本實驗是以無電鍍後得到表面銀被覆的鑽石顆粒，加以大氣熱壓的鑽石銀基複材，研究探討其熱膨脹、熱傳導、硬度等性質，以評估此複合材料在電子構裝熱材的應用潛力。無電鍍是一種化學電鍍法，利用化學氧化還原使銀還原鍍覆在鑽石顆粒表面，如此可增加銀在鑽石顆粒間的分散性；大氣熱壓的參數為600 oC，500 MPa，時間為30分鐘，得到鑽石體積含量10、20、30、40、60 %的複材，並以不同大小的鑽石顆粒製成不同體積比含量的複材，觀察其關係。
Diamond/Ag複材的性質量測顯示：硬度隨著鑽石添加量的增加而上升，達到散佈強化的效果；在熱膨脹係數(Coefficient of Thermal Expansion)方面，CTE隨著強化材含量增加而減小，且與鑽石顆粒大小沒有關係，當強化材體積比含量為60 %時，CTE達到6 ppm/K，符合電子構裝散熱材所希望達到範圍內的值（2-7 ppm/K）；熱傳導性質，隨著鑽石顆粒尺寸變大，表面積減少，熱傳導係數上升；而鑽石含量增加，複材熱傳導係數下降，但20 vol% Diamond/Ag仍有420 W/m•K。整個說來，以此法製造Diamond/Ag複材，製程設備便宜，硬度跟CTE都有隨著鑽石添加而改善性質。

1. J. Markoff, “Intel’s Big Shift After Hitting Technical Wall”, New York Times, May 17, 2004.
2. Carl Zweben, “New, Ultrahigh-Thermal-Conductivity Packaging Materials”, IEEE Components, Packaging & Manufacturing Technology Society - Santa Clara Valley Chapter, March 16, 2005 Sunnyvale, California
3. G. L. Romero, J. M. Fusaro, and J. L. Martinez, “ Metal Matrix Composite Powder Modules : Improvements in Reliability and Package Integration”, IAS 95, Conference Record of the 1995 IEEE Industry Application Conference. Thirtieth IAS Annual Meeting, Vol. 1, pp. 916-922
4. A. Kelly and C. Zewben, Eds., Comprehensive Composite Materials, Pergamon Press, Oxford, 2000.
5. K. A. Schmidt and C. Zewben, “Advanced Composite Packaging Materials”, Electronic Materials Handbook, ASM International, Materials Park, Ohio, 1989.
6. D. D. L. Chung and C. Zewben, “Composites for Electronic Packaging and Thermal Management”, Comprehensive Composite Materials, A. Kelly and C. Zewben, Eds., 6: Design and Applications, Pergamon Press, Oxford, 2000.
7. C. Zweben, “Thermal Management and Electronic Packaging Applications”, ASM Handbook, Volume 21, Composites, ASM International, Materials Park, Ohio, pp.1078-1084, 2001.
8. C. Zweben, “Electronic Packaging: Heat Sink Materials”, Encyclopedia of Materials: Science and Technology, K. H. J. Buschow, et al., Editors-in-Chief, Elsevier Science, Oxford, 3, pp. 2676-83, 2001.
9. T. F. Fleming, C. D. Levan, and W. C. Riley, “Applications for Ultra-High Thermal Conductivity Fibers”, Processings of the International Electronic Packaging Conference, Wheaton, IL, International Electronic Packaging Society, 1995, pp. 493-503.
10. J. W. Klett and T. D. Burchell, “High Thermal Conductivity Mesophase Pitch-derived Carbon Foams,” Proceedings, 43rd International SAMPE Symposium, May 31-June4, Anaheim, CA, 1998.
11. I. Golecki, et al., “Properties of High Thermal Conductivity Carbon-Carbon Composites for Thermal Management Applications”, Proceedings of the 1998 High Temperature Electronic Materials, Devices and Sensors Conference, San Diego, CA, published by the IEEE, pp.190-195,1998.
12. Thaw, J. Zemany and C. Zweben, “Metal Matrix Composites for Microwave Packaging Components”, Electronic Packaging and Production, pp. 27-29, August 1987.
13. J. Norley, “Natural Graphite Based Materials for Electronics Cooling”, Proceedings, IMAPS Advanced Technology Workshop on Thermal Management, Palo Alto, California, October 25-27, 2004.
