簡易檢索 / 詳目顯示

研究生: 蘇威憲
Su, Wei-Hsien
論文名稱: 原子層化學氣相沉積HfO2高介電薄膜應用於電荷能陷儲存元件之特性研究及鑲嵌金奈米晶粒於元件特性之影響
Atomic Layer Deposition of HfO2 Thin Film as Charge Trapping Layer and the Effects of Au Nanocrystals Embedded for Nonvolatile Memory Application
指導教授: 吳泰伯
Wu, Tai-Bor
口試委員:
學位類別: 碩士
Master
系所名稱: 工學院 - 材料科學工程學系
Materials Science and Engineering
論文出版年: 2010
畢業學年度: 98
語文別: 英文
論文頁數: 82
中文關鍵詞: 原子層氣相成績電荷能陷儲存元件
相關次數: 點閱:2下載:0
分享至:
查詢本校圖書館目錄 查詢臺灣博碩士論文知識加值系統 勘誤回報
  • Non-volatile semiconductor memories have attracted much attention due to the fast growing demand of portable electronic devices. In this thesis, the atomic layer deposition prepared HfO2 thin film was fabricated with TEMAH as precursor and O2 plasma as oxidant. A 7-nm thick HfO2 thin film was applied as the charge trapping layer. The significant hysteresis loops found in C-V relation indicated the exellent charge storage effect. In additon, the erase and retention characteristics were investigated and the results were satisfactory for nonvolatile memory application.
    Moreover, the Au nanocrystals were embedded in HfO2 at different locations. The effect on the device was investigated. It is found that the Au nanocrystals have an influence on the device characteristics due to the field enhancement effect.


    Chapter 1 Introduction 1 1.1 Introduction 1 1.2 Research motivation 4 1.3 Thesis organization 5 Chapter 2 Literature Review 6 2.1 Introduction to semiconductor memory 6 2.2 Flash memory 9 2.2.1 Basic concept 9 2.3 Emerging nonvolatile memory 15 2.3.1 FeRAM 16 2.3.2 MRAM 18 2.3.3 PCRAM 20 2.3.4 RRAM 22 2.3.5 SONOS 24 2.3.6 SOHOS 25 2.3.7 Nanocrystal memory 26 2.4 SONOS-type memory 27 2.4.1 Operation(program/erase) mechanism 27 2.4.2 Memory characteristics of SONOS-type memory 32 2.4.3 high-k oxide as blocking oxide for SONOS-type memory application 35 Chapter 3 Methods and Experiment 36 3.1 Experimental details and procedures 36 3.1.1 Substrate RCA clean 38 3.1.2 Back-side ion implantation 38 3.1.3Thermal oxidation of tunnel oxide (SiO2) 39 3.1.4 Deposition of HfO2 layer by ALD 39 3.1.5 Au Thin Film Deposition 41 3.1.6 Deposition of blocking oxide 42 3.1.7 Rapid thermal annealing process 44 3.1.8 Metallization 45 3.2 Analysis and Measurement 47 3.2.1 C-V measurement 47 3.2.2 Erase Curve 47 3.2.3Retention Measurement 47 Chpater 4 HfO2 as Charge Trap Layer 49 4.1 Introduction 49 4.2 Results and discussion 51 4.2.1 The charging effect in MLHOS capacitor 51 4.2.2 Erase characteristics of MLHOS capacitor 57 4.2.3Charge retention characteristics in MLHOS capacitor 58 Chapter 5 Au nanocrystal’s Field enhancement effect on HfO2 as charge trapping layer 60 5.1Introduction 60 5.2 The effects of embedded Au nanocrystals on the charging effect 61 5.3 The effects of embedded Au nanocrystals on the erase characteristics 68 5.4 The effects of embedded Au nanocrystals on retention characteristics. 71 5.5 Conclusion 75

    1.Roberto Bez, Emilio Camerlenghi, Alberto Modellli, and
    Angelo Visconti “Introduction to Flash Memory”
    Proceedings of The IEEE, Vol.91, No.4, April 2003.

    2. Paolo Pavan, Roberto Bez, Piero Olivo, and Enrico
    Zanoni “Flash memory cells – An overview”
    Proceeding of The IEEE, Vol.85, No.8 August 1997.

    3.Kinam Kim et al., 2005 VSLI-TSA pp. 88-94(2005)

    4. “Samsung unwraps 40nm "charge trap flash
    device”
    http://www.electroiq.com/index.html

    5. ITRS 2003 edition,
    http://www.itrs.net/Links/2003ITRS/Home2003.htm

    6. Sheng-Chih Lai, Hang-Ting Lue, Ming-Jui Yang, Ming-Jui
    Yang, Jung-Yu Hsieh,Szu-Yu Wang, Tai-Bor Wu, Guang-Li
    Luo, Chao-Hsin Chien, Erh-Kun Lai, Kuang-Yeu Hsieh,
    Rich Liu and Chih-Yuan Lu,” BE-SONOS: A Bandgap
    Engineered SONOS using Metal Gate and Al2O3 Blocking
    Layer to Overcome Erase Saturation, 2007 22nd Non-
    Volatile Semiconductor Memory Workshop, pp. 26-30, 2007

    7. Roberto Bez, Emilio Camerlenghi, Alberto Modellli and
    Angel Visconti, “Introduction to Flash Memory,
    Proceedings of the IEEE, Vol. 91, No. 4, April 2003.

