研究生: |
吳明璋 Ming-Chang Wu |
---|---|
論文名稱: |
散熱座結合熱電致冷器之最佳化設計 Thermal Optimal Design for Heat Sinks Integrated with Thermoelectric Coolers |
指導教授: |
洪英輝
Ying-Huei Hung |
口試委員: | |
學位類別: |
博士 Doctor |
系所名稱: |
工學院 - 動力機械工程學系 Department of Power Mechanical Engineering |
論文出版年: | 2006 |
畢業學年度: | 95 |
語文別: | 中文 |
論文頁數: | 1冊 |
中文關鍵詞: | 散熱座 、熱電致冷器 、最佳化設計 、水平渠道流 、平面噴流衝擊 |
外文關鍵詞: | Heat Sink, Thermoelectric Cooler, Thermal Optimal Design, Ducted Flow, Slot Jet Impingement |
相關次數: | 點閱:4 下載:0 |
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在本論文研究中,建立了一系列的實驗系統及方法,來分別探討散熱座或散熱座結合熱電致冷器之散熱模組應用於不同冷卻方法之熱傳特性與最佳化設計。冷卻方法分為(一)水平渠道流與(二)限制平面噴流衝擊兩種。在研究中探討影響水平渠道內及限制平面噴流衝擊的熱傳性能之相關參數分別列之如下:(一)水平渠道流-穩態晶片發熱量(Qc,s)、熱電致冷器輸入電流(I)、散熱座高度與渠道高度比(Hs/Hc)與渠道雷諾數(ReD)。這些參數的探討範圍是Qc,s=10-50 W,I=2-10 A,Hs/Hc=0.42-1與ReD=7351-30055。(二)限制平面噴流衝擊-穩態晶片發熱量(Qc,s)、熱電致冷器輸入電流(I)、噴流間距與噴嘴寬度比(H/Wj) 、散熱座高度與噴嘴寬度比(Hs/Wj)與噴流雷諾數(Rej)。這些參數的探討範圍是Qc,s=8-18 W,I=2-6 A,H/Wj=2-10,Hs/Wj=0.74-3.40 與 Rej=194-1685。
在水平渠道內分別針對散熱座或散熱座結合熱電致冷器之散熱模組的暫態/穩態局部和平均熱傳特性作探討。研究結果顯示Hs/Hc和ReD皆對暫態/穩態局部和平均紐賽數以及外界熱阻有顯著影響。另外,平均外界熱阻、I與Qc,s皆對散熱模組之局部和平均總熱阻有顯著影響。利用變異數分析F檢測法針對相關參數作統計敏感度分析,發現ReD對穩態平均紐賽數與平均外界熱阻具有最顯著的影響;對於平均總熱阻而言, 重要的影響參數包括平均外界熱阻、I與Qc,s。在研究中亦針對在水平渠道內散熱座或散熱座結合熱電致冷器之散熱模組的對流熱傳特性建立反應曲面模型並且提出新的經驗公式。
關於限制平面噴流衝擊於散熱座或散熱座結合熱電致冷器散熱模組的對流熱傳特性方面,本研究先後針對暫態/穩態局部和平均熱傳特性作探討。研究結果顯示Hs/Wj和Rej皆對暫態/穩態局部和平均紐賽數以及外界熱阻有顯著影響。另外,平均外界熱阻、I與Qc,s皆對散熱模組之局部和平均總熱阻有顯著影響。利用變異數分析F檢測法針對相關參數作統計敏感度分析,發現Rej對穩態平均紐賽數與平均外界熱阻具有最顯著的影響;對於平均總熱阻而言, 重要的影響參數包括平均外界熱阻、I與Qc,s。在研究中亦針對在限制平面噴流衝擊於散熱座或散熱座結合熱電致冷器散熱模組的對流熱傳特性建立反應曲面模型並且提出新的經驗公式。
為了評估散熱座結合熱電致冷器應用於不同冷卻方法下之熱傳特性,本研究中提出了一個結合熱網路理論模型及熱電致冷器實驗性能曲線的半經驗方法。此方法可準確地預測散熱座結合熱電致冷器熱傳模組在不同外界熱阻下相關的實驗熱傳結果。對於熱端與冷端溫差(□T)與性能係數(COP)而言,理論預測結果與實驗數據比較之平均誤差分別為3.6%與1.5%,而最大誤差分別為18.7%與13.1%。
本研究中更成功地發展出一套應用於在不同外界熱阻下,散熱座或散熱座結合熱電致冷器散熱模組的最佳化散熱方法,此方法可使設計者有效且快速地在多個限制條件下找出最佳化的散熱設計。首先,利用工程統計分析所作出的敏感度測試可定量地分析出系統中相關參數影響之重要性;接著應用反應曲面法搭配實驗計劃法來得到迴歸曲面模型;最後再藉由數值最佳化方法來有效的求出在各種限制條件下的最佳化散熱設計。應用此最佳化方法及流程,可以成功地對於不同外界熱阻下之散熱座或散熱座結合熱電致冷器散熱模組得到各種限制條件的最佳化設計。
In the present study, a series of theoretical and experimental studies on the heat transfer characteristics from heat sinks and Heat Sink/TEC assemblies by using different cooling methods have been performed. Two types of cooling methods such as ducted flow and slot jet impingement are employed in the present study. The relevant parameters influencing heat transfer performance in ducted flow and slot jet impingement studies are listed, respectively. They are: (1) ducted flow - the steady-state heat loads, the input current of TEC, ratio of heat sink height to channel height (Hs/Hc) and channel Reynolds number (ReD). The ranges of parameters studied are Qc,s=10~50 W, I=2~10 A, Hs/Hc=0.42~1, ReD=7351~30055 (or Ui=1.95~7.98 m/s). (2) slot jet impingement -the steady-state heat loads, the input current of TEC, ratio of jet separation distance to nozzle width (H/Wj), ratio of heat sink height to nozzle width (Hs/Wj) and jet Reynolds number (Rej). The ranges of above-mentioned parameters studied at steady state are Qc,s=8~18 W, I=2~6 A, H/Wj=2~10, Hs/Wj=0.74~3.40 and Rej=194~1693. Their effects on heat transfer characteristics in ducted flow and slot jet impingement have been systematically explored.