14. C. Zweben, “High Performance Thermal Management Materials”, Electronics Cooling, Vol. 5, No. 3, pp. 36-42, 1999
15. Carl Zweben, “Ultrahigh-Thermal-Conductivity Packaging Materials”, 21st IEEE SEMI-THERM Symposium
16. C. Zweben, Mechanical Engineering’ Handbook, 2nd ed., ed. M. Kuntz (New York: John Wiley & Sons, 1998)
17. D. M. Jacobson and S. P. S. Sangha, “Novel Low Expansion Packages for Electronics”, The GEC Journal of Technology, Vol. 14, No. 1, pp. 48-52, 1997
18. J. F. Silvain, Y. Le Petitcorps, E. Sellier, P. Bonniau and V. Heim, ” Elastic Moduli, Thermal Expansion and Microstructure of Copper-Matrix Composite Reinforced by Continuous Graphite Fibres”, Composites, Vol. 25, 1994, pp. 570-574
19. I. Dutta, “Role of Interfacial and Matrix Creep During Thermal Cycling of Continuous Fiber Reinforced Metal–Matrix Composites”, Acta Materialia, Volume 48, Issue 5, 14 March 2000, pp. 1055-1074
20. M. Vedula, R. N. Pangborn and R. A. Queeney, “Fibre Anisotropic Thermal Expansion and Residual Thermal Stress in a Graphite/Aluminium Composite”, Composites, Vol. 25, January 1988, pp. 55-60
21. J. F. Silvain, Y. Le Petitcorps, E. Sellier, P. Bonniau and V. Heim, “Elastic Moduli, Thermal Expansion and Microstructure of Copper-Matrix Composite Reinforced by Continuous Graphite Fibres”, Composites, Vol. 25, 1994, pp. 570-574
22. B. K. Hwu, S. J. Lin, and M. T. Jahn, “The Interfacial Compounds and Sem Fractography of Squeeze-Cast SiCp/6061 Al Composites”, Materials Science and Engineering, A206, 1996, pp.110-119
23. O. Ottinger and R. F. Singer, “An Advanced Melt Infiltration Process for the Net Shape Production of Metal Matrix Composites”, Z. Metallkde, Vol. 84, 1993, Iss12, pp. 827-831
24. A. J. Cook and P. S. Weerner, ”Pressure Infiltration Casting of Metal Matrix Composites”, Materials Science and Engineering, A144, 1991, pp. 189-206
25. M. F. Amateau, “Progress in the Development of Graphite-Aluminum Composites Using Liquid Infiltration Technology”, J. Composites Materials, Vol. 10,1976, pp.279-296
26. D. Muscat, K. Shanker and A. L. Drew, “Al/TiC Composites Produced by Melt Infiltration”, Materials Science and Technology, Vol. 8, 1992, pp.971-976
27. M. K. Aghajanian, M. A. Rocazelle, J. T. Burke, and S. D. Keck, “The Fabrication of Metal Matrix Composites by a Pressureless Infiltration Technique”, J. Materials Science, Vol.26, 1991, pp. 447-454
28. R. M. German, K. F. Hens, and J. L. Johnson, “Powder metallurgy Processing of Thermal Management Materials for Microelectronic Applications”, The International Journal of Powder Metallurgy, Vol. 30, No. 2, 1994, pp. 205-215
29. J. Hashin and S. Shtrikman, “A Variational Approach to the Theory of Elastic Behavior of Multiphase Materials”, J. Mech. Phys.: Solids, Vol. 11, 1963, pp. 127-140
30. P. S. Turner, “Thermal Expansion Stresses in Reinforces Plastics”, J. Res. NBS, Vol. 37, 1946, p. 239
31. E. H. Kerner, “The Elastic and Thermoelastic Properties of Composite Media”, Proc. Phys. Soc., Vol. 68B, 1956, p. 808
32. T. T. Wang and T. K. Kwei, J. Polymer Sci., Vol. 7, 1969, p. 889
33. R. R. Tummala and A. L. Friedberg, “Composites, Carbides. Thermal Expansion of Composite Material”, J. Appl. Phys., Vol. 41, 1970, pp. 5104-5107
34. R. A. Schapery, “Thermal Expansion Coefficients of Composite Materials Based on Energy Principles”, J. Comp. Mater., Vol. 2, 1968, pp. 380-404
35. A. A. Fahmy and A. N. Ragai, “Thermal-Expansion Behavior of Two-Phase Solids”, J. Appl. Phys., Vol. 41, No. 13, 1970, pp. 5108-5111
