個轉折點。錫-鉍銲料與基材鎳的界面反應，在300℃下會有Ni3Sn4相或NiBi3相生成之可能。經由不同組成和鎳片的液固界面反應，可以粗略得到不同組成之錫鉍合金與鎳反應生成Sn-Ni相和Ni-Bi相的分界點位於Sn-98wt%Bi附近。而用濕潤天平所測得的濕潤時間和最大濕潤力在Sn-97.5wt%Bi與Sn-98wt%Bi之間也有所變化，不過濕潤力的改變較小。錫鉍合金中的Bi含量增加，濕潤時間變長的原因，可能是一方面因為Bi含量愈高時，氧化層生成較容易，造成銲料要恢復因基材插入後造成的曲面為水平面時的阻力，也因為如此測得的數值跳動比較大。但在Sn-97.5wt%Bi會有一個轉折點，應該是與生成Sn-Ni相和Sn-Bi相的不同有極大的關係。因為界面反應的結果顯示在此組成附近的錫鉍合金與鎳的界面生成相有Sn-Ni相和Sn-Bi相的差異，只是這兩相與銲料的界面張力差距並不大。因此，銲料對基材之濕潤行為實際上是銲料對介金屬相之濕潤行為。

在錫銅銲料方面，錫銅銲料與基材銅在200℃~300℃的溫度下反應會有Cu6Sn5相在界面生成，而與基材銅在此溫度下反應則會有Ni3Sn4相在界面生成。預期將基材於銲料中的浸漬時間加長可能改變介金屬相的厚度，進而使濕潤力有所變化。實驗的結果顯示，在不同浸漬時間下所測得的濕潤時間和最大濕潤力改變並不大，推測可能是因為介金屬相很快就形成了，且在所改變的浸漬時間中，介金屬相厚度的改變並不大，不至於造成濕潤行為的不同。也可能是界面張力的差距不大，或是相對於基材與空氣的界面張力都過小，以致於顯現出沒有改變。

Abstract
Intermetallic compounds form at the interface of Sn-Cu and Sn-Bi solders on diverse substrates in a relatively short time. However, whether these compounds affect the wetting properties of Sn-Cu and Sn-Bi alloys on diverse substrates remains unknown. Therefore, this study attempts to determine how the intermetallic compounds affect the wetting properties of Sn-Cu and Sn-Bi solders on diverse substrates by using the wetting balance method. A vertical substrate plate is immersed into a molten solder bath. The force performed on the plate is then measured by utilizing a wetting balance. Next, a wetting balance is used to measure the wetting time, wetting force, contact angle and surface tension. Moreover, the operational environment of the wetting balance is altered to obtain discrepant wetting property data under various conditions. Solder temperature, immersion time and solder composition comprise the varying operational environments. Furthermore, OM is used to observe the intermetallic compound at the interface. Experimental results demonstrate the basic wetting properties of Sn-Cu solder on diverse substrates by a wetting balance, such as wetting time, wetting force, contact angle and surface tension. Results in this study clarify the role of reactive wetting in formed intermetallic compounds at the interface by altering the operational environments of the wetting balance.

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