For heat sinks and HS/TEC assemblies in a ducted flow, the transient-/steady-state local and average heat transfer characteristics are studied. The results manifest the effects of ReD and Hs/Hc on transient-/steady-state local and average Nusselt Number are more significant as compared with qcv,s (or Qt,s) and I. Similar trend can be found for external thermal resistance. Moreover, the effects of , Qc,s and I on local and average overall thermal resistance are significant. By the statistical sensitivity analysis of ANOVA F-test, ReD has the most significant effect on steady-state average Nusselt number and average external thermal resistance, and is significantly affected by any one of , I and Qc,s in the present parametric studies. In addition, new correlations as well as RSM models of steady-state average Nusselt number, average external thermal resistance and average overall thermal resistance in terms of relevant influencing parameters for heat sinks and HS/TEC assemblies are presented.
For heat sinks and HS/TEC assemblies with slot jet impingement, the transient-/steady-state local and average heat transfer characteristics are studied. The results manifest the effects of Rej and Hs/Wj on transient-/steady-state local and average Nusselt Number are more significant as compared with H/Wj, Qc,s (or Qt,s) and I. Similar trend can be found for external thermal resistance. Moreover, the effects of , Qc,s and I on local and average overall thermal resistance are significant. By the statistical sensitivity analysis of ANOVA F-test, Rej has the most significant effect on steady-state average Nusselt number and average external thermal resistance, and is significantly affected by any one of , I and Qc,s in the present parametric studies. In addition, new correlations as well as RSM models of steady-state average Nusselt number, average external thermal resistance and average overall thermal resistance in terms of relevant influencing parameters for heat sinks and HS/TEC assemblies are presented.
In addition, an effective semi-empirical method combines thermal network models and empirical correlations for exploring the thermal performance of heat sinks and HS/TEC assemblies are successfully established. Comparisons of the predicted parameters such as ΔT, Tc, Th and COP evaluated by this method with the experimental data are made with the average deviations of 3.6%, 1.3%, 0.3% and 1.5%, respectively; as well as with the maximum deviations of 18.7%, 5.8%, 2.2% and 13.1%, respectively.
Furthermore, a systematical design optimization method, which allows the thermal engineer to meet several design objectives and constraints simultaneously and effectively, has been successfully presented and applied to the optimal designs for heat sinks and HS/TEC assemblies with various external thermal resistances in the present study. First of all, a statistical method for the sensitivity analysis is performed to determine the key factors that are critical to the design; and a response surface methodology (RSM) is applied to establish explicit regression models in terms of the design factors with an well-organized design of experiments (DOE). By employing the gradient-based numerical optimization technique, a series of constrained optimal designs can be efficiently performed. With this design optimization method, optimal designs for heat sinks and HS/TEC assemblies under different external thermal resistances are successfully explored with design constraints.