36. R. M. German, “A Model for the Thermal Properties of Liquid-Phase Sintered Composites”, Metallurgical Transactions A, Vol. 24A, 1993, pp.1745-1752
37. D. P. H. Hasselman and K. Y. Donaldson, “Effect of Reinforcement Particle Size on the Thermal Conductivity of a Particulate-Silicon Carbide-Reinforced Aluminum Matrix Composite”, J. Am. Ceram. Soc., Vol. 75, No. 11, 1992, pp. 3137-3140
38. A. G. Every, Y. Tzou, D. P. H. Hasselman and R. Raj, “The Effect of Particle Size on the Thermal Conductivity of ZnS/Diamond Composites”, Acta Metall. Mater., Vol. 40, No. 1, 1992, pp. 123-129
39. L. Rayleigh, “On the Influence of the Obstacles Arranged in Rectangular Order upon the Properties of a Medium”, Phil. Mag., Vol. 34, 1892, pp. 481-502
40. D. P. H. Hasselman and L. F. Johnson, “Effective Thermal Conductivity of Composites with Interfacial Thermal Barrier Resistance”, J. Comp. Mater., Vol. 21, No. 5, 1987, pp. 508-515
41. J. C. Maxwell, A Treatise on Electricity and Magnetism, 1, 3rd ed. Oxford University Press, Oxford, U. K., 1904
42. Y. Benvensite, “Effective Thermal Conductivity of Composites with a Thermal Contact Resistance between the Constituents : Nondilute case”, J. Appl. Phys., Vol. 61, 1987, pp. 2840-2843
43. J. C. Y. Koh and A. Fortini, “Prediction of Thermal Conductivity and Electrical Resistivity of Porous Metallic Materials”, International Journal of Heat and Mass Transfer, Vol. 16, 1973, pp. 2013-2022
44. V. M. Dubin, Y. Shacham-Diamand, B. Zhao, P. K. Vasuder, and C. H. Ting, “Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration”, J. Electrochem. Soc., 144(1997) pp.898-908
45. A. Szasz, D. J. Fabian, Z. Paal, and J. Kojnok, “Chemical Mechanism in Electroless Deposition: A Study on the Role of Hydrogen in Formation”, J. Non-Crystal Solid, Vol. 13, 1988, 21-23
46. 神戶得藏著，莊萬發譯， “無電鍍金：化學鍍金術”， 復漢出版社，1999
47. J. Dugasz and G. J. Shawhan, “Factors Affecting the Adhesion of Electroless Coating”, Surface Coating Technol., Vol. 58, 1993, pp. 57-62
48. S. G. Warrier and R. Y. Lin, “Control of Interface in Al-C Fiber Composites”, J. Mater. Sci., Vol. 28, No. 3, 1993, pp. 760-780
49. http://www.factdiamond.com/technical/index.htm
50. Metals Handbook, “Properties and Selection Nonferrous Alloys and Special-Purpose Materials”, Vol.2 Tenth Edition
51. 許哲豪,“SiCp/Ag電接觸複合材料性質研究”,清華大學, 1998
52. S. K. Bhaumik, G. S. Upadhyaya, and M. L. Vaidya, Int. J. Refractory Met. & Hard Mat., 11, 9(1992)
53. Katsuhito Yoshida, Hideaki Morigami， “Thermal Properties of Diamond/Copper Composite Material”, Microelectronics Reliability, Vol. 44, 2004, pp.303-308
54. K. Hanada, K. Matsuzaki, T. Sano, “Thermal Properties of Diamond Particle-Dispersed Cu Composites”, Journal of Materials Processing Technology, 2004, pp. 514-518
55. D. P. H. Hasselman, Kimberly Y. Donaldson, Jen Liu, Ludwig J. Gauckler, and P. Darrell Ownby, “Thermal Conductivity of a Particulate-Diamond-Reinforced Cordierite Matrix Composite”, J. Am. Ceram. Soc., Vol. 77, pp. 1757-1760 (1994)
56. R. J. Stoner and H. J. Maris, “Measurements of the Kapitza Conductance between Diamond and Several Metals”, Physical Review Letters, Vol.68, No.10, pp. 1563-1566
57. P.W. Ruch , O. Beffort , S. Kleiner , L. Weber , P.J. Uggowitzer, “Selective Interfacial Bonding in Al(Si)-Diamond Composites and Its Effect on Thermal Conductivity”, Composites Science and Technology, Vol.66, pp. 2677–2685 (2006)
58. O. Beffort , L. Weber , P. Ruch , U.E. Klotz , S. Meier , S. Kleiner, “Interface Formation in Infiltrated Al(Si)/Diamond Composites”, Diamond & Related Materials, Vol. 15, pp. 1250–1260 (2006)