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研究生： 洪端佑
HUNG, TUAN-YU
論文名稱： 電力模組功率循環測試之結構可靠度分析與評估
Analysis and Assessment of the Reliability Life of Power Module Structure under Power Cycling Test
指導教授： 江國寧
口試委員: 江國寧
蔡宏營
劉德騏
趙儒民
李昌駿
學位類別： 博士
Doctor
系所名稱： 工學院 - 動力機械工程學系
Department of Power Mechanical Engineering
論文出版年： 2013
畢業學年度： 101
語文別： 英文
論文頁數： 76
中文關鍵詞： 電力模組 、功率循環測試 、導線脫離 、有限單元分析 、壽命預估模型 、高週疲勞 、低週疲勞 、潛變 、焊錫 、熱循環測試 、裂紋成長
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    • 逐漸短缺的資源與全球性對電力能源需求增加，促使人們必須更有效與環保的使用能源。電力模組是功率管理系統中的關鍵結構並廣泛應用於功率供應器、自動化控制、交通運輸、馬達控制、大樓電源控制以及再生能源。
    在功率循環測試中，鋁導線與晶片間熱膨脹係數的不匹配可導致導線因疲勞破壞而脫離。本研究著眼於發展鋁導線可靠度評估方法。根據實際測試樣品建立三維有限單元模型，執行電熱耦合與熱固有限單元分析並分析鋁導線在循環功率下的力學行為。增加鋁線數目可改善電流聚集現象，減少鋁線周圍電流聚集現象所產生的焦耳熱可降低接面溫度。此結果暗示藉由打線設計，電力模組將被操作在更高功率上，同時提供相同等級的可靠度。模擬所得的預估溫度符合實驗結果。當模組承受低電流負載時無法觀察到等效塑性應變，然而，等效塑性應變與彈性應變/等效塑性應變總和的比例將隨著電流負載提升而上升。若模組承受高電流負載則必須考慮降伏效應，塑性應變甚至統御破壞機制。高週疲勞與低週疲勞理論應分別被包含在低電流負載與高電流負載的壽命預估模型。模擬結果與實驗進行驗證後，兩模型即可被提出並應用於電力模組設計。
    由於具高對應溫度，潛變為焊錫主要的失效模式之一，尤其對於高電力模組。為了了解溫度曲線與電力模組可靠度的關係，將模組進行-40 °C/ 125 °C加速熱循環測試與分析、週期分別為66分鐘與30分鐘，在數個循環次數下量測焊錫裂紋長度。此外，為了確定初始裂紋壽命，將各循環次數下的平均裂紋長度進行外插。結果指出焊錫高度差異性明顯影響裂紋成長情形。有鑑於此，本研究聚焦焊錫高度介於150 ~ 300 μm範圍內以及焊錫高度超過300 μm，藉此將焊錫高度差異性的影響控制在最低的情況。結果指出焊錫高度介於150 ~ 300 μm範圍內其初始裂紋壽命與裂紋成長速率分別為73 cycles與 0.0068 mm/cycle的裂紋成長率(30分鐘循環週期)，焊錫高度超過300 μm則無裂紋產生。降低升降溫速率將導致更明顯的應力釋放現象，造成更多的不可回復潛變；較長的持溫時間將促進潛變行為。根據上述物理現象，置於較長循環週期的電力模組將得到較差的疲勞壽命。

    ACKNOWLEDGMENTS I ABSTRACT (CHINESE) III ABSTRACT V TABLE OF CONTENTS VII LIST OF TABLES IX LIST OF FIGURES X CHAPTER I INTRODUCTION 1 1.1 Motivation 1 1.2 Literature survey 4 1.2.1 Review of power cycling test and related numerical analysis 5 1.2.2 Review of temperature profile effect on the solder reliability 8 1.3 Research goal 9 CHAPTER II FUNDAMENTAL THEORY 11 2.1 Viscoelastic 11 2.1.1 Creep and recovery 12 2.1.2 Relaxation 14 2.2 Numerical method and Convergence Criteria 15 2.3 Fatigue model of metal 17 2.3.1 An overview of fatigue behavior 17 2.3.2 Cumulative damage and life exhaustion 22 CHAPTER III EXPERIMENTAL INVESTIGATION OF POWER CYCLING TEST 25 3.1 IEC Standard for Power Cycling Test 25 3.2 Structure and technical information of test sample 27 3.3 Power cycling test equipment setup 30 3.3.1 Main structure of power cycling test equipment 30 3.3.2 Temperature monitoring system 31 3.3.3 Experiment procedures 32 3.4 Analysis of experimental results 32 3.4.1 Analysis of temperature monitoring of chip 33 3.4.2 Failure criteria and mean cycles to failure 35 CHAPTER IV NUMERICAL ANALYSIS OF POWER CYCLING TEST 37 4.1 Electro-thermal finite element analysis and experimental validation 37 4.1.1 Simplified finite element model of power module 37 4.1.2 Equivalent heat transfer coefficient calculation 40 4.1.3 Numerical analysis and experimental validation 44 4.1.4 Wire configuration effect analysis 47 4.2 Reliability assessment of bonding Wire 48 4.2.1 Thermal-mechanical finite element analysis 49 4.2.2 Life prediction model establishing 53 CHAPTER V TEMPERATURE PROFILE EFFECT ON SOLDER CRACK BEHAVIOR 56 5.1 Solder height observation 56 5.2 Crack length measurement 58 5.3 Determining the initial crack life 63 CHAPTER VI CONCLUSION AND RECOMMENDATIONS 67 6.1 Conclusions 67 6.2 Recommendations and future works 69 REFERENCES 71

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