[1] Kiper, A., 1984, “Impinging Water Jet Cooling of VLSI Circuits,” Int. Comm. Heat Transfer, 11, pp. 517-526.
[2] Wadsworth, D. C., and Mudawar, I., 1990, “Cooling of a Multichip Electronic Module by Means of Confined Two-Dimensional Jets of Dielectric Liquid,” ASME J. Heat Transfer, 112, pp. 891-898.
[3] Rowe, D. M., 1995, CRC Handbook of Thermoelectrics, CRC Press LLC, Boca Raton, FL.
[4] Ellison, G. N., 1984, Thermal Computations for Electronic Equipment, Van Nostrand Reinhold Co., New York.
[5] Martin, H., 1977, “Heat and Mass Transfer between Impinging Gas Jet and Solid Surface,” In Advances in Heat Transfer, vol. 13, ed. by Hartnett, J. P., and Irvine, Jr., T. F., Academic Press Inc., New York, pp. 1-60.
[6] Gardon, R., and Akfirat, J. C., 1965, "The Role of Turbulence in Determining the Heat Transfer Characteristics of Impinging Jets," Int. J. Heat Mass Transfer, 8, pp. 1261-1272.
[7] Sparrow, E. M., Baliga, B. R., Patankar, S. V., 1978, "Forced Convection Heat Transfer from a Shrouded Fin Array with and without Tip Clearance," ASME J. Heat Transfer, 100, pp. 572-579.
[8] Sparrow, E. M., and Kadle, D. S., 1986, “Effect of Tip-to-shroud Clearance on Turbulent Heat Transfer from a Shrouded, Longitudinal Fin Array,” ASME J. Heat Transfer, 108., pp. 519-524.
[9] Matsushima, H., Yanagida, T., and Kondo, Y., 1992, “Algorithm for Predicting the Thermal Resistance of Finned LSI Packages Mounted on a Circuit Board,” Heat Transfer Japanese Research, 21, pp. 504-517.
[10] Wirtz, R. A., Chen, W. M., and Zhou, R. H., 1994, “Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks,” ASME J. Electronic Packaging, 116, pp. 206-211.
[11] Kraus, A. D., and Bar-Cohen, A., 1995, Design and Analysis of Heat Sinks, John Wiley & Sons, Inc., New York.
[12] Teertstra, P., Yovanovich, M. M., Culham, J. R., and Lemczyk, T., 1999, “Analytical Forced Convection Modeling of Plate Fin Heat Sinks,” 15th IEEE SEMI-THERM Symposium, San Diego, CA, USA, March 9-11, pp. 34-41.
[13] Ishizuka, M., Yokono, Y., and Hisano, K., 1999, "Experimental Study on the Performance of Compact Heat Sink for LSI Packages," In Advances in Electronic Packaging, EEP-Vol. 26-1, ed. by Agonafer et. al., pp. 713-718.
[14] Jonsson, H., and Moshfegh, B., 2001, “Modeling of the Thermal and Hydraulic Performance of Plate Fin, Strip Fin, and Pin Fin Heat Sinks—Influence of Flow Bypass, ” IEEE Transactions on Components and Packaging Technologies, 24, pp. 142-149.
[15] Jeng, T. M., Wang, M. P., and Hung, Y. H., 2003, “ Performance Prediction for Partially-Confined Heat Sinks,” IPACK2003-35021, in Proceedings of IPACK 2003, ASME InterPACK’03, Maui, Hawaii, USA, July 6-11.
[16] Wang, M. P., Wu, T. Y., Horng, J. T., and Hung, Y. H., 2005, “Fluid Flow Characteristics for Partially-Confined Compact Plain-Plate-Fin Heat Sinks,” HT2005-72225, in Proceedings of HT2005, 2005 ASME Summer Heat Transfer Conference, San Francisco, CA, USA, July 17-22.
[17] Burmeister, L. C., 1983, Convective Heat Transfer, John Wiley & Sons, New York, pp. 312-319 and 384-393.
[18] Sparrow, E. M., and Wong, T. C., 1975, "Impingement Transfer Coefficients due to Initially Laminar Slot Jets," Int. J. Heat Mass Transfer, 18, pp. 597-605.