    8. Yeargain, J. and Kuo, K. (1981) A high density floating
    gate EEPROM cell. IEEE
    IEDM Technical Digest. 24.

    9. M. Lenzlinger, E. H. Snow, “Fowler-Nordheim
    tunneling in thermal grown SiO2”, J. Appl. Phs. 40,
    278 (1969).

    10. Guterman, D., Rimawi, I., Chiu, T., Halvorson, R., and
    McElroy, D. (1979) “An electrically alterable
    nonvolatile memory cell using a floating gate
    structure”. IEEE Transactions on Electron Devices. ED-
    26, 576.

    11.” Emerging Non-Volatile Memory Technologies”: Infineon
    Technologies, MP TD NMP, PO Box 80949, 81541 Munich,
    Germany :Infineon Technologies, Japan

    12. M. Lines and A. Glass, “Principles and applications of
    ferroelectrics and related devices”, Clarendon Press,
    Oxford, 87(1977)

    13. W. J. Gallagher, S. Parkin, Yu Lu, X. P. Bian, A.
    Marley, K. P. Roche, R. A. Altman, S.A. Rishton, C.
    Jahnes, T. M. Shaw, and Gang Xiao, “Microstructured
    magnetic tunnel junctions” J. Appl. Phys. 81, 3741
    (1997).Cc

    14. S. Parkin, K. P. Roche, M. G. Samant, P. M. Rice, R. B.
    Beyers, R. E. Scheuerlein, E. J. O’Sullivan, S. L.
    Brown, J. Bucchigano, D. W. Abraham, Yu Lu, M. Rooks,P.
    L. Trouilloud, R. A. Wanner, and W. J. Gallagher,
    “Exchange-biased magnetic tunnel junctions and
    application to nonvolatile Magneti c random
    access memory”, J. Appl. Phys. 85, 5828(1999)Cc

    15. S. R. Ovskinsky, “Reversible Electrical Switching
    Phenomena in Disordered Structures”, Phys. Rev. Lett.
    21, 1450(1968)

    16. S.Seo, M.J. Lee, D.H. Seo, S.K. Choi, D.S. Suh, Y.S.
    Joung, and I.K. Yoo. I.S. Byun, I.R. Hwang, S.H. Kim,
    and B.H. Park “Conductivity switching
    characteristics and reset currents in NiO films”.
    Appl. Phys. Lett. 86, 093509 (2005)

    17. Genrikh B. Stefanovich, Choong-Rae Cho, Eun-Hong Lee,
    Inkyenong Yoo “Nonvolatile resistance switching in
    amorphous In-Zn-O films”. Journal of Non-crystalline
    Solids 353 (2007) 956-958

    18. S. R. Ovskinsky, “Reversible Electrical Switching
    Phenomena in Disordered Structures”, Phys. Rev. Lett.
    21, 1450(1968)

    19. M. J. Rozenberg, I. H. Inoue, and M. J. Sanchez,
    “Nonvolatile memory with multilevel switching: a basic
    model”, Phys. Rev. Lett. 92, 178302(2004).

    20. 王嗣裕, “Reliability and Processing Effects of
    Bandgap Engineered SONOS (BE-SONOS) Flash Memory
    Devices, 清華大學, 博士論文, 2008.

    21. Marvin H. White, Dennis A. Adams, and Jiakang B “On
    The Go with SONOS”. IEEE July 2000

    22. Hirotaka Hamamura, Takeshi Ishida, Toshiyuki Mine,
    Yutaka Okuyama, Digh Hisamoto, Yasuhiro Shimamoto,
    Shin’ichiro Kimura and Kazuyoshi Torii “Electron
    trapping characteristics and scalability of HfO2 as a
    trapping layer in sonos-type flash memories.” IEEE
    CFP08RPS-CDR 46th Annual International Reliability
    Physics Symposium, Phoenix, 2008

    23. Hee-Wook You and Won-Ju Cho “Charge trapping
    properties of the HfO2 layer with various thickness for
    charge trap flash memory applications”, Appl. Phys.
    Lett. 96, 093506 2010

    24. S. Tiwari, F. Rana, K. Chan, H. Hanafi W. Chan, and D.
    Buchanan, “Volatile and Non-Volatile Memories in
    Silicon with Nano-Crystal Storage”, IEDM Tech. Dig.,
    521(1995).

    25 S. Tiwari, F. Rana, H. Hanafi, A. Hartstein, E. F.
    Crabbe, and K. Chan, “A silicon nanocrystals based
    memory”, Appl. Phys. Lett. 68, 1377(1996).

    26. M. Lenzlinger, E. H. Snow, “Fowler-Nordheim tunneling
    in thermally grown SiO2”, J. Appl. Phys. 40, 278(1969).

    27. L. L. Chang, P. J. Stiles, and L. Esaki, “Electron
    tunneling between a metal and a semiconductor:
    characteristics of Al-Al2O3-SnTe and –GeTe junctions”,
    J. Appl. Phys. 38, 4440(1967).

