應用六標準差設計架構開發新設備-以測試機散熱模組為例

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研究生：	江登鑫 Chiang, Tang-Hsin
論文名稱：	應用六標準差設計架構開發新設備-以測試機散熱模組為例 Apply Six Sigma Framework to Develop New Equipment – A Case Study of Cooling Module Design Test Machine
指導教授：	邱銘傳 Chiu, Ming-Chuan
口試委員:	李雨青 Lee, Yu-Ching 徐昕煒 Hsu, Hsin-Wei
學位類別：	碩士 Master
系所名稱：	工學院 - 工業工程與工程管理學系碩士在職專班 Industrial Engineering and Engineering Management
論文出版年：	2020
畢業學年度：	108
語文別：	中文
論文頁數：	67
中文關鍵詞：	測試機、六標準差設計、田口實驗、架構開發
外文關鍵詞：	Tester, Design For Six Sigma, Taguchi experiment, Equipment Design
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測試機為半導體測試行業的測試通用設備，其占測試設備總市場空間份額約近70%，隨著中國大陸多家晶圓廠陸續投產及量產，國內封測廠將陸續投入新產線以實現產能的配套擴張，將帶動國內半導體測試設備行業高速增長，自主研發和併購將成為國內測試設備企業的必經之路。
隨著積體電路奈米製程的發展及電子科技的飛速進步，高效能儀器與裝置不斷推陳出新，內部元件單位體積所發出熱量越來越多，將造成運作過程中產生不穩定的現象，甚至縮短設備壽命，因此，為了維持元件設備正常工作狀態，採用熱交換的散熱動作，以帶走多餘熱量是絕對必要的。
本研究利用六標準差設計驗證架構，並運用品質機能展開、魚骨圖、因果矩陣圖、創新思維手法、田口實驗及軟體模擬探討，進行產品開發，有效的縮短開發時間，以低成本改善了「測試機高溫飈升」的技術瓶頸與障礙的排除，達到架構最佳散熱之設計。

Tester is one of key equipment in semiconductor testing industry, which accounts for nearly 70% of the total market share of testing equipment. With the ramp up and mass production of several wafer factories in mainland China, the domestic sealing and testing factories successively invest in new production lines to support expansion of production capacity, which will drive the rapid growth of domestic semi conductor testing equipment industry.
With the development of integrated circuit nano fabrication process and the rapid progress of electronic technology, high-efficiency instruments and devices are constantly innovating. More and more heat is emitted by the unit volume of internal components, which will cause instability in the operation process and even shorten the service life of the equipment. Therefore, in order to maintain the normal working state of the components and equipment, heat exchange heat dissipation action is adopted to take away more residual heat is absolutely necessary.
In this study, six sigma design is applied to verify the architecture, and quality function deployment, fishbone diagram, cause and effect matrix diagram, innovative thinking method, Taguchi experiment and software simulation are utilized to conduct product development, which can effectively shorten the development time, improve the technical bottleneck and obstacle removal of "high temperature rise of testing machine" with low cost, As a result, it achieves the best heat dissipation design of the equipment.

摘要.............................................................I
ABSTRACT........................................................II
誌謝............................................................III
目錄.............................................................IV
圖目錄...........................................................VI
表目錄.........................................................VIII
第一章 緒論.......................................................1
1.1 研究背景......................................................1
1.2 研究動機......................................................2
1.3 研究目的......................................................3
1-4 論文架構......................................................3
第二章 文獻回顧探討................................................5
2-1 六標準差設計(Design for Six Sigma, DFSS)......................5
2-2 品質機能展開(Quality function Deployment, QFD)................7
2-3 因子實驗設計..................................................8
2-3-1 殘差分析(Residual Analysis)................................10
2-3-2 變異數分析(Analysis of Variance, ANOVA)....................10
2-4 田口方法(Taguchi Methods)....................................11
2-4-1 直交表(Orthogonal Array)及信號雜音比(Signal to Noise Ratio)......................................................... 14
第三章 研究方法...................................................16
3-1 定義.........................................................17
3-1-1 品質機能展開...............................................17
3-2 衡量.........................................................18
3-2-1魚骨圖......................................................18
3-2-2 因果矩陣圖.................................................20
3-3 分析.........................................................21
3-3-1 因子設計...................................................21
3-3-2 残差分析(Residual analysis)................................22
3-3-3 變異數分析(Analysis of variance, ANOVA)....................22
3-4 設計.........................................................24
3-4-1 實驗流程...................................................24
3-4-2 田口直交表.................................................25
3-4-3 田口品質工程─參數設計.......................................28
3-4-4 訊號與雜訊比(Signal to Noise Ratio, S/N)...................29
3-4-5 頭腦風暴法(Brain Storming, BS).............................32
3-5 驗證.........................................................32
3-5-1 模擬分析(Simulation).......................................32
第四章 個案分析...................................................34
4-1 個案公司背景.................................................34
4-2 半導體測試流程及架構..........................................35
4-2-1 測試機架構.................................................36
4-3 現況問題描述.................................................38
4-3-1 問題探討...................................................39
4-4 實驗結果與分析................................................39
4-5 定義-目標需求................................................39
4-5-1 品質機能展開...............................................40
4-6 衡量-重要因素................................................41
4-6-1 魚骨圖.....................................................41
4-6-2 因果矩陣圖.................................................41
4-7 分析-要因分析................................................43
4-7-1 因子設計(FD).............................................43
4-8 Design-設計-產品設計.........................................49
4-8-1 S/N比分析及最佳參數組合.....................................49
4-8-2 頭腦風暴(腦力激盪)..........................................51
4-9 Verify-實證-效果確認.........................................54
4-10 效益及製程標準化.............................................57
第五章 結論與建議.................................................60
5-1 結論.........................................................60
5-2 研究限制.....................................................60
5-3 未來研究方向.................................................61
參考文獻.........................................................62


                                

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網路資源
1. 個案公司網頁，(http://www.kyec.com.tw/Default.aspx)
2. 半導體積體電路測試概論，白安鵬，(http://ictesting-tom.blogspot.com/2008/10/blog-post_02.html )
3. DOE實驗設計原理與應用，(https://kknews.cc/zh-tw/news/2brjvoy.html)
4. 信甫科技網頁(6SigmaET 電子散熱分析軟體)，(http://www.sheaf.com.tw/)
5. 信灣電機企業股份有限公司，(http://www.sinwan.com.tw/sinwan_web/main/tw/index.asp)
6. 世界半導體貿易統計協會(WSTS)，(https://www.wsts.org/)

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