[19] Chou, Y. J., and Hung, Y. H., 1994, "Impingement Cooling of an Isothermally Heated Surface with a Confined Slot Jet," ASME Journal of Heat Transfer, 116, pp. 479-482.
[20] Lin, Z. H., Chou, Y. J., and Hung, Y. H., 1997, "Heat Transfer Behaviors of a Confined Slot Jet Impingement," Int. J. Heat Mass Transfer, 40, pp. 1095-1107.
[21] Liu, L. K., Fang, C. J., Wu, M. C., Peng, C. H., and Hung, Y. H., 2005, “Convective Heat Transfer from Confined Heated Surfaces with Slot Jet Impingement,” IPACK2005-73120, in Proceedings of IPACK 2005, ASME InterPACK’05, San Francisco, CA, USA, July 17-22.
[22] Sparrow, E. M., Stryker, P. C., and Altemani, A. C., 1985, "Heat Transfer and Pressure Drop in Flow Passages That Are Open along Their Lateral Edges," Int. J. Heat Mass Transfer, 28, pp. 731-740.
[23] Teuscher, K. L., Ramadhyani, S., and Incorpera, F. P., 1993, “Jet Impingement Cooling of an Array of Discrete Heat Sources with Externded Surfaces,” Enhanced Cooling Techniques for Electronics Applications, ASME/HTD-Vol. 263, pp. 1-10.
[24] Biber, C. R., 1997, “Pressure Drop and Heat Transfer in an Isothermal Channel with Impinging Flow,” IEEE Transc. on Comp., Packag., and Manu. Tech. –Part A, 20, pp. 458-462.
[25] Kondo, Y., and Matsuhima, H., 1996, “Study of Impingement Cooling of Heat Sinks for LSI Packages with Longitudinal fins,” Heat Transfer-Japanese Research, 25, pp. 537-553.
[26] Saini, M., and Webb, R. L., 2002, “Validation of Models for Air Cooled Plane Fin Heat Sinks used in Computer Cooling,” in Proceedings of ITHERM 2002, pp. 243-250, San Diego, CA, May 29-June 1.
[27] Duan, Z., and Muzychka, Y. S., 2004, “Impingement Air Cooled Plate Fin Heat Sinks Part II- Thermal Resistance Model,” in Proceedings of ITHERM 2004, pp.436-443, Las Vegas, USA, June 1-4.
[28] Liu, L. K., 2004, ”Fluid Flow and Heat Transfer from Heated Extended Surfaces with Confined Slot Jet Impingement,” Ph.D. Thesis, Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan, ROC.
[29] Ioffe, A. F., 1957, Semiconductor Thermoelements and Thermoelectric Cooling, Infosearch, London.
[30] Kraus, A. D., 1965, Cooling Electronic Equipment, Prentice-Hall, New York, NY.
[31] Simons R. E., 1967, “Thermal Conditioning System for an Optical Data Link,” IBM Technical Report No. 00.1628-1, Poughkeepsie, NY, USA..
[32] Chu, R. C., Seely, J. H., and Simons, R. E., 1968, “Design of a Modular Thermoelectric Cooling System for Special Circuit Packages,” in Proceedings of NEPCON Conference.
[33] Kraus, A. D., and Bar-Coen, A., 1983, Thermal Analysis and Control of Electronic Equipment, Hemisphere Publishing Corporation,Washington.
[34] Goldsmid, H. J., 1985, Electronic Refrigeration, Pion Limited, London.
[35] Buist, R. J., 1980, “Universal Thermoelectric Design Curves,” 15th Intersociety Energy Conversion Engineering Conference, Seattle, Washington, August 18-22.
[36] Simons, R. E., and Chu, R. C., 2000, “Application of Thermoelectric Cooling to Electronic Equipment: A Review and Analysis,” 16th IEEE SEMI-THERM Symposium, San Jose, CA, USA, March 21-23.
[37] Simons, R. E., Ellsworth, M. J., and Chu, R. C., 2003, “An Assessment of Module Cooling Enhancement with Thermoelectric Coolers,” IMECE2003-42239, in Proceedings of IMECE’03, Washington, D. C., Nov. 15-21.
[38] Solbrekken, G. L., Yazawa, K., and Bar-Cohen, A., 2003, “Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices,” IPACK2003-35305, in Proceedings of InterPack 2003, ASME InterPACK’03, , Maui, Hawaii, USA, July 6-11.