    28. K. F. Schuegraf, C. C. King, and C. Hu, “Ultra-thin
    dioxide leakage current and scaling limit”, Symp. VLSI
    Tech. Dig., IEEE, 18(1992).

    29 T. Tuomi, M. Tuominen, E. Prieur, J. Lahtinen, and
    Laakkonen, “Synchrotron section topographic study of
    czochralski-grown silicon wafers for advanced memory
    circuits”, J. Electronchem. Soc. 142, 1699(1995)

    30. D. N. Kouvatsos, V. L. Sougleridis, and A. G.
    Nassiopoulou, “Charging effects in silicon nanocrystals
    within SiO2 layers, fabricated by chemical vapor
    deposition, oxidation, and annealing ”, Appl. Phys.
    Lett., 82, 397(2003).

    31. L. W. Teo, W. K. Choi, W. K. Chim, V. Ho, C. M. Moey,
    M. S. Tay, C. L. Heng, Y. Lei, D. A. Antoniadis, and E.
    A. Fitzgerald, “Size control and charge storage
    mechanism of germanium nanocrystals in a metal-
    insulator-semiconductor structure”, Appl. Phys. Lett.
    81, 3639(2002).

    32. Y. Shi, K. Saito, H. Ishikuro, and T. Hiramoto,
    “Effects of interface traps on charge retention
    characteristics in silicon-quantum-dot-based metal-oxide-
    semiconductor diodes”, J. J. Appl. Phys. 38, 425(1999)

    33.Y. Shi, K. Saito, H. Ishikuro, and T. Hiramoto,
    “Effects of traps on charge storage characteristics in
    metal-oxide-semiconductor memory structures based on
    silicon nanocrystals”, J. Appl. Phys. 84, 2358(1998).

    34. G. Crisenza, C. Clementi, G. Ghidini, and M. Tosi,
    “Floating gate memories reliability”, Quality and
    Reliability International, 8, 177(1992).

    35. J. Chen, T. Y .Chan, I. C. Chen, P. K. Ko, and C. Hu
    “Subbreakdown drain Leakage current in MOSFET” IEEE
    Electron Device Lett., vol. EDL-8, pp. 515-517. Nov.
    1987.Cc

    36. G. Verma, and N. Mielke, “Relability performance of
    ETOX based Flash memories,” in Proc. IEEE IRPS 1988,
    pp. 158-166

    37. S. Haddad, C. Chang, B. Swaminathan, and J. Lien,
    “Degradation due to hole trapping in flash memory
    cells,” IEEE Electron Device Lett., vol. 10, pp. 117-
    119, Mar. 1989.

    38. Jong Jin Lee, Xuguang Wang, Weiping Bai, Nan Lu, and
    Dim-Lee Kwong “Theoretical and Experimental
    Investigation of Si Nanocrystal Memory Device With HfO2
    High- Tunneling Dielectric”. IEEE Transactions on
    Electron Devices, Vol. 50, No.10, October 2003.

    39.Chen-Chan Wang, Yan-Kai Chiou, Che-Hao Chang, Jiun-Yi
    Tseng, Lin-Jung Wu, Chun-Yu Chen and Tai-Bor Wu “Memory
    characteristics of Au nanocrystal embedded in metal-
    oxide-semiconductor structure by using atomic-layer-
    deposited Al2O3 as control oxide” J.Phys. D: Appl.
    Phys. 40 (2007) 1673-1677

    40. Roberto Bez , Agostino Pirovano “Non-volatile memory
    technologies: emerging concepts andnew materials” ,
    Materials Science in Semiconductor Processing 7 (2004)
    349–355

    41. Hirotaka Hamamura, Takeshi Ishida, Toshiyuki Mine,
    Yutaka Okuyama, Digh Hisamoto, Yasuhiro Shimamoto,
    Shin’ichiro Kimura and Kazuyoshi Torii “Electron
    trapping characteristics and scalability of HfO2 as a
    trapping layer in SONOS-type flash memories” IEEE
    46th Annual International Reliability Physics
    Symposium, Phoenix, 2008

    42. Cheng-Wei Cheng, Yuan-Chieh Tseng, Tai-Bor Wu, Li-Jen
    Chou “Enhanced polarization switching characteristics
    of Pb(Zr0.5Ti0.5)O3–Pt nanocomposite thin films” J.
    Mater. Res., 19, 1043 (2004).

    43. K. N. Tu, J. W. Mayer, and L. C. Feldman, “Electronic
    thin film science”, NewYork: Macmillan, (1992).

    44. Yun-Shan Lo, Ke-Chih Liu, Cheng-Wei Cheng, Jyun-Yi Wu,
    Cheng-Hao Hou, and Tai-Bor Wu “Field enhancement
    effect of nanocrystals in bandgap engineering of tunnel
    oxide for nonvolatile memory application” Appl. Phys.
    Lett.94, 082901 2009

    無法下載圖示 全文公開日期 本全文未授權公開 (校內網路)
    全文公開日期 本全文未授權公開 (校外網路)

    QR CODE