本論文旨在探討薄膜擠壓阻尼效應(Squeeze-film damping effect)於壓力感測器之應用。在微機電領域中，薄膜擠壓效應已被廣泛的研究，但主要聚焦於此效應對於動態結構所造成的非理想性，直到近年才開始誕生將此效應應用在壓力感測上的概念。在本研究中，我們採用TSMC MEMS shuttle製程，製作出大小為4mm×4mm、厚度為40μm之晶片，並設計九個不同面積、彈力係數的壓力感測器，將其與壓電片、感測電路整合在PCB板上。PCB板將放置於壓力控制腔中，透過壓電式驅動、電容式感測的方式，捕捉結構共振頻隨壓力的變化，並與模擬結果做比較，以一面積為800μm×800μm的感測元件為例，其感測度能達到0.945 Hz/Pa。

In this thesis, we discuss the use of squeeze-film damping effect for pressure sensing. In the field of microelectromechanics system(MEMS), this effect has been extensively studied, but mostly focused on the non-ideal effect it causes on dynamic structures. Recently, the concept of applying this effect to atmospheric pressure sensing has been proposed. In this work, 9 pressure sensors of 40μm in thickness are designed in a 4mm×4mm chip, which is fabricated by the TSMC MEMS shuttle process. The sensor chip is integrated with a piezoelectric actuator and the corresponding sensing circuit on a printed-circuit board(PCB). The PCB is placed in a pressure controlled chamber for testing. Combined with piezoelectric driving and capacitive sensing mechanism, the resonant frequency shift is comparable to the simulations. The sensitivity of an 800μm×800μm structure is 0.945 Hz/Pa.

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