[39] Bierschenk, J., Johnson, D. 2004, “Extending the Limits of Air Cooling with Thermoelectrically Enhanced Heat Sink,” in Proceedings of ITHERM 2004, pp.679-684, Las Vegas, USA, June 1-4.
[40] Sauciuc, I., Erturk, H., Chrysler, G., Bala, V., and Mahajan, R., 2005, “Thermal Devices ntegrated with Thermoelectric Modules with Applications to CPU Cooling,” IPACK2005-73243, in Proceedings of IPACK 2005, ASME InterPACK’05, San Francisco, CA, USA, July 17-22.
[41] Sauciuc, I., Prasher, R., Chang, J. Y., Erturk, H., Chrysler, G., Chiu, C. P., and Mahajan, R., 2005, “Thermal Performance and Key Challenges for Future CPU Cooling Technologies,” IPACK2005-73242, in Proceedings of IPACK 2005, ASME InterPACK’05, San Francisco, CA, USA, July 17-22.
[42] Vanderplaats, G. N., 1993, Numerical Optimization Techniques for Engineering Design, McGraw-Hill, Singapore.
[43] Box, G. E. P., and Wilson, K. B., 1951, “On the Experimental Attainment of Optimum Conditions,” J. Royal Statistics Society, Series B, No. 13, pp. 1-45.
[44] Myers, G. N., and Montgomery, D. C., 2002, Response Surface Methodology, 2nd Ed., John Wiley & Sons, New York.
[45] Lee, S., 1995, “Optimum Design and Selection of Heat Sinks,” 11th Annual IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, California, Feb. 7-9, pp. 48-54.
[46] Huang, B. J., Chin C. J. and Duang, C. L., 2000, “A Design Method of Thermoelectric Cooler,” International Journal of Refrigeration, 23, pp. 208-218.
[47] Xuan, X. C., 2002, “Optimum Design of a Thermoelectric Device,” Semicond. Sci, Technol., 17, pp. 114-119.
[48] Taylor, R. A., and Solbrekken, G. L., 2005, “An Improved Optimization Approach for Thermoelectric Refrigeration Applied to Portable Electronic Equipment,” IPACK2005-73190, in Proceedings of IPACK2005, ASME InterPACK’05, San Francisco, CA, USA, July 17-22.
[49] Chen H. T., Horng, J. T., Chen, P. L., and Hung, Y. H., 2004, “Optimal Design for PPF Heat Sinks in Electronics Cooling Applications,” ASME Journal of Electronic Packaging, 126, pp. 410-422.
[50] Chen, H. T., Chen, P. L., Horng, J. T., and Hung, Y. H., 2005, “Design Optimization for Pin-Fin Heat Sinks,” ASME Journal of Electronic Packaging, 127, pp. 397-406.
[51] Hung, Y. H., and Perng, S. W., 1988, “An Experimental Technique for Measuring Transient Natural/Forced-Convective Heat Fluxes in a Vertical Channel,” Exp. Therm. Fluid Sci., 1, pp. 305-313.
[52] Hung, Y. H., and Shiau, W. M., 1989, “An Effective Model for Measuring Transient Natural Convection Heat Flux in Vertical Parallel Plates with a Rectangular Rib,” Int. J. Heat Mass Transfer, 32, pp. 863-871.
[53] Lin, H. H., and Hung, Y. H., 1993, “Transient Forced Convection Heat Transfer in a Vertical Rib-Heated Channel Using a Turbulence Promoter,” Int. J. Heat Mass Transfer, 36, pp. 1553-1571.
[54] Kline, S. J., and McClintock, F. A., 1953, “Describing Uncertainties in Single-Sample Experiments,” Mechanical Engineering, 75, pp. 3-8.
[55] Moffat, R. J., 1988, “Describing the Uncertainties in Experimental Results,” Expl. Thermal Fluid Sci., 1, pp. 3-17.
[56] Monthomery, D. C., 2001, Design and Analysis of Experiments, 5th Ed., John Wiley & Sons, New York.
[57] Box, G. E. P., and Draper, N. R., 1987, Empirical Model-Building and Response Surfaces, John Wiley & Sons, New York.
[58] Abramzon, B., 2005, “Numerical Optimization of the Thermoelectric Cooling Devices,” HT2005-72686, in Proceedings of HT2005, 2005 ASME Summer Heat Transfer Conference, San Francisco, CA, USA, July 17-22.