摘要
本研究主要以LIGA和DRIE製程技術製作TE_41 模式轉換元件，希望能完善實驗室之前建立起的高精度的LIGA製程，以及建立一套高效率的DRIE深蝕刻製程，預期使用於高頻Y-Band 400GHz的頻段，此元件可應用於Cusp Gun中。
實驗室之前以微機械加工(LIGA)方式製作W-Band TE_41 模式轉換元件以及203 GHz之TE_02 模式轉換元件，於HP8720C網路分析儀所量測結果與HFSS(High Frequency Structure Simlator)模擬結果有所差距，推測的結果為表面粗糙度影響穿透效率極為顯著，而加工精度也影響非常大，在較低頻段影響明顯，可想而知在400GHz更為嚴重，故我們採用LIGA製程製作Y-Band元件，但是由於LIGA製程製作不易，同時在製作時碰到某些困難，內文詳述。所以我們試著去開發一套深蝕刻(DRIE)製程，並努力兩種製程都能做到最佳，便可比較兩種製程之差異性，希冀能整合，再加以融合兩道製程之優點開發出一套省時、省錢、效果又佳的製程。
另外，在高頻量測部分我們更希望能結合光學量測技術，將微波頻段量測推展至太赫茲THz量測頻段，結合TDS(Time Domain Spectrum)量測系統至波導管中模式量測技術。
DRIE部分未來預期能在各種太赫茲元件、透鏡上應用，使用深蝕刻技術製作矽透鏡，以及有效掌握其光路。
LIGA部分已能應用在較低頻段中的微波元件製作，預期未來能加速整道LIGA製程，使元件能有效製作較低頻的波導元件。兩者更甚至於應用至半導體、光子晶體、共振腔之製作。

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