微型發光二極體顯示技術，因其高亮度、高對比度、反應時間快、低功耗等優勢，被視為未來顯示器之最佳解決方案，然而時至今日卻尚未量產，這是因為不同色彩的微型發光二極體無法在磊晶基板上同時成長，再加上微型發光二極體製程良率不佳，因此必須使用具有選擇性吸取功能的批量轉移工具，提升面板組裝效率，降低生產成本。
本研究欲利用微機電製程技術，利用其高精度、易陣列化等優勢製作微型靜電轉移頭陣列，透過外部電路控制靜電力產生，實現批量化吸取以及選擇性等功能。除了轉移頭元件上的開發，本研究同時改良實驗架設，包括：提升系統機械剛性、提升定位精度、利用治具輔助樣品排列、觀測系統的改善以及更合理的元件固定方式，以提升離散晶粒在批量化操作時的可靠度。
本研究透過SOI以及CMOS兩個製程平台製作轉移頭元件。SOI轉移頭接續實驗室相關研究，透過製程改良，實現可獨立控制的4×4陣列，以達成選擇性吸取功能的驗證。CMOS轉移頭則是透過測試元件，驗證利用CMOS製程小線寬的優勢是否能提升靜電力，此外也利用相同電極結構進行近接感測。

The Micro-LED display technology is regarded as the best solution for future displays due to its mechanism. However, it has not been commercialized yet. The reason is Micro-LED has poor yield. Therefore, it is necessary to use a mass transfer tool with selectivity pick-up function to improve panel assembly efficiency and reduce production cost.
We want to use MEMS process technology to make micro-electrostatic transfer head array due to the advantages of high precision and easy arraying. Electrostatic force is controlled through external circuit control to achieve mass transfer and selectivity pick-up functions.
In addition to the development of the transfer head components, this study also improved the experimental setup, including: improving the mechanical rigidity of the system, improving the positioning accuracy, using the jig to assist sample arrangement, improving the observation system, and more reasonable transfer head fixing methods to enhance the reliability in batch operations of Micro-chips.
The SOI transfer head continues the related research of our laboratory. By process improvement we implement the 4×4 array which can independently control. And verify the selectivity pick-up function.
The CMOS transfer head is the test component to verify the small line width electrodes can increase the electrostatic force. In addition, the same electrode structure also used for proximity sensing.

[1] http://www.maxi-pedia.com/tft+lcd+display+monitor+panel
[2] C.-C. Chen, C.-Y. Wu, and T.-F. Wu, “LED back-light driving system for LCD panels,” Twenty-First Annual IEEE Applied Power Electronics Conference and Exposition, Dallas, TX, March, 2006, pp 381-385.
[3] A. Carroll, and G. Heiser, "An Analysis of Power Consumption in a Smartphone." USENIX annual technical conference, 2010.
[4] https://www.sony.co.jp/SonyInfo/News/Press/201605/16-053/
[5] A. Bibl, J.A. Higginson, H.-f. S. Law, and H.-H. Hu, “Light emitting diode structure,” U.S. Patent NO.20130126827 A1, 2013.
[6] S. X. Jin, J. Li, J. Z. Li, J. Y. Lin, and H.X. Jiang, “GaN microdisk light emitting diodes,” Applied Physics Letters, 76, pp 631-633, 2000.
[7] H.X. Jiang, S.X. Jin, J. Lin, and J. Sakya, and J. Y. Lin, “III-nitride blue microdisplay,” Applied Physics Letters, 78, pp 1303-1305, 2001.
[8] S.-I. Park, Y. Xiong, R.H. Kim, P. Elvikis, M. Meitl, D.H. Kom, J. Wu, J. Yoon, C.-J. Yu, Z. Liu, Y. Huang, K.-C. Hwang, P. Ferreira, X. Li, K. Choquette, and J.A. Rogers, “Printed assemblies of inorganic light-emitting diode for deformable and semitransparent displays,” Science, 35, pp 977-981, 2009.
[9] http://www.sony.net/SonyInfo/News/Press/201201/12-005E/
[10] http://www.ledinside.com.tw/research/20160804-32880.html
[11] M. Douglass, “DMD reliability: a MEMS success story,” Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, Micromachining and Microfabrication, San Jose, CA, 2003.
[12] Y.-C. Wu, “Development of Micro Pick-up Array for Micro LED Assembly, ” NTHU, MS, Thesis, 2016.
[13] P. Kim, Y.-D. Ha, H. Park, and J.-H. Park, “Development of die-bonder with multi & matrix picker and placer to increase production capacity,” Proceedings of the World Congress on Engineering and Computer Science, San Francisco, CA, October, 2012.
[14] A. Carlson, A.M. Bowen, Y. Huang, R.G. Nuzzo, and J.A. Rogers, “transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Advanced materials, 24, pp 5284-5318, 2012.
[15] M.H Wu, Y.H. Fang, and C.-H. Chao, “Electric-programmable magnetic module and picking-up and placement process for electronic devices,” U.S. Patent NO. 9607907 B2, 2017.
[16] A. Bibl, J.A. Higginson, H.-F. S. Law, and H.-H. Hu, “Micro device transfer head heater assembly and method of transferring a micro device,” U.S. Patent NO.8349116 B1, 2013.
[17] D. Golda, and A. Bibl, “Compliant bipolar micro device transfer head with silicon electrodes,” U.S. Patent NO.8415767 B2, 2013.
[18] A. Bibl, and D. Golda, “Compliant micro device transfer head with integrated electrode leads,” U.S. Patent NO.8791530 B2, 2014.
[19] D. Golda, J.A. Higginson, and A. Bibl, “Micro pick up array with integrated pivot mount,” U.S. Patent NO.9314930 B2, 2016.
[20] J‐F. Daviet, L. Peccoud, and F. Mondon, “Electrostatic Clamping Applied to Semiconductor Plasma Processing,” Journal of Electrochemical Society , 140, pp 3245-3256, 1993.
[21] K. Asano, F. Hatakeyama, and K. Yatsuzuka, ”Fundamental study of an electrostatic chuck for silicon wafer handling,” IEEE Transactions on Industry Applications, 38.3, pp 840-845, 2002.
[22] D. Ruffatto, J. Shah, and M. Spenko, "Optimization and experimental validation of electrostatic adhesive geometry," 2013 IEEE Aerospace Conference, Big Sky, MT, pp. 1-8, 2013.
[23] J. Guo, T Bamber, M. Chamberlain, and M. Jackson, “Optimization and experimental verification of coplanar interdigital electroadhesives” Journal of Physics D: Applied Physics, 49, 2016.
[24] http://www.yole.fr “MicroLED Displays Webcast,” 2017.
[25] C. -H. Yeh, “Development of Electrostatic Transfer Heads with Buffer Structure for Micro LED Display,” NTHU, MS, Thesis, 2017.
[26] Y. -P. Chen, “Design and Implementation of Electrostatic Transfer Heads Array for Micro-LED Display Assembly, ” NTHU, MS, Thesis, 2018.
[27] Z. Chen, and R.C. Luo, “Design and Implementation of Capacitive Proximity Sensor Using Microelectromechanical Systems Technology,” Transactions on Industrial Electronics, 45, pp 886-894, 1998
[28] S. Tsuchitani, S. Suzuki, M. Matsumoto, and M. Miki, “Theoretical study on the surface force in microstructures,” Transactions of the Society of Instrument and Control Engineers, 32, pp 637-645, 1996.