隨著5G時代的來臨,因應5G的網路速度提升、巨量機器通信與物聯網創新應用服務，各大EMS大廠(電子專業製造服務，Electronic Manufacturing Services）積極開發系統單封裝（SiP：System in a Package）封裝技術，將數個功能不同的晶片（Chip），直接封裝成具有完整功能的「一個」積體電路（IC）。在產品設計中應用SiP解決方案的主要優勢包括：小尺寸 ，快速上市，簡化設計，更好的射頻性能 ，經過預測試和資格預審，具備更高的生產效率和良率，便捷的原物料管理 ，可以降低設備採購投資成本 ，不同型號的標準化。電子產品的設計變得越來越複雜， 產品的生命週期也越來越短。 上市時間成為成功的關鍵因素。 產品中的模組化設計可以幫助我們縮短產品上市時間。選擇SiP模塊的電子設備可以集成更多功能，整合多晶片的技術逐日受到各產業重視，並有希望超越摩爾定律。
因應SiP技術的快速發展與廣泛應用，本研究以S公司為個案，結合技術藍圖理論視角，分析S公司如何在為客戶提供“一站式”解決方案的過程中—整合系統設計能力與先進的IC封裝技術—S公司如何透過塑造企業的核心能力，制定競爭策略，在SiP行業取得競爭優勢。本研究透過訪談蒐集S公司的初級資料，並結合技術規劃相關文獻及產業分析報告等次級資料開展個案分析，並得到如下結論：S公司在SIP行業的競爭優勢主要來自相對成本優勢及差異化。S公司制定的具體競爭策略包括： (1)成本領導:成為所處產業最低成本製造商； (2)差異化:把自己置於最獨特定位，滿足客戶需求， 取得較佳的產品價格 (3)焦點化:在一個區段中發展成本優勢(焦點成本)在一個區段中發展差異化。

In response to the 5G development, major EMS (Electronic Manufacturing Services) manufacturers are actively developing SiP (SiP: System in a Package) packaging technology, which directly encapsulates several chips with different functions into a single integrated circuit (IC) with complete functions. The main advantages of applying SiP solutions in product design include “small size”, “fast time to market”, “simplified design”, “better RF performance”, “pre-tested and pre-qualified”, “higher production efficiency and yield”, and “convenient raw material management”. It can reduce the cost of equipment procurement and standardize different models. The design of electronic products has become more and more complex, and the life cycle of products has become shorter and shorter. Time to market becomes a critical factor for success. The modular design in the product can help firms shorten the time to market. Electronic equipment that chooses SiP modules can integrate more functions, and the technology of integrating multiple chips is increasingly receiving attention from various industries, which may hopefully exceed Moore's Law.
In response to the rapid development and wide application of SiP technology, this study takes firm S as a case, combined with the technical roadmap perspective. The paper aims to analyze, in the process of integrating system design capabilities with advanced IC packaging technology to provide customers with "one-stop" solutions, how firm S shapes its core capabilities and formulate competitive strategies to gain a competitive advantage in the SiP industry. This research collects primary data of firm S through interviews, and conducts case analysis based on secondary data such as academic literature and industry analysis reports, and draws the following conclusions: S company's competitive advantage in the SiP industry mainly comes from relative cost advantage and differentiation. The specific competitive strategies formulated by firm S include: (1) Cost leadership: becoming the lowest cost manufacturer in the industry; (2) Differentiation: putting the firm in the most unique position to meet customers’ needs and obtain better product prices; (3) Focus: developing cost advantages in a section (focus cost) and develop differentiation in another section.

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